Flip chip assembly with connected component

• US 9,553,079 B1
• Filed: 12/15/2015
• Issued: 01/24/2017
• Est. Priority Date: 12/15/2015
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Guerin, Luc G., Langlois, Richard, Martel, Stephan L., Ouimet, Sylvain E., Audet, Jean
• Primary Examiner(s): Sefer, A.
• Application Number:
  US14/969,765
• Time in Patent Office: 406 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/08265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/16265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/171 Disposition
• CPC Class Codes: H01L 2224/73201 on the same surface
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/80815 Reflow soldering
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81192 wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/81986 : Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/08 : of an individual bonding area
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 28/40 : Capacitors
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19103 : interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive

Abstract

A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

Claims

1. A method of making a flip chip assembly, comprising:

depositing solder bumps on a plurality of electrical contacts on a die surface, or on a substrate surface, or on both the die surface and substrate surface, the die electrical contacts electrically connected to die circuitry;

disposing between the die and the substrate a passive component comprising electrodes positioned adjacent to solder bumps;

applying heat to reflow the solder;

solidifying the solder, thereby providing a connection between the passive component electrodes and the die and substrate electrical contacts; and

disposing a conductive spacer between the die and substrate positioned between a die solder bump and a substrate solder bump.

2. The method of claim 1, wherein disposing the passive component between the die and the substrate comprises positioning the passive component electrodes on die solder bumps, applying heat to reflow the solder, solidifying the solder, and positioning the die and substrate with the passive component electrodes on substrate solder bumps.

3. The method of claim 1, wherein disposing the passive component between the die and the substrate comprises positioning the passive component electrodes on substrate solder bumps, applying heat to reflow the solder, solidifying the solder, and positioning the die and substrate with the passive component electrodes on die solder bumps.

4. The method of claim 1, further comprising depositing a filler material to underfill between the die and the substrate.

5. The method of claim 1, comprising

depositing solder bumps on a plurality of electrical contacts on a die surface, the electrical contacts electrically connected to die circuitry;

depositing solder bumps on a plurality of electrical contacts on a substrate;

disposing one or more capacitors comprising a dielectric between electrodes such that the electrodes are on die solder bumps, applying heat to reflow the solder, and solidifying the solder to connect the capacitor electrodes to the die electrical contacts;

disposing one or more conductive spacers on substrate solder bumps corresponding to die electrical contacts without a capacitor, applying heat to reflow the solder, and solidifying the solder to connect the conductive spacers to the substrate electrical contacts;

disposing the die adjacent to the spacer such that the passive component electrodes on the die are adjacent to substrate solder bumps, and conductive spacers on the substrate are adjacent to die solder bumps, and applying heat to reflow the solder;

solidifying the solder, thereby providing a connection between the capacitor electrodes and the die and substrate electrical contacts, and a connection between the conductive spacers and the die and substrate electrical contacts; and

depositing a filler material to underfill between the die and the substrate.