Wireless IC device

• US 9,558,440 B2
• Filed: 07/15/2014
• Issued: 01/31/2017
• Est. Priority Date: 07/18/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ikemoto, Nobuo, Dokai, Yuya, Kato, Noboru
• Primary Examiner(s): ELLIS, SUEZU Y
• Application Number:
  US14/331,337
• Publication Number:
  US 20140319224A1
• Time in Patent Office: 931 Days
• Field of Search: 235/492, 340/10.1, 340/572.1, 340/572.5, 340/572.7
• US Class Current: 1/1
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/20 Two collinear substantially straight active elements; Substantially straight single active elements H01Q9/28 takes precedence
• CPC Class Codes: H04B 5/22 Capacitive coupling

Abstract

An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.

Claims

1. A wireless integrated circuit (IC) device comprising:

a wireless IC chip including first and second IC terminals;

a radiation plate including first and second radiation terminals arranged on a base material, the first radiation terminal being connected to the first IC terminal, and the second radiation terminal being connected to the second IC terminal; and

a functional substrate including a matching circuit including first and second inductance elements disposed inside the functional substrate, the wireless IC chip being mounted on the functional substrate so as to define a module, and the module being mounted on the base material so as to connect the wireless IC chip with the radiation plate via the matching circuit;

wherein

a first end of the first inductance element is connected to one of the first or second IC terminals and a second end of the first inductance element is connected to one of the first or second radiation terminals;

a first end of the second inductance element is connected to the first radiation terminal and a second end of the second inductance element is connected to the second radiation terminal; and

the matching circuit is configured such that a relationship between a reactance component of an impedance obtained by viewing the wireless IC chip from a connecting portion connecting the wireless IC chip and the functional substrate to each other and a reactance component of an impedance obtained by viewing the radiation plate from the connecting portion connecting the wireless IC chip and the functional substrate to each other is a conjugate relationship.

2. The wireless IC device according to claim 1, wherein the functional substrate includes a multilayer substrate including laminated dielectric layers on which electrode patterns are provided.

3. The wireless IC device according to claim 1, wherein the matching circuit includes an element included in the functional substrate and an element mounted on the functional substrate.

4. The wireless IC device according to claim 1, further comprising a protection film covering at least one of the wireless IC chip, the functional substrate, and the radiation plate.

5. The wireless IC device according to claim 1, wherein the matching circuit is electromagnetically coupled to the radiation plate.

6. The wireless IC device according to claim 1, wherein

the radiation plate has an elongated configuration;

the matching circuit includes first and second external coupling electrodes that individually occupy two areas divided from the functional substrate; and

one end of the radiation plate is coupled to the first external coupling electrode and another end of the radiation plate is coupled to the second external coupling electrode.

7. The wireless IC device according to claim 6, wherein

the radiation plate is a loop-shaped radiation plate arranged such that both ends of the radiation plate face each other;

a first one of the both ends of the radiation plate is coupled to the first external coupling electrode; and

a second one of the both ends of the radiation plate is coupled to the second external coupling electrode.

8. The wireless IC device according to claim 6, further comprising an auxiliary matching circuit portion including a matching electrode;

the radiation plate includes a first radiation electrode and a second radiation electrode;

the first radiation electrode includes a first internal end, the second radiation electrode includes a second internal end, and the first internal end and the second internal end are provided adjacent to each other;

the matching electrode is connected to the first radiation electrode at a point adjacent to the first internal end;

the matching electrode is connected to the second radiation electrode at a point adjacent to the second internal end; and

the auxiliary matching circuit portion further includes a portion of the first radiation electrode from the first internal end to the point connected with the matching electrode and a portion of the second radiation electrode from the second internal end to the point connected with the matching electrode.

9. The wireless IC device according to claim 1, wherein

the first and second inductance elements are loop-shaped inductance elements;

and

winding axes of the loop-shaped first and second inductance elements cross an area in which the radiation plate is located.

10. The wireless IC device according to claim 1, wherein the matching circuit includes a capacitive coupling electrode that faces the radiation plate and is capacitively coupled to the radiation plate.

11. The wireless IC device according to claim 10, wherein

the capacitive coupling electrode is provided on a surface of the functional substrate facing the radiation plate;

and

the functional substrate is attached to the radiation plate so that the capacitive coupling electrode and the radiation plate face each other.

12. The wireless IC device according to claim 10, wherein the capacitive coupling electrode included in the functional substrate extends to a surface other than the surface of the functional substrate facing the radiation plate.