Passive component as thermal capacitance and heat sink
First Claim
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1. A system, comprising:
- a printed circuit board (PCB) including at least a first layer and a second layer;
a chip die disposed between the first layer and the second layer;
a first passive component strategically located on an outer surface of one of the first layer or the second layer, and arranged to conduct heat generated by the chip die away from the chip die, the first passive component overlapping a portion of the chip die; and
a second passive component strategically located on an outer surface of the other one of the first layer and the second layer of the PCB, and arranged to conduct heat generated by the chip die away from the chip die.
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Accused Products
Abstract
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.
5 Citations
18 Claims
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1. A system, comprising:
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a printed circuit board (PCB) including at least a first layer and a second layer; a chip die disposed between the first layer and the second layer; a first passive component strategically located on an outer surface of one of the first layer or the second layer, and arranged to conduct heat generated by the chip die away from the chip die, the first passive component overlapping a portion of the chip die; and a second passive component strategically located on an outer surface of the other one of the first layer and the second layer of the PCB, and arranged to conduct heat generated by the chip die away from the chip die. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A system, comprising:
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a multi-layer printed circuit board (PCB) including a plurality of layers; a chip die embedded within the PCB, between two layers of the plurality of layers; a first passive circuit component strategically located on an outer surface of one of the two layers of the plurality of layers, and arranged to conduct heat generated by the chip die away from the chip die, the first passive circuit component overlapping a portion of the chip die; and a second passive circuit component strategically located on an outer surface of the other one of the two layers of the plurality of layers of the PCB, and arranged to conduct heat generated by the chip die away from the chip die. - View Dependent Claims (9, 10, 11, 12)
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13. A system, comprising:
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a printed circuit board (PCB) including at least a first layer and a second layer; a chip die disposed between the first layer and the second layer; a first passive component strategically located on an outer surface of one of the first layer or the second layer, and arranged to conduct heat generated by the chip die away from the chip die, the first passive component overlapping a portion of the chip die; and a plurality of passive components strategically located on the outer surface of the first layer or the second layer of the PCB, each of the plurality of passive components overlapping a portion of the chip die. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification