Method and apparatus for discontinuous dermabrasion

• US 9,561,051 B2
• Filed: 01/27/2012
• Issued: 02/07/2017
• Est. Priority Date: 01/28/2011
• Status: Active Grant

• Current Assignee: The General Hospital Corporation (Mass General Brigham, Inc.)
• Original Assignee: The General Hospital Corporation (Mass General Brigham, Inc.)
• Inventors: Austen, William G., Manstein, Dieter
• Primary Examiner(s): Eastwood, David C
• Application Number:
  US13/982,070
• Publication Number:
  US 20140163582A1
• Time in Patent Office: 1,838 Days
• Field of Search: 606/131
• US Class Current: 1/1
• CPC Class Codes: A61B 17/32 Surgical cutting instruments A61B18/042 takes precedence; suture cutters A61B17/0467; instruments for ligaturing or cutting A61B17/128; instruments for rupturing the amniotic membrane A61B17/4208; specially adapted knives for eye surgery A61F9/0133
• CPC Class Codes: A61B 17/3205 Excision instruments
• CPC Class Codes: A61B 17/54 Chiropodists' instruments , e.g. pedicure chiropractic devices A61H1/008
• CPC Class Codes: A61B 2017/00561 creating a vacuum
• CPC Class Codes: A61B 2017/00761 Removing layer of skin tissue, e.g. wrinkles, scars or cancerous tissue
• CPC Class Codes: A61B 2017/320004 abrasive
• CPC Class Codes: A61B 2217/005 with suction drainage system

Abstract

Exemplary embodiments of method and apparatus are provided for resurfacing of skin that includes formation of a plurality of small holes, e.g., having widths less than about 1 mm or 0.5 mm. For example, such small holes can be produced using a mechanical apparatus that includes one or more abrading elements provided at the end of one or more rotating shafts, thus avoiding generation of thermal damage as occurs with conventional laser resurfacing procedures and devices. The holes thus formed can be well-tolerated by the skin, and may exhibit shorter healing times and less swelling than conventional resurfacing procedures. The fractional surface coverage of the holes can be between about 0.1 and 0.7, or between about 0.2 and 0.5. The method and apparatus can produce cosmetic improvements in the skin appearance by eliciting a healing response.

Claims

1. An apparatus for cosmetic resurfacing of a skin tissue, comprising:

a plurality of shafts;

an abrading element coupled to a distal end of each of the shafts;

a reciprocating arrangement configured to (i) translate the shafts in a direction substantially along the longitudinal axis of the shafts and/or (ii) translate the shafts over the skin tissue in one or two orthogonal directions; and

a drive arrangement configured to rotate each of the shafts around a longitudinal axis thereof,

wherein a width of the abrading element is less than about 1 mm, and

wherein the abrading element is configured to contact a surface of the skin tissue to generate holes in the skin tissue by removing portions of the skin tissue.

2. The apparatus of claim 1, wherein the width of the abrading element is less than about 0.8 mm.

3. The apparatus of claim 1, wherein the width of the abrading element is less than about 0.5 mm.

4. The apparatus of claim 1, wherein the width of the abrading element is between about 0.3 mm and about 0.5 mm.

5. The apparatus of claim 1, further comprising a substrate, wherein the shafts are rotatably coupled to the substrate.

6. The apparatus of claim 1, wherein the reciprocating arrangement comprises an actuator and a control arrangement.

7. The apparatus of claim 1, wherein the reciprocating arrangement comprises a trigger mechanism and a spring arrangement.

8. The apparatus of claim 1, wherein the reciprocating arrangement is configured to bring the abrading element in contact with the surface of the skin tissue with a predetermined force or depth.

9. The apparatus of claim 1, further comprising a conduit configured to facilitate contact between a surface of the skin tissue and the abrading element when the conduit is placed in communication with a low-pressure source.

10. The apparatus of claim 1, wherein the shape of the abrading element is spherical, cylindrical, or conical.

11. The apparatus of claim 1, wherein the abrading element comprises an abrasive medium.

12. The apparatus of claim 11, wherein the abrasive medium is selected from the group consisting of a diamond powder, a metallic powder, and carbide particles.

13. The apparatus of claim 1, wherein an areal fraction of the skin tissue covered by the abrading element is 0.1.

14. The apparatus of claim 1, wherein the depth of the holes generated by the abrading element in the skin tissue is (i) into the upper epidermal layer, (ii) at the dermal/epidermal junction, or (iii) below the dermal/epidermal junction.

15. The apparatus of claim 1, wherein the depth of the holes generated by the abrading element in the skin tissue is 2 mm or less.

16. The apparatus of claim 1, wherein an array in one or more rows or in a random spatial distribution is generated by removing portions of the skin tissue.

17. The apparatus of claim 9, wherein the low-pressure source is a vacuum pump or a piston.

18. The apparatus of claim 1, wherein the reciprocating arrangement is enclosed in a housing.

19. The apparatus of claim 18, wherein the housing is configured to stretch and/or stabilize the skin tissue proximal to the at least one shaft, to reduce deformation of the skin tissue, and/or to improve accuracy of the insertion of the at least one shaft into the skin tissue.

20. The apparatus of claim 1, wherein the drive arrangement comprises a fan, a turbine, and/or a rack-and-pinion mechanism comprising one or more gears.

21. A method for resurfacing skin tissue, comprising:

producing a plurality of holes in the skin tissue using the apparatus of claim 1, wherein each hole is produced by removing a portion of the skin tissue, and wherein a width of each hole is less than about 1 mm.

22. The method of claim 21, wherein the width of each hole is less than about 0.8 mm.

23. The method of claim 21, wherein the width of each hole is less than about 0.5 mm.

24. The method of claim 21, wherein a surface area fraction of the removed portions of the skin tissue is about 0.1.

25. The method of claim 21, wherein at least one of the holes extends to a depth of (i) the upper epidermal layer, (ii) the dermal/epidermal junction, or (iii) below the dermal/epidermal junction.

26. The method of claim 21, wherein the width of each hole is between about 0.3 mm and about 0.5 mm.

27. The method of claim 21, wherein at least one of the holes extends to a depth of 2 mm or less.

28. The method of claim 21, wherein an array in one or more rows or in a random spatial distribution is generated by the plurality of holes.