System and method for redirecting airflow across an electronic assembly

• US 9,549,457 B2
• Filed: 02/12/2014
• Issued: 01/17/2017
• Est. Priority Date: 02/12/2014
• Status: Active Grant

• Current Assignee: SanDisk Technologies LLC (Western Digital Corporation)
• Original Assignee: SanDisk Technologies LLC (Western Digital Corporation)
• Inventors: Ellis, Robert W., Dean, David
• Primary Examiner(s): SMITH, COURTNEY L
• Application Number:
  US14/179,247
• Publication Number:
  US 20150230327A1
• Time in Patent Office: 1,070 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 7/20127 Natural convection
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 9/0079 Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges

Abstract

The system for redirecting airflow includes multiple electronic assemblies arranged adjacent to one another. Each electronic assembly includes a substrate having a substantially flat first surface and an opposing substantially flat second surface. Electronic devices are coupled to each of the first and second surfaces. Each surface also has one or more tabs coupled thereto, where each tab is configured to redirect the airflow over a least one electronic device.

Claims

1. A system for redirecting airflow across an electronic assembly, comprising:

an electronic assembly comprising;

a substrate, wherein the substrate has a substantially flat first surface and an opposing substantially flat second surface;

at least one electronic device coupled to the substrate; and

at least one first tab and at least one second tab, wherein the at least one first tab is coupled to the flat first surface of the substrate of the electronic assembly, and the at least one second tab is coupled to the flat second surface of the substrate of the electronic assembly, such that when air flows over the electronic assembly, the at least one first tab redirects the air over the at least one electronic device.

2. The system of claim 1, wherein the first and second tabs are soldered to the substrate.

3. The system of claim 2, wherein the substrate is a printed circuit board.

4. The system of claim 1, wherein each of the first and second tabs include at least one projection, where each projection mates with a hole in the substrate.

5. The system of claim 4, wherein each projection is a push pin biased to lock into place once inserted through its respective hole in the substrate.

6. The system of claim 1, wherein the first and second tabs are oriented to cause turbulent airflow.

7. The system of claim 1, wherein multiple first tabs are affixed to the first surface at two or more different angles with respect to one another, and multiple second tabs are affixed to the second surface at two or more different angles with respect to one another.

8. The system of claim 1, wherein the at least one first tab is disposed substantially perpendicular to the first surface, and the at least one second tab is disposed substantially perpendicular to the second surface.

9. The system of claim 1, further comprising multiple electronic assemblies disposed adjacent and parallel to one another.

10. The system of claim 1, wherein the at least one electronic device comprises multiple integrated circuit memory devices.

11. The system of claim 1, wherein the at least one electronic device comprises multiple electronic devices coupled to each of the first surface and the second surface of the substrate.

12. The system of claim 1, wherein the at least one electronic device comprises multiple electronic devices disposed between the first surface and the second surface.

13. The system of claim 1, farther comprising a source of the airflow.

14. The system of claim 1, wherein the first tab is L-shaped, T-shaped, or I-shaped.

15. The system of claim 1, wherein an angle of the first tab is adjustable.

16. The system of claim 15, wherein the angle is adjusted by rotating the tab with respect to the substrate and inserting pins of the tab into corresponding holes formed in the substrate.

17. The system of claim 15, wherein the tab comprises a tab portion rotatably coupled to a base portion, where the base portion is affixed to the substrate and the angle of the tab portion is adjusted by rotating the tab portion relative to the base portion and the substrate.

19. The system of claim 1, wherein the at least one first tab and the at least one second tab are positioned directly between a source of the airflow and the at least one electronic device to direct the airflow over the at least one electronic device.

20. The system of claim 19, wherein an angle of incidence of the at least one first tab with reference to the air.

21. The system of claim 20, wherein the angle is adjusted by rotating the at least one first tab with respect to the substrate and inserting a pin of the at least one first tab into a corresponding hole formed in the substrate.

22. The system of claim 20, wherein the at least one first tab comprises a tab portion rotatably coupled to a base portion, where the base portion is affixed to the substrate and the angle of the tab portion is adjusted by rotating the tab portion relative to the base portion and the substrate.

18. A system for redirecting airflow across a substrate:

a substrate having opposing first and second sides and comprising at least a first electronic device coupled to the first side and at least a second electronic device coupled to the second side; and

multiple tabs affixed to the first and second sides of the substrate, wherein when the substrate receives an airflow, the multiple tabs redirects the airflow over the first and second electronic devices.