Method for producing an illuminant
First Claim
Patent Images
1. A method for producing a light-emitting means, comprising the following steps:
- providing an optoelectronic semiconductor component part comprising a housing body, at least one light-emitting diode chip, which is arranged in the housing body, and at least two electrical connection points, which are arranged on a lower side of the optoelectronic semiconductor component part;
providing a connection carrier comprising at least two contact points, which are arranged on an upper side of the connection carrier;
providing a positioning apparatus, which is in direct contact with the connection carrier and/or the optoelectronic semiconductor component part;
providing a connecting means between the connection points of the optoelectronic semiconductor component part and the contact points of the connection carrier; and
mechanically fastening and electrically connecting the optoelectronic semiconductor component part on the connection carrier by means of the connecting means,wherein the positioning apparatus keeps the optoelectronic semiconductor component part within a tolerance range on the upper side of the connection carrier during the mechanical fastening and electrical connection, andwherein at least one component of the positioning apparatus is removed once the optoelectronic semiconductor component part has been mechanically fastened and electrically connected on the connection carrier.
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Abstract
A method for producing an illuminant is specified, in which a positioning device (3) holds an optoelectronic semiconductor component (1) inside a tolerance range (4) on the upper side of a connection carrier (2) during the mechanical fixation and electrical connecting of the optoelectronic semiconductor component (1) to the connection carrier (2).
18 Citations
15 Claims
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1. A method for producing a light-emitting means, comprising the following steps:
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providing an optoelectronic semiconductor component part comprising a housing body, at least one light-emitting diode chip, which is arranged in the housing body, and at least two electrical connection points, which are arranged on a lower side of the optoelectronic semiconductor component part; providing a connection carrier comprising at least two contact points, which are arranged on an upper side of the connection carrier; providing a positioning apparatus, which is in direct contact with the connection carrier and/or the optoelectronic semiconductor component part; providing a connecting means between the connection points of the optoelectronic semiconductor component part and the contact points of the connection carrier; and mechanically fastening and electrically connecting the optoelectronic semiconductor component part on the connection carrier by means of the connecting means, wherein the positioning apparatus keeps the optoelectronic semiconductor component part within a tolerance range on the upper side of the connection carrier during the mechanical fastening and electrical connection, and wherein at least one component of the positioning apparatus is removed once the optoelectronic semiconductor component part has been mechanically fastened and electrically connected on the connection carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for producing a light-emitting means, comprising the following steps:
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providing an optoelectronic semiconductor component part comprising a housing body, at least one light-emitting diode chip, which is arranged in the housing body, and at least two electrical connection points, which are arranged on a lower side of the optoelectronic semiconductor component part; providing a connection carrier comprising at least two contact points, which are arranged on an upper side of the connection carrier; providing a positioning apparatus, which is in direct contact with the connection carrier and/or the optoelectronic semiconductor component part; providing a connecting means between the connection points of the optoelectronic semiconductor component part and the contact points of the connection carrier; and mechanically fastening and electrically connecting the optoelectronic semiconductor component part on the connection carrier by means of the connecting means, wherein the positioning apparatus keeps the optoelectronic semiconductor component part within a tolerance range on the upper side of the connection carrier during the mechanical fastening and electrical connection, and wherein during the mechanical fastening and electrical connection the optoelectronic semiconductor component part floats on the connecting means in such a way that it abuts the positioning apparatus.
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15. A method for producing a light-emitting means, comprising the following steps:
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providing an optoelectronic semiconductor component part comprising a housing body, at least one light-emitting diode chip, which is arranged in the housing body, and at least two electrical connection points, which are arranged on a lower side of the optoelectronic semiconductor component part; providing a connection carrier comprising at least two contact points, which are arranged on an upper side of the connection carrier; providing a positioning apparatus, which is in direct contact with the connection carrier and/or the optoelectronic semiconductor component part; providing a connecting means between the connection points of the optoelectronic semiconductor component part and the contact points of the connection carrier; and mechanically fastening and electrically connecting the optoelectronic semiconductor component part on the connection carrier by means of the connecting means, wherein the positioning apparatus keeps the optoelectronic semiconductor component part within a tolerance range on the upper side of the connection carrier during the mechanical fastening and electrical connection, wherein the positioning apparatus comprises at least two pins and at least two cutouts, wherein at least one of the pins is an oval pin, and wherein during positioning of the oval pin in the corresponding cutout a play results, which causes the tolerance range during connection of the optoelectronic semiconductor component part and the connection carrier.
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Specification