Anode for electroplating and method for electroplating using anode

• US 9,556,534 B2
• Filed: 08/13/2012
• Issued: 01/31/2017
• Est. Priority Date: 09/13/2011
• Status: Active Grant

• Current Assignee: Doshisha Company Limited
• Original Assignee: Doshisha Company Limited
• Inventors: Morimitsu, Masatsugu
• Primary Examiner(s): Wong, Edna
• Application Number:
  US14/344,675
• Publication Number:
  US 20150027899A1
• Time in Patent Office: 1,632 Days
• Field of Search: 205/261, 205/263, 205/264, 205/265, 205/269, 205/271, 205/283, 205/291, 205/299, 205/300, 205/305, 205/80, 205/238
• US Class Current: 1/1
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 17/10 Electrodes , e.g. composition, counter electrode

Abstract

Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate.

Claims

1. A method for electroplating which comprises electroplating a desired metal present in an aqueous electrolytic solution onto a cathode with an anode comprising a conductive substrate and a catalytic layer formed on the conductive substrate, and the catalytic layer is composed of amorphous ruthenium oxide and amorphous tantalum oxide and does not contain IrO₂.

2. The method for electroplating according to claim 1, wherein the desired metal is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

3. The method for electroplating according to claim 1, wherein a mole ratio of ruthenium to tantalum in the catalytic layer is 50:

50.

4. The method for electroplating according to claim 3, wherein the desired metal is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

5. The method for electroplating according to claim 1, wherein the anode further comprises an intermediate layer formed between the catalytic layer and the conductive substrate.

6. The method for electroplating according to claim 5, wherein the intermediate layer contains crystalline iridium oxide and amorphous tantalum oxide.

7. The method for electroplating according to claim 6, wherein the desired metal is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

8. The method for electroplating according to claim 5, wherein the desired metal is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

9. The method for electroplating according to claim 1, wherein the catalytic layer consists of amorphous ruthenium oxide and amorphous tantalum oxide.