Low cross-talk headset

• US 9,544,688 B1
• Filed: 01/29/2014
• Issued: 01/10/2017
• Est. Priority Date: 01/29/2014
• Status: Active Grant

• Current Assignee: Clear-Com, LLC (HM Electronics Incorporated)
• Original Assignee: Clear-Com, LLC (HM Electronics Incorporated)
• Inventors: Knoblock, Karl
• Primary Examiner(s): Kim, Paul S
• Assistant Examiner(s): Yu, Norman
• Application Number:
  US14/167,856
• Time in Patent Office: 1,077 Days
• Field of Search: 381/330, 381/370, 381/381, 381/71.6, 381/74, 381/92, 381/94.7, 379/430, 455/575.2
• US Class Current: 1/1
• CPC Class Codes: H04R 1/083 Special constructions of mouthpieces
• CPC Class Codes: H04R 1/105 Earpiece supports, e.g. ear hooks for stereophonic headphones H04R5/0335
• CPC Class Codes: H04R 1/1066 Constructional aspects of the interconnection between earpiece and earpiece support earpiece support for monophonic headphones H04R1/105; earpiece support for stereophonic headphones H04R5/0335
• CPC Class Codes: H04R 2201/107 Monophonic and stereophonic headphones with microphone for two-way hands free communication
• CPC Class Codes: H04R 2410/05 Noise reduction with a separate noise microphone
• CPC Class Codes: H04R 2460/01 Hearing devices using active noise cancellation
• CPC Class Codes: H04R 3/002 Damping circuit arrangements for transducers, e.g. motional feedback circuits
• CPC Class Codes: H04R 3/02 for preventing acoustic reaction , i.e. acoustic oscillatory feedback specially adapted for hearing aids H04R25/453

Abstract

A headset for receiving and transmitting audio signals having a frame configured to retain the headset on the user, one or more earphones mounted to the frame of the headset at a first position, one or more microphones mounted to the frame of the headset in a second position separate from the first position, one or more electrical earphones, one or more electrical microphones, wherein the one or more electrical microphone wires are isolated from the one or more electrical earphone wires.

Claims

1. A headset for receiving and transmitting audio signals comprising:

a frame configured to retain the headset on a user;

an earphone configured to provide audio signals to a user of the headset, wherein the earphone is supported by the frame of the headset at a first position, wherein the first position comprises a first location on the frame of the headset adjacent to a first ear of the user and a first temple of the user;

a microphone boom configured to carry one or more microphones, wherein the microphone boom is supported by the frame through a mechanical coupling in a second position separate from the first position, wherein the second position comprises a second location on the frame of the headset adjacent to a second temple of the user opposite the first temple, and wherein the mechanical coupling is configured such that no earphone is positioned between the microphone boom and the frame of the headset;

the one or more microphones configured to receive audio signals from the user of the headset;

one or more electrical earphone wires associated with the earphone configured to carry audio signals to the earphone;

one or more electrical microphone wires associated with individual ones of the one or more microphones configured to carry audio signals from individual ones of the one or more microphones, wherein the one or more electrical microphone wires are physically separated from the one or more electrical earphone wires, and wherein the one or more electrical microphone wires are not supported by the earphone.

2. The headset of claim 1, wherein the one or more electrical earphone wires and the one or more electrical microphone wires comprise double-shielded electrical cables configured to reduce transmission of electrical signals between the one or more electrical earphone wires and the one or more electrical microphone wires.

3. The headset of claim 1, wherein the microphone boom comprises a wire-type microphone boom configured to reduce the transmission of audio signals from the user through the frame of the headset.

4. The headset of claim 1, wherein the one or more electrical microphone wires and the one or more electrical earphone wires are separate wires and are configured to reduce electrical crosstalk between the one or more electrical microphone wires and the one or more electrical earphone wires.

5. The headset of claim 4, wherein the one or more electrical microphone wires and the one or more electrical earphone wires further comprise spacers disposed between the one or more electrical microphone wires and the one or more electrical earphone wires configured to reduce electrical coupling between the one or more electrical microphone wires and the one or more electrical earphone wires.

6. The headset of claim 1, further comprising one or more physical processors configured to by machine-readable instructions to:

reduce the audio signals that are transmitted from the one or more electrical earphone wires to the one or more electrical microphone wires.

7. The headset of claim 6, wherein the one or more physical processors are configured to reduce the audio signals that are transmitted from the earphone through the frame of the headset to the one or more microphones.

8. A headset for receiving and transmitting audio signals comprising:

a frame configured to retain the headset on a user;

an earphone configured to provide audio signals to the user of the headset, wherein the earphone is supported by the headset at a first position, wherein the first position corresponds to a first location that is adjacent to a first ear of the user and a first temple of the user;

a microphone boom configured to carry one or more microphones, wherein the microphone boom is supported by the frame through a mechanical coupling in a second position separate from the first position, wherein the second position comprises a second location on the frame of the headset adjacent to a second temple of the user opposite the first temple, and wherein the mechanical coupling is configured such that no earphone is positioned between the microphone boom and the frame of the headset;

the one or more microphones configured to receive audio signals from the user of the headset;

one or more electrical earphone wires associated with the earphone configured to carry audio signals to the earphone;

one or more electrical microphone wires associated with individual ones of the one or more microphones configured to carry audio signals from individual ones of the one or more microphones, wherein the one or more electrical microphone wires are physically separated from the one or more electrical earphone wires, and wherein the one or more electrical microphone wires are not supported by the earphone.

9. The headset of claim 8, wherein the one or more electrical earphone wires and the one or more electrical microphone wires comprise double-shielded electrical cables configured to reduce transmission of electrical signals between the one or more electrical earphone wires and the one or more electrical microphone wires.

10. The headset of claim 8, wherein the microphone boom comprises a wire-type microphone boom configured to reduce the transmission of audio signals from the user through the frame of the headset.

11. The headset of claim 8, wherein the one or more electrical microphone wires is separate from the one or more electrical earphone wires and configured to reduce electrical crosstalk between the one or more electrical microphone wires and the one or more electrical earphone wires.

12. The headset of claim 11, wherein the one or more electrical microphone wires and the one or more electrical earphone wires further comprise spacers disposed between the one or more electrical microphone wires and the one or more electrical earphone wires configured to reduce electrical coupling between the one or more electrical microphone wires and the one or more electrical earphone wires.

13. A headset for receiving and transmitting audio signals comprising:

a frame configured to retain the headset on a user;

an earphone configured to provide audio signals to a user of the headset, wherein the earphone is supported by the frame of the headset at a first position;

a microphone boom configured to carry one or more microphones, wherein the microphone boom is supported by the frame through a mechanical coupling in a second position separate from the first position and on an opposite side of the frame from the first position, and wherein the mechanical coupling is configured such that no earphone is positioned between the microphone boom and the frame of the headset;

the one or more microphones configured to receive audio signals from the user of the headset; and

one or more electrical wires associated with the earphone and the one or more microphones, configured to carry audio signals to the earphone and/or from the one or more microphones, wherein the one or more electrical wires carry audio signals to the earphone via a first connection of the headset, wherein the one or more electrical wires carry audio signals from the one or more microphones via a second connection of the headset, wherein the first connection and the second connection are physically separated, and wherein the one or more electrical wires carrying audio signals from the one or more microphones are not supported by the earphone.

14. The headset of claim 13, wherein the first position comprises a location on the frame of the headset adjacent a first ear of the user and the second position comprises a location on the frame of the headset adjacent a first temple of the user opposite the first ear.

15. The headset of claim 13, wherein the microphone boom comprises a wire-type microphone boom configured to reduce the transmission of audio signals from the user through the frame of the headset.

16. The headset of claim 13, further comprising one or more physical processors configured to by machine-readable instructions to:

reduce the audio signals that are transmitted from the one or more electrical earphone wires to the one or more electrical microphone wires.

17. The headset of claim 16, wherein the one or more physical processors are configured to reduce the audio signals that are transmitted from the earphone through the frame of the headset to the one or more microphones.

18. The headset of claim 13, wherein the first connection and the second connection are physically separated by one or more spacers.