Adhesive tape for encapsulating an organic electronic arrangement

• US 9,543,549 B2
• Filed: 05/27/2013
• Issued: 01/10/2017
• Est. Priority Date: 06/29/2012
• Status: Active Grant

• Current Assignee: Tesa SE (Maxingvest AG)
• Original Assignee: Tesa SE (Maxingvest AG)
• Inventors: Bai, Minyoung, Ellinger, Jan, Grnauer, Judith, Keite-Telgenbscher, Klaus, Petersen, Anika
• Primary Examiner(s): Payen, Marvin
• Application Number:
  US14/411,585
• Publication Number:
  US 20150162568A1
• Time in Patent Office: 1,324 Days
• US Class Current: 1/1
• CPC Class Codes: C09J 11/04 inorganic
• CPC Class Codes: C09J 153/005 Modified block copolymers
• CPC Class Codes: C09J 153/02 Vinyl aromatic monomers and conjugated dienes
• CPC Class Codes: C09J 157/02 Copolymers of mineral oil hydrocarbons
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: C09J 177/06 Polyamides derived from polyamines and polycarboxylic acids C09J177/10 takes precedence
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2301/302 the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2400/22 Presence of unspecified polymer
• CPC Class Codes: C09J 2453/00 Presence of block copolymer
• CPC Class Codes: C09J 2463/00 Presence of epoxy resin
• CPC Class Codes: C09J 2477/00 Presence of polyamide
• CPC Class Codes: C09J 7/10 without carriers
• CPC Class Codes: C09J 7/20 characterised by their carriers
• CPC Class Codes: C09J 7/35 Heat-activated
• CPC Class Codes: C09J 7/38 Pressure-sensitive adhesives [PSA]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/846 : comprising getter material or desiccants
• CPC Class Codes: H10K 71/00 : Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 77/10 : Substrates, e.g. flexible substrates
• CPC Class Codes: Y02E 10/549 : Organic PV cells

Abstract

The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Claims

1. A method for protecting an electronic arrangement comprising organic constituents that is arranged on a substrate, said method comprising:

applying a liner to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the liner, and

bonding the liner at least to a partial area on the substrate and/or on the electronic arrangement, the bond being brought about by means of at least one layer of an adhesive in an adhesive tape,

wherein

the adhesive comprises a getter material capable of sorbing at least one permeable substance, the getter material being present in the adhesive at a fraction of not more than 2 wt %, based on the adhesive with the getter material.

2. The method as claimed in claim 1, wherein the adhesive tape is a single-layer adhesive tape comprising the layer of adhesive.

3. The method as claimed in claim 1, wherein

the fraction of the getter material in the adhesive is not more than 1 wt %.

4. The method as claimed in claim 1, wherein

the fraction of the getter material in the adhesive is at least 0.01 wt %.

5. The method as claimed in claim 1, wherein

the getter material is in nanoscale form.

6. The method as claimed in claim 1, wherein

an adhesive is used which when shaped to form a layer having a thickness of 50 μ

m has a water vapor permeation rate of less than 50 g/m²d and/or an oxygen permeation rate of less than 5000 g/m²d bar.

7. The method as claimed in claim 1, wherein

first of all the layer of pressure-sensitive adhesive, optionally as part of a double-sided adhesive tape comprising further layers, and, in a subsequent step, the liner are applied to the substrate and/or the electronic arrangement.

8. The method as claimed in claim 1, wherein

the layer of pressure-sensitive adhesive and the liner are applied jointly to the substrate and/or the electronic arrangement.

9. The method as claimed in claim 1, wherein

the liner completely covers the electronic arrangement.

10. The method as claimed in claim 9, wherein a region of the substrate around the electronic arrangement as well is wholly or partly covered by the liner.

11. The method as claimed in claim 1, wherein

the layer of adhesive completely covers the electronic arrangement.

12. The method as claimed in claim 11, wherein a region of the substrate around the electronic arrangement as well is wholly or partly covered by the layer of adhesive.

13. An adhesive tape comprising at least one layer of an adhesive, the pressure-sensitive adhesive comprising a getter material capable of sorbing at least one permeable substance,

wherein the getter material is present in the adhesive at a fraction of not more than 2 wt %, based on the adhesive with the getter material.