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Chip component mounting structure, and module component

  • US 9,560,757 B2
  • Filed: 05/21/2015
  • Issued: 01/31/2017
  • Est. Priority Date: 12/19/2012
  • Status: Active Grant
First Claim
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1. A chip component mounting structure comprising:

  • a substrate including;

    a first mounting terminal and a second mounting terminal that are arranged on a surface of the substrate at first diagonal positions of a square; and

    a third mounting terminal and a fourth mounting terminal that are arranged on the surface of the substrate at second diagonal positions of the square;

    a chip component including at least a pair of a first external terminal and a second external terminal that are arranged on a mounting surface of the chip component at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface;

    at least a pair of a third external terminal and a fourth external terminal that are arranged on the mounting surface of the chip component at positions that are rotationally symmetric to each other by 180 degrees with respect to the center of the mounting surface of the chip component and that are rotationally symmetric to each other by 90 degrees with respect to the first external terminal and the second external terminal;

    an external terminal that is arranged between two of the first external terminal, the second external terminal, the third external terminal, or the fourth external terminal that are adjacent to each other; and

    four mounting terminals each of which is arranged between the first mounting terminal and the third mounting terminal, between the second mounting terminal and the third mounting terminal, between the first mounting terminal and the fourth mounting terminal, and between the second mounting terminal and the fourth mounting terminal;

    whereinthe first mounting terminal and the second mounting terminal are configured to face the first external terminal and the second external terminal of the chip component, and the third mounting terminal and the fourth mounting terminal are configured to face the first external terminal and the second external terminal of the chip component;

    the first mounting terminal and the fourth mounting terminal are connected to each other, and the second mounting terminal and the third mounting terminal are connected to each other;

    the first external terminal and the second external terminal are signal terminals; and

    the third mounting terminal and the fourth mounting terminal are floating terminals.

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