Stress released image sensor package structure and method

• US 9,543,347 B2
• Filed: 02/05/2016
• Issued: 01/10/2017
• Est. Priority Date: 02/24/2015
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Primary Examiner(s): PHAM, THANHHA S
• Application Number:
  US15/017,506
• Publication Number:
  US 20160247849A1
• Time in Patent Office: 340 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/14698 Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation

Abstract

A sensor package that includes a substrate with opposing first and second surfaces. A plurality of photo detectors are formed on or under the first surface and configured to generate one or more signals in response to light incident on the first surface. A plurality of contact pads are formed at the first surface and are electrically coupled to the plurality of photo detectors. A plurality of holes are each formed into the second surface and extending through the substrate to one of the contact pads. Conductive leads each extend from one of the contact pads, through one of the plurality of holes, and along the second surface. The conductive leads are insulated from the substrate. One or more trenches are formed into a periphery portion of the substrate each extending from the second surface to the first surface. Insulation material covers sidewalls of the one or more trenches.

Claims

1. A sensor package, comprising:

a first substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or under the first surface of the first substrate and configured to generate one or more signals in response to light incident on the first surface of the first substrate,

a plurality of contact pads formed at the first surface of the first substrate and which are electrically coupled to the plurality of photo detectors,

a plurality of holes each formed into the second surface of the first substrate and extending through the first substrate to one of the contact pads, and

conductive leads each extending from one of the contact pads, through one of the plurality of holes, and along the second surface of the first substrate, wherein the conductive leads are insulated from the first substrate;

one or more trenches formed into a periphery portion of the first substrate each extending from the second surface to the first surface; and

insulation material covering sidewalls of the one or more trenches.

2. The sensor package of claim 1, further comprising:

a dam structure formed on the first surface of the first substrate and around but not over the plurality of photo detectors;

a second substrate disposed on the dam structure and extending over the plurality of photo detectors, wherein the dam structure and the second substrate form a sealed cavity over the plurality of photo detectors.

3. The sensor package of claim 1, further comprising:

a second substrate disposed on the first surface and extending over the plurality of photo detectors, wherein a cavity formed into a surface of the second substrate is positioned over and seals the plurality of photo detectors.

4. The sensor package of claim 1, further comprising:

a plurality of electrical connectors each electrically connected to one of the conductive leads.

5. The sensor package of claim 4, further comprising:

a layer of insulation material disposed over the second surface of the first substrate and covering the conductive leads except for contact pad portions thereof which are in electrical contact with the plurality of electrical connectors.

6. The sensor package of claim 1, further comprising:

a layer of insulation material between each of the conductive leads and the first substrate.

7. The sensor package of claim 1, wherein each of the plurality of holes has a funnel shaped cross section.

8. The sensor package of claim 1, wherein the sidewalls of the one or more trenches include a shoulder formed therein.