Passive optical alignment
First Claim
Patent Images
1. A system for passive optical alignment comprising:
- a through optical via formed through a substrate, said optical via comprising an open center providing an open passageway through said substrate and inner walls coated with a material having a lower index of refraction than the passageway;
an optical transmission medium secured to a first side of said substrate such that said optical transmission medium is aligned with said through optical via;
an optoelectronic component secured to a second side of said substrate such that said an active region of said optoelectronic component is aligned with said through optical via;
a circuit board for said optoelectronic component; and
a heat sink on which said optoelectronic component is disposed, said circuit board surrounding said heat sink.
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Abstract
A system for passive optical alignment includes an through optical via formed through a substrate, an optical transmission medium secured to a first side of the substrate such that the optical transmission medium is aligned with the through optical via, and an optoelectronic component secured to a second side of the substrate such that the active region of said optoelectronic component is aligned with the through optical via.
50 Citations
19 Claims
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1. A system for passive optical alignment comprising:
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a through optical via formed through a substrate, said optical via comprising an open center providing an open passageway through said substrate and inner walls coated with a material having a lower index of refraction than the passageway; an optical transmission medium secured to a first side of said substrate such that said optical transmission medium is aligned with said through optical via; an optoelectronic component secured to a second side of said substrate such that said an active region of said optoelectronic component is aligned with said through optical via; a circuit board for said optoelectronic component; and a heat sink on which said optoelectronic component is disposed, said circuit board surrounding said heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for passive optical alignment, the method comprising:
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forming a through optical via through a substrate, the optical via having an open center extending through the substrate; securing a receiving end of an optical transmission medium directly one end of said open-center optical via and to a first side of said substrate such that said optical transmission medium is aligned with said through optical via; securing an optoelectronic component to a second side of said substrate such that an active region of said optoelectronic component is aligned with said open-center optical via; providing a circuit board for said optoelectronic component; and disposing said optoelectronic component on a heat sink, said circuit board surrounding said heat sink. - View Dependent Claims (13, 14, 15, 16)
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17. An optical system comprising:
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a first set of bond pads disposed on a first side of a substrate; a through optical via formed through said substrate; a second set of bond pads disposed on an optoelectronic component, said second said of bond pads being spatially identical to said first set of bond pads; solder bumps disposed between said first set of bond pads and said second set of bond pads to align an active region of said optoelectronic component to said through optical via; a processing module, wherein a signal path between the optoelectronic component and the processing module comprises at least one of the solder bumps; a coupling mechanism to secure an optical transmission medium to a second side of said substrate such that said optical transmission medium is aligned with said through optical via; a circuit board for said optoelectronic component; and a heat sink on which said optoelectronic component is disposed, said circuit board surrounding said heat sink, wherein said through optical via allows light to pass between said optoelectronic component and said optical transmission medium. - View Dependent Claims (18, 19)
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Specification