Virtualized physical layer adapted for EHF contactless communication

• US 9,559,753 B2
• Filed: 03/12/2014
• Issued: 01/31/2017
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: McCormack, Gary D, Kyles, Ian A, Isaac, Roger D
• Primary Examiner(s): Yun, Eugene
• Application Number:
  US14/205,658
• Publication Number:
  US 20140273852A1
• Time in Patent Office: 1,056 Days
• Field of Search: 455/41.2
• US Class Current: 1/1
• CPC Class Codes: H04B 5/20 characterised by the transmission technique; characterised by the transmission medium
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer
• CPC Class Codes: H04W 76/10 Connection setup
• CPC Class Codes: H04W 76/14 Direct-mode setup

Abstract

A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

Claims

1. An electronic device comprising:

a host system (Host IC) operating with an Open Systems Interconnection (OSI) network architecture comprising a Physical Layer (PHY) and a first Standards-based Data Link Layer (LINK); and

an EHF contactless EHF IC (EHF IC) comprising at least one transceiver (EHF-XCVR) and capable of communicating over an EHF contactless link transmission medium with another electronic device;

characterized by;

the PHY layer (PHY) comprises at least one virtualized contactless link-based Physical Layer (VcPHY) comprising;

a contactless Physical Layer (Host-cPHY) which is adapted to implement interface specifications and medium requirements for sending and receiving signals over the EHF contactless link via the EHF contactless EHF IC (EHF IC); and

a second Link Layer (cLINK) for coupling the first Standards-based Link Layer (LINK) with the contactless Physical Layer (Host-cPHY).

2. The device of claim 1, wherein:

the second Link Layer (cLINK) comprises a functionality that is directed towards the contactless link.

3. The device of claim 2, wherein:

the second Link Layer (cLINK) comprises a functionality that is directed towards the electrical connection between the host system and the EHF IC.

4. The device of claim 1, wherein:

the second Link Layer (cLINK) is operable to enable the first Link Layer (LINK) to communicate with the virtualized contactless link-based PHY (VcPHY) as though the VcPHY is a Physical Layer implementation from a corresponding Standards'"'"' specification.

5. The device of claim 4, wherein the Standards'"'"' specification is selected from the group consisting of Display Port, HDMI, PCIe and USB.

6. The device of claim 1, wherein the first and the second Link Layers have at least one function in common.

7. The device of claim 1, wherein the second Link Layer (cLINK) is operable to perform at least one of discovering, configuring and maintenance functions that are directed towards enabling and maintaining a contactless link.

8. The device of claim 1, wherein the second Link Layer (cLINK) is operable to perform at least one of polling, beaconing and security verification functions.

9. The device of claim 1, wherein the first conventional Link Layer (LINK) is operable to perform beaconing or listening for the EHF contactless link, and is operable to configure the link parameters of at least a segment of the path that couples the first conventional Link Layer and the contactless EHF IC.

10. The device of claim 1, wherein the second Link Layer (cLINK) is operable to configure the link parameters of at least a segment of the path that couples the second Link Layer (cLINK) and the contactless EHF IC.

11. The device of claim 1, wherein the second Link Layer (cLINK) is operable to configure parameters of the contactless link.

12. The device of claim 1, wherein:

the first conventional Link Layer (LINK) is operable to direct a first set of link training operations for the contactless link.

13. The device of claim 1, wherein the electronic device comprises:

a plurality of LINKs;

a plurality of VcPHYs; and

a plurality of at least one transceivers (EHF-XCVR).

14. The device of claim 1, wherein the electronic device (1202) comprises:

a plurality of LINKs; and

a single VcPHY;

wherein a given one of the plurality of LINKs is selectively connected to the single VcPHY at a given time.

15. The device of claim 1, wherein the electronic device comprises:

multiple LINKs;

multiple VcPHYs; and

a switch routing data streams between the multiple LINKs and the multiple VcPHYs.

16. The device of claim 1, wherein the electronic device comprises:

multiple EHF ICs.

17. The device of claim 1, wherein the electronic device (FIG. 14, 1402) comprises:

one or more LINKs (1417) and an associated EHF IC (1406A); and

an Ethernet protocol stack (1421) and an associated EHF IC (1406B).

18. The device of claim 17, wherein the other electronic device comprises:

two EHF ICs;

a first host system having a first VcPHY; and

a second host system having a second VcPHY.

19. The device of claim 1, wherein:

the electronic device comprises at least two VcPHYs and associated at least two EHF ICs; and

the other electronic device comprises a network processor.

20. The device of claim 1, wherein:

the electronic device comprises at least two VcPHYs and associated at least two EHF ICs; and

the other electronic device comprises a switch.

21. The device of claim 1, wherein the other electronic device comprises a bridge chip.

22. A method of communicating between electronic devices over an EHF contactless communications link, at least one device having a host system and an EHF contactless EHF IC (EHF IC), characterized by:

providing at least one of the electronic devices with a virtualized contactless link-based Physical Layer (VcPHY) which is dedicated to EHF contactless communication over the EHF contactless communications link;

providing a contactless Physical Layer (Host-cPHY) within the virtualized contactless link-based Physical Layer (VcPHY) which is adapted to implement interface specifications and medium requirements for sending and receiving signals over the EHF contactless communications link; and

providing a contactless link-based Link Layer (cLINK) within the virtualized contactless link-based Physical Layer (VcPHY) that functionally couples a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY) in the virtualized contactless link-based Physical Layer (VcPHY).

23. The method of claim 22, wherein:

the contactless Link Layer (cLINK) provides (i) functionality directed towards the contactless link and (ii) functionality directed towards the electrical connection between the host system and the EHF IC.

24. The method of claim 22, further comprising:

positioning the contactless Link Layer (cLINK) functionally between the conventional Link Layer (LINK) and the contactless Physical Layer (Host-cPHY) to isolate the Link Layer (LINK) from the EHF contactless communications link.

25. A contactless communication device comprising:

a virtualized contactless link-based Physical Layer (VcPHY) which is adapted to implement interface specifications and medium requirements for sending and receiving signals over an EHF contactless communications link;

a first, conventional, Standards-based Link Layer (LINK) that directs a first set of link training operations for the contactless link;

a second Link Layer (cLINK) in the VcPHY that couples with the first Link Layer (LINK) that directs a second set of link training operations; and

an EHF IC capable of communicating over the contactless communications link.