Microelectronic assembly with multi-layer support structure

• US 9,548,145 B2
• Filed: 12/04/2013
• Issued: 01/17/2017
• Est. Priority Date: 01/05/2007
• Status: Active Grant

• Current Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Original Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Inventors: Nystrom, Michael J., Humpston, Giles
• Primary Examiner(s): Tucker, Philip
• Assistant Examiner(s): Smith, Jr., Jimmy R
• Application Number:
  US14/096,906
• Publication Number:
  US 20140224419A1
• Time in Patent Office: 1,140 Days
• Field of Search: 156/299
• US Class Current: 1/1
• CPC Class Codes: H01B 13/00 Apparatus or processes specially adapted for manufacturing conductors or cables
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Claims

1. A method of forming a microelectronic assembly, comprising:

positioning a support structure adjacent to an active region of a device but not extending onto the active region, thereby positioning the support structure on a surface of the device,

the support structure having a first adhesive layer for bonding with the surface of the device, and having a second adhesive layer facing away from the surface of the device, and a first structural layer between the first and second adhesive layers,

positioning a second structural layer which projects from a major surface of a lid so that the second structural layer contacts the second adhesive layer and the lid extends over the active region of the device; and

exposing the first and second adhesive layers to environmental conditions to cause the first and second adhesive layers to bond to the device and to the second structural layer, respectively,

wherein the support structure and the second structural layer resist deformation under the environmental conditions associated with bonding the first and second adhesive layers to the device and the second structural layer, respectively.

2. The method of claim 1, wherein the support structure is a multi-layered sheet comprising the first and second adhesive layers and the first structural layer therebetween, the method further comprising punching the multi-layered sheet to define an aperture having one or more side walls adapted to border the active region prior to the positioning the support structure and the second structural layer relative to the device and prior to the exposing the first and second adhesive layers to the environmental conditions.

3. The method of claim 2 further comprising forming the multi-layered sheet of support structure material including:

providing a sheet of material which is capable of resisting deformation under environmental conditions associated with bonding an adhesive material;

forming a plurality of pores in opposite surfaces of the sheet to provide porous surfaces; and

coating the porous surfaces with first and second adhesive layers, respectively, such that adhesive material of the adhesive layers seeps at least partially into the pores.

4. The method of claim 2 further comprising forming the multi-layered sheet of support structure material including:

providing an adhesive material; and

partially curing the adhesive material to define a section of the support structure which is capable of resisting deformation under environmental conditions associated with fully curing the adhesive material, the section of the support structure that is capable of resisting deformation being the structural layer.

5. The method of claim 4 wherein the section of the support structure that is capable of resisting deformation is approximately midway between the device and the lid.

6. The method of claim 2 wherein positioning the support structure comprises aligning the aperture so that the one or more side walls border the active region.