Microphone package

• US 9,549,261 B2
• Filed: 10/03/2013
• Issued: 01/17/2017
• Est. Priority Date: 11/20/2012
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Higashi, Yoshihiro, Fuji, Yoshihiko, Hara, Michiko, Yuzawa, Akiko, Kaji, Shiori, Nagata, Tomohiko, Hori, Akio, Fukuzawa, Hideaki
• Primary Examiner(s): Goins, Davetta W
• Assistant Examiner(s): DABNEY, PHYLESHA LARVINIA
• Application Number:
  US14/045,153
• Publication Number:
  US 20140137658A1
• Time in Patent Office: 1,202 Days
• Field of Search: 381/174, 381/175, 381/113, 737/79, 738/626.9, 735/87
• US Class Current: 1/1
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 7/10 comprising superposed layers in contact

Abstract

According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.

Claims

1. A sensor comprising:

a film being deformable; and

a sensing element provided on the film and comprising;

a first magnetic layer having a first magnetization along a first direction,

a second magnetic layer having a second magnetization; and

an intermediate layer provided between the first magnetic layer and the second magnetic layer; and

a housing, the film and the sensing element being provided in the housing, the housing comprising;

a first portion being magnetic, at least a part of the first portion being arranged with the first magnetization in the first direction.

2. The sensor according to claim 1, wherein

an angle between the first magnetization and the second magnetization changes in response to a deformation of the film.

3. The sensor according to claim 1, wherein the first portion comprises a magnetic material.

4. The sensor according to claim 1, wherein the housing further comprises a lid, the sensing element is provided between the lid and the film, and the lid comprises a metal.

5. The sensor according to claim 1, wherein

the film has a portion formed in a geometrically isotropic shape, and

the sensing element is placed at a position not including a geometric center point of the geometrically isotropic shape.

6. The sensor according to claim 1, wherein the film comprises silicon.

7. The sensor according to claim 1, wherein the film comprises a polymer material.

8. The sensor according to claim 1, wherein

the second magnetic layer is apart from the first magnetic layer in a stacking direction,

the first magnetization is perpendicular to the stacking direction,

the second magnetization is perpendicular to the stacking direction, and

the first portion has a surface substantially perpendicular to the first magnetization and the second magnetization.

9. The sensor according to claim 1, wherein

the second magnetic layer is apart from the first magnetic layer in a stacking direction,

the first magnetization is substantially parallel to the stacking direction,

the second magnetization is substantially parallel to the stacking direction, and

the first portion has a surface substantially parallel to the first magnetization and the second magnetization.

10. The sensor according to claim 1, wherein

the housing further comprises a second portion,

the sensing element is provided between the second portion and the film, and

the second portion is formed of a resin material.

11. The sensor according to claim 1, wherein the housing is provided with a hole configured to passing sound.