Peak-based endpointing for chemical mechanical polishing

• US 9,564,377 B2
• Filed: 11/25/2013
• Issued: 02/07/2017
• Est. Priority Date: 10/31/2006
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Benvegnu, Dominic J., Swedek, Boguslaw A., Lischka, David J.
• Primary Examiner(s): MACARTHUR, SYLVIA
• Application Number:
  US14/088,933
• Publication Number:
  US 20140080232A1
• Time in Patent Office: 1,170 Days
• Field of Search: 156/345.12, 156/345.16, 156/345.25, 156/345.15
• US Class Current: 1/1
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/12 involving optical means
• CPC Class Codes: B24D 7/12 with apertures for inspecting the surface to be abraded
• CPC Class Codes: H01L 21/31053 involving a dielectric removal step
• CPC Class Codes: H01L 21/3212 by chemical mechanical polishing [CMP]
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

Claims

1. A polishing endpoint detection system, comprising:

a light source to direct a light to a substrate while the substrate is being polished;

a spectrometer to measure a sequence of current spectra of light reflected from the substrate while the substrate is being polished; and

a controller configured such that in operation the controller will

store a predetermined number for detecting an endpoint,

receive the sequence of current spectra from the spectrometer,

identify a plurality of peaks or valleys in the sequence of current spectra, wherein the peaks or valleys persist with an evolving location through at least some of the sequence of current spectra,

count a number of peaks or valleys that were identified that pass a predetermined location as polishing progresses, and

generate a signal to halt polishing of the substrate when the number counted reaches the predetermined number.

2. The system of claim 1, wherein the controller is configured to measure a first location of a peak or valley in a first current spectrum of the sequence of current spectra, and to measure a second location of the peak or valley in a second current spectrum of the sequence of current spectra.

3. The system of claim 2, wherein the controller is configured to count the number of peaks or valleys by determining whether the first location is on one side of the predetermined location and the second location is on an opposite side of the predetermined location.

4. The system of claim 3, wherein the controller is configured to use a spectrum measured during a first rotation of a platen as the first current spectrum and to use a spectrum measured during an immediately subsequent second rotation of the platen as the second current spectrum.

5. The system of claim 1, wherein a location of a peak or valley comprises a wavelength.

6. The system of claim 1, wherein the plurality of peaks or valleys comprise peaks.

7. The system of claim 1, wherein the plurality of peaks or valleys comprises valleys.

8. The system of claim 1, wherein the light source is a white light source.

9. A polishing system, comprising:

a support to hold a polishing pad;

a carrier head to hold the substrate;

a motor to generate relative motion between the substrate and the polishing pad; and

the polishing endpoint detection system of claim 1.

10. The polishing system of claim 9, wherein:

the light source and the spectrometer are located on a side of the substrate opposite the carrier head.

11. The polishing system of claim 1, wherein the controller is configured to apply a low pass filter to the current spectra.

12. The polishing system of claim 1, wherein the controller is configured to normalize the current spectra.