Apparatus and method of environmental condition management for electronic equipment

• US 9,554,490 B2
• Filed: 06/09/2014
• Issued: 01/24/2017
• Est. Priority Date: 12/04/2008
• Status: Expired due to Fees

• Current Assignee: Baselayer Technology, LLC
• Original Assignee: Baselayer Technology, LLC
• Inventors: Slessman, George
• Primary Examiner(s): Jones, Melvin
• Application Number:
  US14/299,952
• Publication Number:
  US 20140287671A1
• Time in Patent Office: 960 Days
• Field of Search: 621/32, 622/592, 165/80.2, 165/80.3, 165/104.33, 361/699, 361/700
• US Class Current: 1/1
• CPC Class Codes: F28F 9/0265 by using guiding means or impingement means inside the header box
• CPC Class Codes: F28F 9/028 by using inserts for modifying the pattern of flow inside the header box, e.g. by using flow restrictors or permeable bodies or blocks with channels
• CPC Class Codes: H05K 7/1497 Rooms for data centers; Shipping containers therefor
• CPC Class Codes: H05K 7/20554 Forced ventilation of a gaseous coolant in closed loop H05K7/206 or H05K7/20609 or H05K7/20618
• CPC Class Codes: H05K 7/20745 within rooms for removing heat from cabinets, e.g. by air conditioning device
• CPC Class Codes: H05K 7/20763 Liquid cooling without phase change
• CPC Class Codes: H05K 7/20836 Thermal management, e.g. server temperature control

Abstract

A control system for providing thermal management of electronic equipment housed in a cabinet enclosure. The system can include a plurality of sensors in proximity to the cabinet enclosure for monitoring a temperature, a pressure and a humidity associated with the electronic equipment; and a controller in communication with the sensors for receiving data from the sensors, where the controller adjusts the temperature, the pressure and the humidity associated with the electronic equipment.

Claims

1. A system for providing thermal management of electronic equipment, the system comprising:

a cabinet forming an enclosure for the electronic equipment, wherein the cabinet has an inlet and an outlet, wherein the inlet is in proximity to a bottom portion of the cabinet, and wherein the outlet is in proximity to a top portion of the cabinet;

a supply channel connected with the cabinet inlet, wherein the cabinet is positioned on a floor and the supply channel is under the floor;

an exhaust channel connected with the cabinet outlet;

one or more plenums in fluid communication with at least one of the supply and exhaust channels, wherein the plenums have a pressure source for generating a pressure differential through the enclosure of the cabinet causing air to flow therethrough;

one or more sensors in proximity to the cabinet for monitoring at least one of a temperature, pressure and humidity associated with operation of the electronic equipment; and

a controller in communication with the sensors for receiving data from the sensors, wherein the controller adjusts at least one of the temperature, the pressure and the humidity associated with the operation of the electronic equipment.

2. The system according to claim 1, further comprising a cooling coil positioned under the floor and in thermal contact with the supply channel, wherein a coolant flows through the cooling coil to remove heat from the air flowing through the supply channel.

3. The system according to claim 1, wherein the plenums are positioned under the floor.

4. The system according to claim 3, wherein the pressure source is a fan and wherein the controller is configured to provide control signals to the fan to adjust the pressure.

5. The system according to claim 1, wherein the enclosure of the cabinet is separated into temperature zones comprising at least a cold zone and a hot zone, wherein at least one baffle is provided to create the temperature zones such that air is directed to flow from the cold zone through an electronic component storage area to the hot zone, and wherein the at least one baffle comprises a thermal management plate that is positioned horizontally in the cabinet above the electronic component storage area.

6. The system according to claim 1, further comprising a damper connected with the supply channel, wherein the damper has a damper actuator connected thereto, wherein the damper can be opened and closed based on signals transmitted from the controller to the damper actuator.

7. The system according to claim 1, further comprising a dehumidifier in fluid communication with at least one of the supply and exhaust channels for adjusting humidity of the air flowing through the enclosure of the cabinet.

8. The system according to claim 1, wherein the controller adjusts the temperature, the pressure and the humidity associated with the electronic equipment in real time.

9. The system according to claim 1, wherein the controller is configured to adjust the at least one of the temperature, the pressure and the humidity based on the monitored at least one of the temperature, the pressure and the humidity from the at least one sensor.

10. The system according to claim 1, further comprising a dehumidifier coupled to the controller, wherein the controller is configured to provide control signals to the dehumidifier to control the humidity.

11. The system according to claim 1, further comprising a cooling subsystem, a damper, and a dehumidifier coupled to the controller, wherein the pressure source includes a fan, and wherein the controller is configured to independently control the temperature, the pressure, and the humidity by sending control signals to one or more of the cooling subsystem, the damper, the dehumidifier, and the fan.

12. The system according to claim 11, wherein the controller is configured to collect temperature data associated with an operation of the electronic equipment and utilization data associated with the operation of the electronic equipment to form historical data, the utilization data comprising information about the operation of the electronic equipment over time.

13. The system according to claim 12, wherein the controller is configured to adjust the temperature associated with the operation of the electronic equipment based on the historical data.

14. The system according to claim 12, wherein the controller is configured to adjust the temperature associated with the operation of the electronic equipment based on an anticipated utilization of the electronic equipment determined at least in part from the historical data, wherein the controller is configured to lower the temperature associated with the operation of the electronic equipment when the anticipated utilization of the electronic equipment corresponds to an increase in temperature.

15. The system according to claim 11, wherein the controller is configured to collect efficiency data corresponding to adjustment techniques for adjusting the temperature associated with the operation of the electronic equipment, and wherein the efficiency data comprises an elapsed time of each of the adjustment techniques, an amount of power utilized by each of the adjustment techniques, or a combination thereof.

16. The system according to claim 15, wherein the adjustment techniques include a first technique and a second technique to decrease the temperature associated with the operation of the electronic equipment, the first technique including adjusting the pressure with the fan and the second technique including adjusting the temperature with the cooling subsystem, and

wherein the controller is configured to select between the first technique and the second technique to achieve the decrease in temperature based on the efficiency data.

17. The system according to claim 1, wherein the controller is configured to adjust the temperature based on a time of day.

18. The system according to claim 1, wherein the controller is configured to adjust the temperature based on a historical usage of the electronic equipment.