Corner layout for high voltage semiconductor devices
First Claim
1. A semiconductor device comprising:
- a doped layer;
an active cell region having a plurality of active cell device structures having a first end and a second end formed in the doped layer and arranged in striped cell arrays; and
a termination region having a plurality of termination device structures formed in the doped layer surrounding the active cell region, wherein the termination device structures include one or more concentric ring arrays, wherein an innermost ring array of termination device structures has a plurality of spurs extending inward toward the active cell region and wherein a distance between each of the spurs and a nearby striped cell is configured to maximize the breakdown voltage of the device;
wherein a first subset of the striped cells are configured to maximize a breakdown voltage of the semiconductor device by having the ends of each striped cell in the first subset spaced a uniform distance from a nearest termination device structure; and
wherein a second subset of the striped cells proximate to a corner region of the active cell region are configured to maximize the breakdown voltage by spacing the ends of each striped cell in the second subset a non-uniform distance from the nearest termination device structure; and
wherein the second subset of striped cells include arcuate end portions; and
wherein the arcuate end portions are in the shape of concentric quarter circles.
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Abstract
A corner layout for a semiconductor device that maximizes the breakdown voltage is disclosed. The device includes first and second subsets of the striped cell arrays. The ends of each striped cell in the first array is spaced a uniform distance from the nearest termination device structure. In the second subset, the ends of striped cells proximate a corner of the active cell region are configured to maximize breakdown voltage by spacing the ends of each striped cell a non-uniform distance from the nearest termination device structure. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
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Citations
8 Claims
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1. A semiconductor device comprising:
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a doped layer; an active cell region having a plurality of active cell device structures having a first end and a second end formed in the doped layer and arranged in striped cell arrays; and a termination region having a plurality of termination device structures formed in the doped layer surrounding the active cell region, wherein the termination device structures include one or more concentric ring arrays, wherein an innermost ring array of termination device structures has a plurality of spurs extending inward toward the active cell region and wherein a distance between each of the spurs and a nearby striped cell is configured to maximize the breakdown voltage of the device; wherein a first subset of the striped cells are configured to maximize a breakdown voltage of the semiconductor device by having the ends of each striped cell in the first subset spaced a uniform distance from a nearest termination device structure; and wherein a second subset of the striped cells proximate to a corner region of the active cell region are configured to maximize the breakdown voltage by spacing the ends of each striped cell in the second subset a non-uniform distance from the nearest termination device structure; and wherein the second subset of striped cells include arcuate end portions; and wherein the arcuate end portions are in the shape of concentric quarter circles. - View Dependent Claims (2, 3, 4)
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5. A method of forming a semiconductor device, comprising:
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forming a doped layer; forming an active cell region having a plurality of active cell device structures having a first end and a second end formed in the doped layer and arranged as striped cells; and forming a termination region having a plurality of termination device structures formed in the doped layer surrounding the active cell region, wherein the termination device structures include one or more termination concentric ring arrays, wherein an innermost ring array of termination device structures has a plurality of spurs extending inward toward the active cell region, wherein a distance between each of the spurs and a nearby striped cell is configured to maximize the breakdown voltage of the device; wherein a first subset of the striped cells are configured to maximize a breakdown voltage of the semiconductor device by having the ends of each striped cell array spaced a uniform distance from a nearest termination device structure; and wherein a second subset of the striped cells proximate to a corner region of the active cell region are configured to maximize the breakdown voltage by spacing the ends of each striped cell array in the second subset a non-uniform distance from the nearest termination device structure; and wherein the second subset of striped cells include arcuate end portions; and wherein the arcuate end portions are in the shape of concentric quarter circles. - View Dependent Claims (6, 7, 8)
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Specification