Sonic sensors and packages

• US 9,557,417 B2
• Filed: 12/15/2015
• Issued: 01/31/2017
• Est. Priority Date: 10/05/2011
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Elian, Klaus, Theuss, Horst
• Primary Examiner(s): Ratcliffe, Luke
• Assistant Examiner(s): Baghdasaryan, Hovhannes
• Application Number:
  US14/969,848
• Publication Number:
  US 20160103219A1
• Time in Patent Office: 413 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: G01S 15/08 Systems for measuring distance only indirect measurement G01S15/46
• CPC Class Codes: G01S 15/10 using transmission of interrupted, pulse-modulated waves determination of distance by phase measurement G01S15/32
• CPC Class Codes: G01S 7/521 Constructional features
• CPC Class Codes: G10K 11/004 Mounting transducers, e.g. provided with mechanical moving or orienting device mountings specially adapted to a particular sound-producing device, see the preceding groups G10K1/00 - G10K9/00, e.g. G10K1/26, G10K1/28, G10K9/22; arrangements of sonic watch equipment on submarines B63G8/39; buoys B63B22/00
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H10N 30/2047 Membrane type
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings

Abstract

Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.

Claims

1. A method comprising:

providing an integrated sensor including a transmitter, a microelectromechanical (MEMS) microphone and driver electronics, the MEMS microphone and the driver electronics being integrated in a housing and disposed on a surface of the housing, wherein the integrated sensor further includes a cover disposed on the housing opposite the surface of the housing, the cover comprising a piezoelectric element of the transmitter;

transmitting a signal using the piezoelectric element of the transmitter;

receiving a reflected signal by the MEMS microphone through an aperture in the cover; and

determining a time of flight of the signal.

2. The method of claim 1, further comprising determining a distance, from the integrated sensor, of an object reflecting the signal from the time of flight of the signal.

3. The method of claim 1, wherein transmitting a signal comprises transmitting one of an ultrasonic signal, a supersonic signal, a sonar signal or a radar signal.

4. The method of claim 1, further comprising forming the housing with a transmitter portion having a transmitter portion cover comprising the piezoelectric element and a receiver portion having a receiver portion cover.

5. The method of claim 4, wherein forming the housing further comprises forming the piezoelectric element from at least one of metal, ceramic, plastic or foil.

6. The method of claim 4, wherein forming the housing further comprises forming the receiver portion cover from metal.

7. The method of claim 1, further comprising mounting the integrated sensor in a vehicle.

8. The method of claim 7, wherein the vehicle is selected from the group consisting of an automobile, a bicycle, an electric bicycle, a scooter, a SEGWAY, construction equipment and a boat.

9. The method of claim 1, further comprising mounting the integrated sensor in one of a mobile phone or a gaming system.

10. The method of claim 1, further comprising mounting the sensor in a gaming system, wherein the gaming system is one of a handheld gaming system or a console gaming system.

11. The method of claim 1, further comprising:

forming the aperture in the cover such that the aperture is formed opposite the surface of the housing and opposite the MEMS microphone disposed on the surface of the housing.

12. The method of claim 1, wherein the cover comprises a multilayered structure, the piezoelectric element being a piezoelectric layer formed as a layer of the multilayered structure of the cover.

13. The method of claim 4, wherein the transmitter portion is a different portion of the housing from the receiver portion of the housing.