Sensor electrode path error diagnosis

• US 9,552,121 B2
• Filed: 06/30/2015
• Issued: 01/24/2017
• Est. Priority Date: 01/25/2011
• Status: Expired due to Fees

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: Saucedo, Jorge, Weinerth, John M., Fang, Wen
• Primary Examiner(s): Ghebretinsae, Temesghen
• Assistant Examiner(s): Xie, Kwin
• Application Number:
  US14/788,429
• Publication Number:
  US 20150301658A1
• Time in Patent Office: 574 Days
• Field of Search: 345173-174
• US Class Current: 1/1
• CPC Class Codes: G01D 3/08 with provision for safeguarding the apparatus, e.g. against abnormal operation, against breakdown
• CPC Class Codes: G01D 5/24 by varying capacitance
• CPC Class Codes: G06F 3/0418 for error correction or compensation, e.g. based on parallax, calibration or alignment
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

A processing system for a capacitive sensing input device comprises a sensing module, a first internal diagnostic mechanism, and a determination module. The sensing module is configured to couple with a first sensor electrode path of a plurality of sensor electrode paths, and is configured to drive the first sensor electrode path with a first signal. The first internal diagnostic mechanism is configured to couple with a second sensor electrode path and to acquire a test signal output while the sensing module drives the first sensor electrode path with the first signal. The first internal diagnostic mechanism comprises a selectable current source configured to couple with the second sensor electrode path, and the selectable current source is enabled during acquisition of the test signal output. The determination module is configured to determine whether the first and second sensor electrode paths are ohmically coupled together based on the test signal output.

Claims

1. A processing system for a capacitive sensing input device, said processing system comprising:

a sensing module configured to couple with a first sensor electrode path of a plurality of sensor electrode paths, wherein the sensing module is configured to drive said first sensor electrode path with a first signal;

a first internal diagnostic mechanism configured to couple with a second sensor electrode path and configured to acquire a test signal output while said sensing module drives said first sensor electrode path with said first signal, wherein said first internal diagnostic mechanism comprises a selectable current source configured to couple with said second sensor electrode path, and wherein said selectable current source is enabled during acquisition of said test signal output; and

a determination module configured to determine whether said first and second sensor electrode paths are ohmically coupled together based on said test signal output.

2. The processing system of claim 1, further comprising:

a second internal diagnostic mechanism configured to couple with a third sensor electrode path and configured to acquire a second test signal output while said sensing module drives said first sensor electrode path with said first signal, wherein said second internal diagnostic mechanism comprises a second selectable current source configured to couple with said third sensor electrode path, and wherein said second selectable current source is enabled during acquisition of said second test signal output; and

wherein said determination module is further configured to determine whether said first and third sensor electrode paths are ohmically coupled together based on said second test signal output.

3. The processing system of claim 2, further comprising:

a third internal diagnostic mechanism configured to couple with a fourth sensor electrode path and configured to acquire a third test signal output while said sensing module drives said first sensor electrode path with said first signal, wherein said third internal diagnostic mechanism comprises a third selectable current source configured to couple with said fourth sensor electrode path, and wherein said third selectable current source is enabled during acquisition of said third test signal output; and

wherein said determination module is further configured to determine whether said first and fourth sensor electrode paths are ohmically coupled together based on said third test signal output.

4. The processing system of claim 1, wherein said first internal diagnostic mechanism further comprises a Schmitt trigger configured to provide said output signal.

5. The processing system of claim 1, wherein said selectable current source comprises a selectable variable current source in which a positive level of current is also selectable when said selectable variable current source is enabled, such that testing may be accomplished to discern different levels of ohmic coupling.

6. The processing system of claim 1, wherein said first sensor electrode path comprises at least one of a pin of said processing system, a sensor electrode, and a trace coupled between said sensor electrode and said pin.

7. The processing system of claim 1, wherein said first internal diagnostic is further configured acquire a second test output signal while selectively coupling a pull-up voltage to said second sensor electrode path while a grounded conductive object is also coupled with said second sensor electrode path;

and

wherein said determination module is further configured to determine whether there is an open in said second electrode path based on a value of said second test output signal.

8. A capacitive sensing input device comprising:

a sensor electrode pattern comprising a plurality of sensor electrodes; and

a processing system coupled with said plurality of sensor electrodes and configured for performing capacitive sensing with said plurality of sensor electrodes, said processing system further configured for;

drive a first sensor electrode path with a first signal, wherein said first sensor electrode path comprises a first sensor electrode of said plurality of sensor electrodes;

acquire, with a first internal diagnostic mechanism coupled with a second sensor electrode path, a test signal output while driving said first sensor electrode path with said first signal, wherein said first internal diagnostic mechanism comprises a selectable current source coupled with said second sensor electrode path, wherein said selectable current source is enabled during acquisition of said test signal output, and wherein said second sensor electrode path comprises a second sensor electrode of said plurality of sensor electrodes; and

determine whether said first and second sensor electrode paths are ohmically coupled together based on said test signal output.

9. The capacitive sensing input device of claim 8, further comprising a flexible circuit configured for coupling signals between said processing system and said plurality of sensor electrodes.

10. The capacitive sensing input device of claim 9, wherein said first sensor electrode path comprises at least one of a pin of said processing system, said first sensor electrode, and a trace disposed on said flexible circuit and coupled between said first sensor electrode and said pin.

11. The capacitive sensing input device of claim 8, wherein said processing system is further configured to:

acquire, with a second internal diagnostic mechanism coupled with a third sensor electrode path, a second test signal output while driving said first sensor electrode path with said first signal, wherein said second internal diagnostic mechanism comprises a second selectable current source coupled with said third sensor electrode path, wherein said second selectable current source is enabled during acquisition of said second test signal output, and wherein said third sensor electrode path comprises a third sensor electrode of said plurality of sensor electrodes; and

determine whether said first and third sensor electrode paths are ohmically coupled together based on said second test signal output.

12. The capacitive sensing input device of claim 11, wherein said processing system is further configured to:

acquire, with a third internal diagnostic mechanism coupled with a fourth sensor electrode path, a third test signal output while driving said first sensor electrode path with said first signal, wherein said third internal diagnostic mechanism comprises a third selectable current source coupled with said fourth sensor electrode path, wherein said third selectable current source is enabled during acquisition of said third test signal output, and wherein said fourth sensor electrode path comprises a fourth sensor electrode of said plurality of sensor electrodes; and

determine whether said first and fourth sensor electrode paths are ohmically coupled together based on said third test signal output.

13. The capacitive sensing input device of claim 8, wherein said first internal diagnostic mechanism further comprises a Schmitt trigger configured to provide said output signal.

14. The capacitive sensing input device of claim 8, wherein said selectable current source comprises a selectable variable current source in which a positive level of current is also selectable when said selectable variable current source is enabled, such that testing may be accomplished to discern different levels of ohmic coupling.

15. A method of sensor electrode path error diagnosis comprising:

driving, with a capacitive sensing input device processing system, a first sensor electrode path with a first signal;

acquiring, with a first internal diagnostic mechanism coupled with a second sensor electrode path, a test signal output while driving said first sensor electrode path with said first signal, wherein said first internal diagnostic mechanism comprises a selectable current source coupled with said second sensor electrode path, wherein said selectable current source is enabled during acquisition of said test signal output, and wherein said first internal diagnostic mechanism is disposed as a portion of said capacitive sensing input device processing system; and

determining, by said capacitive sensing input device processing system, whether said first and second sensor electrode paths are ohmically coupled together based on said test signal output.

16. The method as recited in claim 15, further comprising:

acquiring, with a second internal diagnostic mechanism coupled with a third sensor electrode path, a second test signal output while driving said first sensor electrode path with said first signal, wherein said second internal diagnostic mechanism comprises a second selectable current source coupled with said third sensor electrode path, wherein said second selectable current source is enabled during acquisition of said second test signal output, and wherein said second internal diagnostic mechanism is disposed as a portion of said capacitive sensing input device processing system; and

determining, by said capacitive sensing input device processing system, whether said first and third sensor electrode paths are ohmically coupled together based on said second test signal output.

17. The method as recited in claim 16, further comprising:

acquiring, with a third internal diagnostic mechanism coupled with a fourth sensor electrode path, a third test signal output while driving said first sensor electrode path with said first signal, wherein said third internal diagnostic mechanism comprises a third selectable current source coupled with said fourth sensor electrode path, wherein said third selectable current source is enabled during acquisition of said third test signal output, and wherein said third internal diagnostic mechanism is disposed as a portion of said capacitive sensing input device processing system; and

determining, by said capacitive sensing input device processing system, whether said first and fourth sensor electrode paths are ohmically coupled together based on said third test signal output.

18. The method as recited in claim 15, further comprising:

employing a Schmitt trigger within said first internal diagnostic mechanism to provide said output signal.

19. The method as recited in claim 15, further comprising:

selecting, from a plurality of different positive levels, a level of current supplied by said current source when said current source is enabled, such that said error detection is accomplished at a selected one of a plurality of different levels of ohmic coupling.

20. The method as recited in claim 15, further comprising:

acquiring, by said first internal diagnostic mechanism, a second test output signal while selectively coupling a pull-up voltage to said second sensor electrode path while a grounded conductive object is also coupled with said second sensor electrode path; and

determining, by said capacitive sensing input device processing system, whether there is an open in said second electrode path based on a value of said second test output signal.