Vapor compression refrigeration chuck for ion implanters
First Claim
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1. An ion implantation system comprising:
- a beamline assembly configured to steer an ion beam from an ion source towards an electrostatic chuck, wherein the electrostatic chuck includes an engagement region adapted to selectively retain a workpiece for implantation by the ion beam;
a compressor configured to receive vapor-phase refrigerant fluid from the electrostatic chuck and compress the vapor-phase refrigerant fluid to provide a compressed refrigerant fluid;
a condenser configured to condense the compressed refrigerant fluid to provide a condensed refrigerant fluid; and
a supply conduit to transport the condensed refrigerant fluid from the condenser to the electrostatic chuck, wherein the electrostatic chuck includes a cavity or recess to expand and vaporize the condensed refrigerant fluid to cool the engagement region of the electrostatic chuck, and wherein the cavity or recess comprises;
a flow restrictor which is defined in a body of the electrostatic chuck; and
a cooling channel which is disposed in the body of the electrostatic chuck and which is downstream of the flow restrictor, wherein the flow restrictor comprises;
first and second distal flow restrictor regions having respective sidewalls separated by a first flow restrictor width, wherein the first distal flow restrictor region is proximate to the supply conduit and the second distal flow restrictor region is proximate to the cooling channel; and
a central flow restrictor region separating the first and second distal flow restrictor regions and having sidewalls separated by a second flow restrictor width that is greater than the first flow restrictor width.
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Abstract
Aspects of the present invention relate to ion implantation systems that make use of a vapor compression cooling system. In one embodiment, a thermal controller in the vapor compression system sends refrigeration fluid though a compressor and a condenser according to an ideal vapor compression cycle to help limit or prevent undesired heating of a workpiece during implantation, or to actively cool the workpiece.
41 Citations
17 Claims
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1. An ion implantation system comprising:
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a beamline assembly configured to steer an ion beam from an ion source towards an electrostatic chuck, wherein the electrostatic chuck includes an engagement region adapted to selectively retain a workpiece for implantation by the ion beam; a compressor configured to receive vapor-phase refrigerant fluid from the electrostatic chuck and compress the vapor-phase refrigerant fluid to provide a compressed refrigerant fluid; a condenser configured to condense the compressed refrigerant fluid to provide a condensed refrigerant fluid; and a supply conduit to transport the condensed refrigerant fluid from the condenser to the electrostatic chuck, wherein the electrostatic chuck includes a cavity or recess to expand and vaporize the condensed refrigerant fluid to cool the engagement region of the electrostatic chuck, and wherein the cavity or recess comprises; a flow restrictor which is defined in a body of the electrostatic chuck; and a cooling channel which is disposed in the body of the electrostatic chuck and which is downstream of the flow restrictor, wherein the flow restrictor comprises; first and second distal flow restrictor regions having respective sidewalls separated by a first flow restrictor width, wherein the first distal flow restrictor region is proximate to the supply conduit and the second distal flow restrictor region is proximate to the cooling channel; and a central flow restrictor region separating the first and second distal flow restrictor regions and having sidewalls separated by a second flow restrictor width that is greater than the first flow restrictor width. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An ion implantation system comprising:
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an ion source configured to provide an ion beam; a beamline assembly configured to steer the ion beam from the ion source towards an electrostatic chuck, wherein the electrostatic chuck includes a body made up of first and second plates; a clamping control system operably coupled to the first plate and configured to selectively retain a workpiece on an engagement region of the first plate; and a vapor compression cooling system operably coupled to the second plate and including one or more cooling channels in the second plate in which a vapor phase refrigerant is provided to cool the engagement region and thereby cool the workpiece, wherein the vapor compression cooling system comprises; a compressor configured to receive vapor-phase refrigerant fluid from the electrostatic chuck and compress the vapor-phase refrigerant fluid to provide a compressed refrigerant fluid; a condenser configured to condense the compressed refrigerant fluid to provide a condensed refrigerant fluid; and a supply conduit to transport the condensed refrigerant fluid from the condenser to the electrostatic chuck, wherein the electrostatic chuck includes a flow restrictor and cooling channel defined in a body thereof, wherein the flow restrictor and cooling channel expand the condensed refrigerant fluid to vapor-phase to cool the engagement region of the electrostatic chuck, and wherein the flow restrictor comprises; first and second distal flow restrictor regions having respective sidewalls separated by a first flow restrictor width, wherein the first distal flow restrictor region is proximate to the supply conduit and the second distal flow restrictor region is proximate to the cooling channel; and a central flow restrictor region separating the first and second distal flow restrictor regions and having sidewalls separated by a second flow restrictor width that is greater than the first flow restrictor width. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method comprising:
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placing a workpiece on an engagement region of an electrostatic chuck; receiving vapor-phase refrigerant fluid at a first temperature from the electrostatic chuck and compressing the vapor-phase refrigerant fluid to provide a compressed refrigerant fluid; condensing the compressed refrigerant fluid to provide a condensed refrigerant fluid; transporting the condensed refrigerant fluid to the electrostatic chuck; and cooling the engagement region of the electrostatic chuck by expanding the condensed refrigerant fluid within the electrostatic chuck to vaporize the condensed refrigerant to exhibit a second temperature, which is less than the first temperature, wherein the condensed refrigerant fluid is vaporized within the electrostatic chuck via a flow restrictor that is defined within a body of the electrostatic chuck. - View Dependent Claims (15, 16, 17)
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Specification