High temperature tolerant RFID tag

• US 9,563,834 B2
• Filed: 03/27/2014
• Issued: 02/07/2017
• Est. Priority Date: 04/10/2013
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Imbruglio, Richard
• Primary Examiner(s): LE, THIEN MINH
• Application Number:
  US14/782,652
• Publication Number:
  US 20160048751A1
• Time in Patent Office: 1,048 Days
• Field of Search: 235/492, 235/488, 235/375, 235/380
• US Class Current: 1/1
• CPC Class Codes: G06K 19/02 characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/0773 the record carrier comprising means to protect itself against external heat sources
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07762 the adhering arrangement making the record carrier wearable, e.g. having the form of a ring, watch, glove or bracelet record carriers for insertion in the human body for medical purposes A61B90/00; record carriers adapted for attachment to animals A01K11/00
• CPC Class Codes: G06K 19/07764 the adhering arrangement making the record carrier attachable to a tire tire temperature or pressur control arrangements, see B60C23/00

Abstract

Apparatus and associated methods relate to a flexible high-temperature-tolerant RFID tag having an RFID integrated packaged in an SOT package attached with a high temperature solder to a flex circuit defining an RFID antenna. In an illustrative embodiment, the flexible high-temperature-tolerant RFID tag may be encapsulated in a flexible material. For example, the SOT packaged RFID integrated circuit may be encapsulated in rubber. In some embodiments the entire assembled RFID tag may be encapsulated in rubber or another flexible compound. In some embodiments, such flexible high-temperature-tolerant RFID tags may be advantageously used in high-temperature applications. In an exemplary embodiment, flexible high-temperature-tolerant RFID tags may be attached to products that may be flexible and/or deformable. In an exemplary embodiment, a flexible high-temperature-tolerant RFID tag may be molded into a rubber that will be used in a flexible application.

Claims

1. A flexible high-temperature-tolerant RFID tag comprising:

an RFID integrated circuit packaged in a Small-Outline Transistor 323 (SOT-323) package having a plurality of leads; and

a flex circuit defining an RFID antenna and a plurality of connection pads arranged to receive the plurality of leads,

wherein the plurality of SOT-323 packaged RFID integrated circuit leads are attached to the plurality of contact pads of the flex circuit by a high-temperature silver solder, and,

wherein the RFID integrated circuit and the flex circuit are embedded in a plastic formed via injection molding.

2. The flexible high-temperature-tolerant RFID tag of claim 1, wherein the RFID integrated circuit is a passive RFID integrated circuit.

3. The flexible high-temperature-tolerant RFID tag of claim 1, wherein the flexible high-temperature-tolerant RFID tag is coated with a flexible coating.

4. The flexible high-temperature-tolerant RFID tag of claim 3, wherein the flexible coating comprises a rubber coating.

5. The flexible high-temperature-tolerant RFID tag of claim 1, further comprising a glove.

6. A flexible high-temperature-tolerant RFID tag comprising:

an RFID integrated circuit packaged in a Small-Outline Transistor (SOT) package having a plurality of leads; and

a flex circuit defining an RFID antenna and a plurality of connection pads arranged to receive the plurality of leads,

wherein the plurality of SOT packaged RFID integrated circuit leads are attached to the plurality of contact pads of the flex circuit by a high-temperature solder, and,

wherein the RFID integrated circuit and the flex circuit are embedded in a plastic formed via injection molding.

7. The flexible high-temperature-tolerant RFID tag of claim 6, wherein the high-temperature solder comprises silver solder.

8. The flexible high-temperature-tolerant RFID tag of claim 6, wherein the RFID integrated circuit is a passive RFID integrated circuit.

9. The flexible high-temperature-tolerant RFID tag of claim 6, wherein the SOT package is an SOT-323 package.

10. The flexible high-temperature-tolerant RFID tag of claim 6, wherein the flexible high-temperature-tolerant RFID tag is coated with a flexible coating.

11. The flexible high-temperature-tolerant RFID tag of claim 10, wherein the flexible coating comprises a rubber coating.

12. The flexible high-temperature-tolerant RFID tag of claim 6, wherein the flex circuit'"'"'s dielectric comprises fluorocarbon.

13. The flexible high-temperature-tolerant RFID tag of claim 6, wherein the flex circuit'"'"'s dielectric comprises aramid.

14. The flexible high-temperature-tolerant RFID tag of claim 6, further comprising a glove.

15. The flexible high-temperature-tolerant RFID tag of claim 6, further comprising an article of footwear.