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Passive component as thermal capacitance and heat sink

  • US 9,559,047 B2
  • Filed: 10/18/2012
  • Issued: 01/31/2017
  • Est. Priority Date: 10/18/2012
  • Status: Active Grant
First Claim
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1. A system, comprising:

  • a printed circuit board (PCB) including at least a first layer and a second layer;

    a chip die disposed between the first layer and the second layer;

    a first passive component strategically located on an outer surface of one of the first layer or the second layer, and arranged to conduct heat generated by the chip die away from the chip die, the first passive component overlapping a portion of the chip die; and

    a second passive component strategically located on an outer surface of the other one of the first layer and the second layer of the PCB, and arranged to conduct heat generated by the chip die away from the chip die.

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