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Opto-electronic semiconductor module and method for the production thereof

  • US 9,564,555 B2
  • Filed: 08/11/2008
  • Issued: 02/07/2017
  • Est. Priority Date: 08/20/2007
  • Status: Active Grant
First Claim
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1. A method of manufacturing an optoelectronic semiconductor module comprising:

  • providing a light transmissive cover plate wafer and a frame wafer;

    forming an opening in the frame wafer;

    joining a layer free attachment of the frame wafer to the cover plate wafer;

    separating a cover element from a combination of the frame wafer and the cover plate wafer, whereby a separated part of the cover plate wafer forms a cover plate of the cover element, and a separated part of the frame wafer at least partly contains the opening and forms a frame part of the cover element joined to the cover plate;

    mounting a light emitting semiconductor chip on a chip carrier; and

    fixing the frame part with the chip carrier so that the frame part laterally encloses the semiconductor chip and the semiconductor chip is arranged between the cover plate and the chip carrier,wherein an anti-reflection layer is applied to the side of the cover plate facing toward the semiconductor chip;

    the optoelectronic semiconductor module emits and/or receives light beams during operation that enclose an angle (β

    , β

    1, β

    2) of less than or equal to 10°

    with a main plane of extension of the chip carrier; and

    the light beams are coupled out of the semiconductor module through the second main face of the cover plate facing away from the semiconductor chip.

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