Chip component mounting structure, and module component

• US 9,560,757 B2
• Filed: 05/21/2015
• Issued: 01/31/2017
• Est. Priority Date: 12/19/2012
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Murayama, Hiromi, Higashibata, Kazuaki, Kato, Noboru
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US14/718,367
• Publication Number:
  US 20150257266A1
• Time in Patent Office: 621 Days
• Field of Search: 257/728, 257/773, 257/786
• US Class Current: 1/1
• CPC Class Codes: G06K 19/0772 Physical layout of the record carrier
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 9/20 Two collinear substantially straight active elements; Substantially straight single active elements H01Q9/28 takes precedence
• CPC Class Codes: H05K 1/0259 Electrostatic discharge [ESD] protection
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/0295 adapted for choosing between different types or different locations of mounted components
• CPC Class Codes: H05K 1/03 Use of materials for the substrate
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/09427 Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10628 Leaded surface mounted device
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A chip component includes external terminals on a mounting surface thereof at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface. A substrate includes first and second mounting terminals on the mounting surface of the substrate at first diagonal positions of a square indicated by a two dot chain line, and third and fourth mounting terminals on the surface of the substrate at second diagonal positions of the square. The first and fourth mounting terminals are connected by a first terminal connecting portion, and the second and third mounting terminals are connected by a second terminal connecting portion. The chip component is configured to be mounted in any of four directions obtained by rotating the chip component every 90 degrees and achieves the same electrical characteristics.

Claims

1. A chip component mounting structure comprising:

a substrate including;

a first mounting terminal and a second mounting terminal that are arranged on a surface of the substrate at first diagonal positions of a square; and

a third mounting terminal and a fourth mounting terminal that are arranged on the surface of the substrate at second diagonal positions of the square;

a chip component including at least a pair of a first external terminal and a second external terminal that are arranged on a mounting surface of the chip component at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface;

at least a pair of a third external terminal and a fourth external terminal that are arranged on the mounting surface of the chip component at positions that are rotationally symmetric to each other by 180 degrees with respect to the center of the mounting surface of the chip component and that are rotationally symmetric to each other by 90 degrees with respect to the first external terminal and the second external terminal;

an external terminal that is arranged between two of the first external terminal, the second external terminal, the third external terminal, or the fourth external terminal that are adjacent to each other; and

four mounting terminals each of which is arranged between the first mounting terminal and the third mounting terminal, between the second mounting terminal and the third mounting terminal, between the first mounting terminal and the fourth mounting terminal, and between the second mounting terminal and the fourth mounting terminal;

wherein

the first mounting terminal and the second mounting terminal are configured to face the first external terminal and the second external terminal of the chip component, and the third mounting terminal and the fourth mounting terminal are configured to face the first external terminal and the second external terminal of the chip component;

the first mounting terminal and the fourth mounting terminal are connected to each other, and the second mounting terminal and the third mounting terminal are connected to each other;

the first external terminal and the second external terminal are signal terminals; and

the third mounting terminal and the fourth mounting terminal are floating terminals.

2. The chip component mounting structure according to claim 1, further comprising:

an external terminal that is located at the center of the mounting surface; and

a mounting terminal that is arranged in a center of the four mounting terminals.

3. The chip component mounting structure according to claim 1, wherein the chip component further comprises:

a base including an impedance matching circuit; and

an IC that is mounted on the base.

4. The chip component mounting structure according to claim 1, wherein the chip component is mounted on the substrate at an angle of one of 0, 90, 180 and 270 degrees.

5. A module component comprising the chip component mounting structure according to claim 1.

6. The module component according to claim 5, further comprising:

an external terminal that is located at the center of the mounting surface; and

a mounting terminal that is arranged in a center of the four mounting terminals.

7. The module component according to claim 5, wherein the chip component further comprises:

a base including an impedance matching circuit; and

an IC that is mounted on the base.

8. The module component according to claim 5, wherein the chip component is mounted on the substrate at an angle of one of 0, 90, 180 and 270 degrees.

9. The module component according to claim 5, wherein the module component is an RFID tag.

10. The module component according to claim 5, wherein the substrate is flexible.

11. The module component according to claim 5, further comprising a first antenna on a first surface of the substrate and a second antenna on a second surface of the substrate.

12. The module component according to claim 5, wherein the chip component is an RFIC.

13. The module component according to claim 5, further comprising a first antenna and a second antenna on a same surface of the substrate.

14. The module component according to claim 5, further comprising one of a loop antenna and a dipole antenna.

15. The module component according to claim 5, further comprising resin provided on an upper surface of the substrate.

16. The module component according to claim 5, wherein an external shape of the chip component is square or substantially square.

17. A chip component mounting structure comprising:

a substrate including;

a first mounting terminal and a second mounting terminal that are arranged on a surface of the substrate at first diagonal positions of a square; and

a third mounting terminal and a fourth mounting terminal that are arranged on the surface of the substrate at second diagonal positions of the square;

a chip component including at least a pair of a first external terminal and a second external terminal that are arranged on a mounting surface of the chip component at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface;

at least a pair of a third external terminal and a fourth external terminal that are arranged on the mounting surface of the chip component at positions that are rotationally symmetric to each other by 180 degrees with respect to the center of the mounting surface of the chip component and that are rotationally symmetric to each other by 90 degrees with respect to the first external terminal and the second external terminal;

an external terminal that is located at the center of the mounting surface; and

a mounting terminal that is arranged in a center of the four mounting terminals;

wherein

the first mounting terminal and the second mounting terminal are configured to face the first external terminal and the second external terminal of the chip component, and the third mounting terminal and the fourth mounting terminal are configured to face the first external terminal and the second external terminal of the chip component;

the first mounting terminal and the fourth mounting terminal are connected to each other, and the second mounting terminal and the third mounting terminal are connected to each other;

the first external terminal and the second external terminal are signal terminals; and

the third mounting terminal and the fourth mounting terminal are floating terminals.

18. The chip component mounting structure according to claim 17, wherein the chip component further comprises:

a base including an impedance matching circuit; and

an IC that is mounted on the base.

19. A module component comprising the chip component mounting structure according to claim 17.