High mobility devices with anti-punch through layers and methods of forming same
First Claim
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1. A method for forming a semiconductor device, the method comprising:
- forming an anti-punch through (APT) layer over a semiconductor substrate, wherein the APT layer comprises first APT dopants;
forming a semiconductor layer over the APT layer;
patterning the semiconductor layer and the APT layer to define;
a first fin extending upwards from the semiconductor substrate, wherein the first fin comprises a first APT layer portion and a first semiconductor layer portion over the first APT layer portion; and
a second fin comprising a second APT layer portion and a second semiconductor layer portion over the second APT layer portion;
implanting second APT dopants in the second APT layer portion after forming the second semiconductor layer portion, wherein the second APT dopants are of a different type than the first APT dopants; and
forming a conductive gate stack on a top surface and a sidewall of the first semiconductor layer portion of the first fin.
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Abstract
An embodiment semiconductor device includes a fin extending upwards from a semiconductor substrate. The fin includes an anti-punch through (APT) layer having APT dopants and a channel region over the APT layer. The channel region is substantially free of APT dopants. The semiconductor device further includes a conductive gate stack on a sidewall and a top surface of the channel region.
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Citations
20 Claims
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1. A method for forming a semiconductor device, the method comprising:
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forming an anti-punch through (APT) layer over a semiconductor substrate, wherein the APT layer comprises first APT dopants; forming a semiconductor layer over the APT layer; patterning the semiconductor layer and the APT layer to define; a first fin extending upwards from the semiconductor substrate, wherein the first fin comprises a first APT layer portion and a first semiconductor layer portion over the first APT layer portion; and a second fin comprising a second APT layer portion and a second semiconductor layer portion over the second APT layer portion; implanting second APT dopants in the second APT layer portion after forming the second semiconductor layer portion, wherein the second APT dopants are of a different type than the first APT dopants; and forming a conductive gate stack on a top surface and a sidewall of the first semiconductor layer portion of the first fin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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patterning first fin extending upwards from a substrate, wherein the first fin comprises; a first anti-punch through (APT) portion comprising first APT dopants; and a first semiconductor portion over the first APT portion; patterning second fin extending upwards from a substrate, wherein the second fin comprises; a second anti-punch through (APT) portion comprising second APT dopants of a same type as the first APT dopants; and a second semiconductor portion over the second APT portion; masking the first fin; while masking the first fin, removing the second semiconductor portion to expose the second APT portion; while masking the first fin, implanting third APT dopants of a different type than the second APT dopants into the second APT portion after removing the second semiconductor portion; and after implanting the third APT dopants, forming a third semiconductor portion over the second APT portion. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method for forming a semiconductor device, the method comprising:
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forming an anti-punch through (APT) layer over a semiconductor substrate, wherein the APT layer comprises first APT dopants; forming a semiconductor layer over the APT layer; patterning the semiconductor layer and the APT layer to define; a first fin extending upwards from the semiconductor substrate, wherein the first fin comprises a first APT layer portion and a first semiconductor layer portion over the first APT layer portion; and a second fin comprising a second APT layer portion and a second semiconductor layer portion over the second APT layer portion; implanting second APT dopants in the second APT layer portion after forming the second semiconductor layer portion, wherein the second APT dopants are of a different type than the first APT dopants, and wherein a ratio of the second APT dopants in the second APT layer portion to the first APT dopants in the second APT layer portion is at least two to one; and forming a conductive gate stack on a top surface and a sidewall of the first semiconductor layer portion of the first fin. - View Dependent Claims (17, 18, 19, 20)
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Specification