Signal processing platform in an acoustic capture device

• US 9,554,214 B2
• Filed: 07/09/2015
• Issued: 01/24/2017
• Est. Priority Date: 10/02/2014
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Nielsen, John, Mortensen, Anders Svava, Larsen, Rene Rye, Popper, Robert A., Nandy, Dibyendu, Midtgaard, Jacob
• Primary Examiner(s): Mei, Xu
• Application Number:
  US14/795,305
• Publication Number:
  US 20160100257A1
• Time in Patent Office: 565 Days
• Field of Search: 381/55, 381/91, 381/92, 381/95, 381111-114, 381/122, 381/173, 381/175, 381/189, 381/190, 381/355, 381/369, 381/393, 381/396, 257/416, 257/419
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: H04R 1/005 using digitally weighted transducing elements
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 23/00 Transducers other than those covered by groups H04R9/00 - H04R21/00 diaphragms for transducers of the distributed-mode type H04R7/045
• CPC Class Codes: H04R 3/007 Protection circuits for transducers

Abstract

A microphone includes a base, a micro electro mechanical system (MEMS) device disposed on the base, and a front end processing apparatus disposed on the base and coupled to the MEMS device, the front end processing apparatus being configured to convert analog signals received from the MEMS device into digital signals. The microphone also includes a DSP apparatus, the DSP apparatus being a digital programmed device with a computer memory, the DSP apparatus configured to process the digital signals received from the front end processing apparatus. The MEMS device, the front end processing apparatus, and DSP apparatus are enclosed within a single microphone enclosure or assembly. During operation the DSP apparatus generates DSP noise. The DSP apparatus includes a noise reduction structure that substantially prevents the DSP noise from reaching or interfering with the operation of the MEMS device or the front end processing apparatus.

Claims

1. A microphone, the microphone comprising:

a base;

a micro electro mechanical system (MEMS) device disposed on the base;

a front end processing apparatus disposed on the base and coupled to the MEMS device, the front end processing apparatus configured to convert analog signals received from the MEMS device into digital signals; and

a DSP apparatus coupled to the front end processing apparatus, the DSP apparatus being a digital programmed device with a computer memory, the DSP apparatus configured to process the digital signals received from the front end processing apparatus,

wherein the MEMS device, the front end processing apparatus, and DSP apparatus are enclosed within a single microphone enclosure or assembly,

wherein during operation the DSP apparatus generates DSP noise,

wherein the DSP apparatus includes a noise reduction structure that reduce an amount of the generated DSP noise from reaching or interfering with the operation of the MEMS device or the front end processing apparatus, and

wherein the DSP apparatus has multiple layers of materials including a top layer and the noise reduction apparatus is disposed above the top layer.

2. The microphone of claim 1, further comprising a chip disposed on the base and coupled to the MEMS device, and the DSP apparatus and the front end processing apparatus being disposed at the chip.

3. The microphone of claim 1, further comprising a first chip and a second chip, the first chip and the second chip being disposed on the base and coupled to the MEMS device, and the DSP apparatus disposed at the first chip and the front end processing apparatus being disposed at the second chip.

4. The microphone of claim 3, wherein first chip is disposed on top of the second chip.

5. The microphone of claim 1, wherein the noise reduction structure comprises a Faraday cage.

6. The microphone of claim 1, wherein the noise reduction apparatus is connected to a low noise ground, and wherein the DSP apparatus further comprises digital components, the digital components being coupled to a digital ground.

7. The microphone of claim 1, further comprising a cover configured to cover the MEMS device and the DSP apparatus.

8. A microphone, the microphone comprising:

a base;

a micro electro mechanical system (MEMS) device disposed on the base;

a front end processing apparatus disposed on the base and coupled to the MEMS device, the front end processing apparatus configured to convert analog signals received from the MEMS device into digital signals; and

a DSP apparatus coupled to the front end processing apparatus, the DSP apparatus being a digital programmed device with a computer memory, the DSP apparatus configured to process the digital signals received from the front end processing apparatus,

wherein the MEMS device, the front end processing apparatus, and DSP apparatus are enclosed within a single microphone enclosure or assembly,

wherein during operation the DSP apparatus generates DSP noise,

wherein the DSP apparatus includes multiple layers including a top layer, and a shield disposed above the top layer of the DSP apparatus and is configured to reduce the amount of the generated DSP noise from reaching or interfering with the operation of the MEMS device or the front end processing apparatus, and

wherein the DSP apparatus is constructed of different layers, and wherein the shield is connected to a low noise ground, and wherein the DSP apparatus further comprises digital components, the digital components being coupled to a digital ground.

wherein the DSP apparatus is constructed of different layers, and wherein the noise reduction apparatus is connected to a low noise ground, and wherein the DSP apparatus further comprises digital components, the digital components being coupled to a digital ground.

9. The microphone of claim 8, further comprising a chip disposed on the base and coupled to the MEMS device, and the DSP apparatus and the front end processing apparatus being disposed at the chip.

10. The microphone of claim 8, further comprising a first chip and a second chip, the first chip and the second chip being disposed on the base and coupled to the MEMS device, and the DSP apparatus disposed at the first chip and the front end processing apparatus being disposed at the second chip.

11. The microphone of claim 10, wherein first chip is disposed on top of the second chip.

12. The microphone of claim 10, further comprising a cover that covers the MEMS device and the DSP apparatus.

13. The microphone of claim 8, wherein the noise reduction structure comprises a Faraday cage.

14. A microphone, the microphone comprising:

a base;

a micro electro mechanical system (MEMS) device disposed on the base;

a front end processing apparatus disposed on the base and coupled to the MEMS device, the front end processing apparatus configured to convert analog signals received from the MEMS device into digital signals;

a DSP apparatus coupled to the front end processing apparatus, the DSP apparatus being a digital programmed device with a computer memory, the DSP apparatus configured to process the digital signals received from the front end processing apparatus;

wherein the MEMS device, the front end processing apparatus, and DSP apparatus are enclosed within a single microphone enclosure or assembly;

wherein during operation the DSP apparatus generates DSP noise;

wherein the DSP apparatus includes a Faraday cage, at least a portion of which is disposed above a top layer of the DSP apparatus and is configured to reduce an amount of the generated DSP noise from reaching or interfering with the operation of the MEMS device or the front end processing apparatus;

wherein the DSP apparatus is constructed of different layers, and wherein the Faraday cage is connected to a low noise ground, and wherein the DSP apparatus further comprises digital components, the digital components being coupled to a digital ground.

15. The microphone of claim 14, further comprising a chip disposed on the base and coupled to the MEMS device, and the DSP apparatus and the front end processing apparatus being disposed at the chip.

16. The microphone of claim 14, further comprising a first chip and a second chip, the first chip and the second chip being disposed on the base and coupled to the MEMS device, and the DSP apparatus disposed at the first chip and the front end processing apparatus being disposed at the second chip.

17. The microphone of claim 16, wherein first chip is disposed on top of the second chip.

18. The microphone of claim 16, further comprising a cover that covers the MEMS device and the DSP apparatus.