Method for manufacturing organic light emitting display

• US 9,547,387 B2
• Filed: 10/23/2015
• Issued: 01/17/2017
• Est. Priority Date: 08/29/2012
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Choi, Ho-Won, Kim, Seung-Hyun
• Primary Examiner(s): Huynh, Andy
• Application Number:
  US14/921,432
• Publication Number:
  US 20160041670A1
• Time in Patent Office: 452 Days
• Field of Search: 438/34, 438/82, 438/99
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A method for manufacturing an organic light emitting display comprises forming a touch pad portion in a part of a dead region of the second buffer layer and the touch pad portion comprises a plurality of touch pads and each of the touch pads comprises a metal pad layer and a transparent electrode pad layer connected to each other via a plurality of first contact holes in a first insulating film.

Claims

1. A method for manufacturing an organic light emitting display comprising:

forming a first etching stopper film and a first buffer layer on a first substrate, and forming a transistor-organic light emitting diode array having a transistor in each of pixels defined in a matrix form and an organic light emitting diode connected to the transistor in an active region of the first buffer layer;

forming a second etching stopper film and a second buffer layer on a second substrate and forming a touch electrode array in an active region of the second buffer layer;

forming a touch pad portion in a part of a dead region of the second buffer layer, wherein the touch pad portion comprises a plurality of touch pads and each of the touch pads comprises a metal pad layer and a transparent electrode pad layer connected to each other via a plurality of first contact holes in a first insulating film;

forming a dummy pad portion in a dead region of the first buffer layer, wherein the dummy pad portion comprises a plurality of dummy pads, each dummy pad corresponding to each touch pad; and

applying a sealant including a conductive ball to the touch pad portion or the dummy pad portion, attaching an adhesive layer to the touch electrode array or the transistor-organic light emitting diode array and joining the first substrate to the second substrate.

2. The method according to claim 1, wherein the conductive ball laterally contacts at least one of the plurality of first contact holes inside at least one of the plurality of first contact holes.

3. The method according to claim 2, wherein a diameter of the first contact hole is smaller than a diameter of the conductive ball and the plurality of first contact holes correspond to one conductive ball.

4. The method according to claim 3, wherein the forming each touch pad of the touch pad portion comprises:

forming a metal pad layer on the second buffer layer;

forming a first insulating film comprising a plurality of first contact holes on the metal pad layer;

forming a transparent electrode pad layer on the first insulating film such that the transparent electrode pad layer is connected to the metal pad layer through the first contact hole.

5. The method according to claim 4, wherein the transparent electrode pad layer comprises a first transparent electrode pad layer and a second transparent electrode pad layer which are disposed in different layers.

6. The method according to claim 5, wherein the forming each touch pad comprises:

horizontally disposing a plurality of metal patterns between the first contact hole and vertically disposing the plurality of metal patterns between the first transparent electrode pad layer and the second transparent electrode pad layer.

7. The method according to claim 1, wherein the forming the dummy pad of the dummy pad portion comprises:

forming a gate metal pad layer on the first buffer layer;

forming a third insulating film including a plurality of second contact holes on the gate metal pad layer; and

forming a source pad layer on the third insulating film such that the source pad layer is connected through the second contact holes to the gate metal pad layer.

8. The method according to claim 1, wherein, after joining, the conductive ball is compressed to a predetermined to a thickness between the touch pad portion and the dummy pad portion.

9. The method according to claim 8, wherein, after joining, the dead region of the touch pad portion neighboring portion is spaced from the sealant by a predetermined distance.

10. The method according to claim 1, further comprising:

removing the first substrate and the second substrate; and

adhering a film substrate to an exposed surface of the first etching stopper film.

11. The method according to claim 10, wherein the removing the first substrate and the second substrate is carried out by etching or laser-irradiating the first substrate and the second substrate.