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Flexible thermal conduit for an electronic device

  • US 9,545,030 B2
  • Filed: 05/06/2015
  • Issued: 01/10/2017
  • Est. Priority Date: 01/20/2015
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a first housing portion containing an electronic component that generates heat during operation;

    a second housing portion, flexibly coupled via a hinge to the first housing portion, the second housing portion containing a heat dissipation structure; and

    a multi-layer flexible thermal conduit that passes from the first housing portion to the second housing portion, to convey heat generated by the electronic component to the heat dissipation structure,wherein the multi-layer flexible thermal conduit comprises a plurality of flexible thermally conductive layers,a major surface of each layer of the plurality of flexible thermally conductive layers is adjacent to a major surface of an adjacent layer of the plurality of flexible thermally conductive layers,a major surface of one of the flexible thermally conductive layers is adjacent to the hinge; and

    wherein the plurality of flexible thermally conductive layers are not affixed to each other in a region where the second housing portion is flexibly coupled to the first housing portion, such that the plurality of flexible thermally conductive layers are able to flex separately in said region.

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