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Virtualized physical layer adapted for EHF contactless communication

  • US 9,559,753 B2
  • Filed: 03/12/2014
  • Issued: 01/31/2017
  • Est. Priority Date: 03/15/2013
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a host system (Host IC) operating with an Open Systems Interconnection (OSI) network architecture comprising a Physical Layer (PHY) and a first Standards-based Data Link Layer (LINK); and

    an EHF contactless EHF IC (EHF IC) comprising at least one transceiver (EHF-XCVR) and capable of communicating over an EHF contactless link transmission medium with another electronic device;

    characterized by;

    the PHY layer (PHY) comprises at least one virtualized contactless link-based Physical Layer (VcPHY) comprising;

    a contactless Physical Layer (Host-cPHY) which is adapted to implement interface specifications and medium requirements for sending and receiving signals over the EHF contactless link via the EHF contactless EHF IC (EHF IC); and

    a second Link Layer (cLINK) for coupling the first Standards-based Link Layer (LINK) with the contactless Physical Layer (Host-cPHY).

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