Tungsten separation

• US 9,553,102 B2
• Filed: 08/19/2014
• Issued: 01/24/2017
• Est. Priority Date: 08/19/2014
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Wang, Xikun, Liu, Jie, Wang, Anchuan, Ingle, Nitin K.
• Primary Examiner(s): Reames, Matthew
• Assistant Examiner(s): Wall, Vincent
• Application Number:
  US14/463,561
• Publication Number:
  US 20160056167A1
• Time in Patent Office: 889 Days
• US Class Current: 1/1
• CPC Class Codes: C23F 4/00 Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01L 21/28 Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268 etching for patterning the electrodes H01L21/311, H01L21/3213; multistep manufacturing processes for data storage electrodes H01L29/4011
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 21/67225 comprising at least one lithography chamber lithographic apparatuses G03F7/00
• CPC Class Codes: H10B 43/27 the channels comprising vertical portions, e.g. U-shaped channels
• CPC Class Codes: H10B 43/30 characterised by the memory core region

Abstract

Methods of selectively etching tungsten from the surface of a patterned substrate are described. The etch electrically separates vertically arranged tungsten slabs from one another as needed, for example, in the manufacture of vertical flash memory devices. The tungsten etch may selectively remove tungsten relative to films such as silicon, polysilicon, silicon oxide, aluminum oxide, titanium nitride and silicon nitride. The methods include exposing electrically-shorted tungsten slabs to remotely-excited fluorine formed in a capacitively-excited chamber plasma region. The methods then include exposing the tungsten slabs to remotely-excited fluorine formed in an inductively-excited remote plasma system. A low electron temperature is maintained in the substrate processing region during each operation to achieve high etch selectivity.

Claims

1. A method of etching a patterned substrate, the method comprising:

placing the patterned substrate in a substrate processing region of a substrate processing chamber, wherein the patterned substrate comprises electrically-shorted tungsten slabs arranged in at least one of two adjacent vertical columns, wherein a trench is disposed between the two adjacent vertical columns;

flowing a first fluorine-containing precursor into a chamber plasma region within the substrate processing chamber and exciting the first fluorine-containing precursor in a first remote plasma in the chamber plasma region to produce first plasma effluents, wherein the chamber plasma region is fluidly coupled with the substrate processing region through a showerhead and the first remote plasma is capacitively-coupled;

flowing the first plasma effluents into the substrate processing region through the showerhead and isotropically etching the electrically-shorted tungsten slabs;

flowing a second fluorine-containing precursor into a remote plasma system outside the substrate processing chamber and exciting the second fluorine-containing precursor in a second remote plasma with an external remote plasma power in the remote plasma system to produce second plasma effluents,

wherein the second remote plasma is inductively-coupled with the external remote plasma power of between 2,000 watts and 10,000 watts;

flowing the second plasma effluents into the substrate processing region; and

anisotropically etching additional tungsten material.

2. The method of claim 1 wherein isotropically etching the electrically-shorted tungsten slabs leaves a tungsten residue at the top of the at least one of two adjacent vertical columns and anisotropically etching additional tungsten material removes the tungsten residue from the top of the at least one of two adjacent vertical columns.

3. The method of claim 1 wherein isotropically etching the electrically-shorted tungsten slabs in combination with anisotropically etching additional tungsten material electrically isolates the electrically-shorted tungsten slabs from one another to form electrically-isolated tungsten slabs.

4. The method of claim 1 wherein the first fluorine-containing precursor and the second fluorine-containing precursor each comprise at least one of atomic fluorine, diatomic fluorine, bromine trifluoride, chlorine trifluoride, nitrogen trifluoride, hydrogen fluoride, fluorinated hydrocarbons, sulfur hexafluoride and xenon difluoride.

5. The method of claim 1 wherein an aspect ratio of the trench is at least ten.

6. The method of claim 1 wherein the at least one of the two adjacent vertical columns comprise at least fifty tungsten slabs.

7. The method of claim 1 wherein a depth of the trench is greater than one micron.

8. The method of claim 1 wherein a temperature of the patterned substrate is maintained at between 0°

C. and about 60°

C. during isotropically etching the electrically-shorted tungsten slabs and anisotropically etching additional tungsten material.

9. The method of claim 1 wherein the electrically-shorted tungsten slabs consist of tungsten and a barrier layer.

10. The method of claim 1 wherein flowing the first plasma effluents into the substrate processing region occurs before flowing the second plasma effluents into the substrate processing region.

11. A method of etching a patterned substrate, the method comprising:

placing the patterned substrate in a substrate processing region of a substrate processing chamber, wherein the patterned substrate comprises electrically-shorted tungsten slabs arranged in at least one of two adjacent vertical columns, wherein a trench is disposed between the two adjacent vertical columns;

flowing a fluorine-containing precursor into a remote plasma system outside the substrate processing chamber and exciting the fluorine-containing precursor with an external remote plasma power in an external remote plasma in the remote plasma system to produce intermediate plasma effluents, wherein the external remote plasma is inductively-coupled with the external remote plasma power of between 2,000 watts and 10,000 watts;

flowing the intermediate plasma effluents into a chamber plasma region within the substrate processing chamber and exciting the intermediate plasma effluents in an internal remote plasma in the chamber plasma region to produce plasma effluents, wherein the chamber plasma region is fluidly coupled with the substrate processing region through a showerhead;

flowing the plasma effluents into the substrate processing region through the showerhead and selectively etching the electrically-shorted tungsten slabs, wherein selectively etching the electrically-shorted tungsten slabs electrically isolates the electrically-shorted tungsten slabs from one another to form electrically-isolated tungsten slabs.

12. The method of claim 11 wherein the internal remote plasma is capacitively-coupled with an internal remote plasma power of between 25 watts and 1,500 watts.

13. The method of claim 11 wherein an electron temperature in the substrate processing region while selectively etching the electrically-shorted tungsten slabs is below 0.5 eV.