Opto-electronic semiconductor module and method for the production thereof
First Claim
Patent Images
1. A method of manufacturing an optoelectronic semiconductor module comprising:
- providing a light transmissive cover plate wafer and a frame wafer;
forming an opening in the frame wafer;
joining a layer free attachment of the frame wafer to the cover plate wafer;
separating a cover element from a combination of the frame wafer and the cover plate wafer, whereby a separated part of the cover plate wafer forms a cover plate of the cover element, and a separated part of the frame wafer at least partly contains the opening and forms a frame part of the cover element joined to the cover plate;
mounting a light emitting semiconductor chip on a chip carrier; and
fixing the frame part with the chip carrier so that the frame part laterally encloses the semiconductor chip and the semiconductor chip is arranged between the cover plate and the chip carrier,wherein an anti-reflection layer is applied to the side of the cover plate facing toward the semiconductor chip;
the optoelectronic semiconductor module emits and/or receives light beams during operation that enclose an angle (β
, β
1, β
2) of less than or equal to 10°
with a main plane of extension of the chip carrier; and
the light beams are coupled out of the semiconductor module through the second main face of the cover plate facing away from the semiconductor chip.
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Abstract
An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
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Citations
21 Claims
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1. A method of manufacturing an optoelectronic semiconductor module comprising:
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providing a light transmissive cover plate wafer and a frame wafer; forming an opening in the frame wafer; joining a layer free attachment of the frame wafer to the cover plate wafer; separating a cover element from a combination of the frame wafer and the cover plate wafer, whereby a separated part of the cover plate wafer forms a cover plate of the cover element, and a separated part of the frame wafer at least partly contains the opening and forms a frame part of the cover element joined to the cover plate; mounting a light emitting semiconductor chip on a chip carrier; and fixing the frame part with the chip carrier so that the frame part laterally encloses the semiconductor chip and the semiconductor chip is arranged between the cover plate and the chip carrier, wherein an anti-reflection layer is applied to the side of the cover plate facing toward the semiconductor chip; the optoelectronic semiconductor module emits and/or receives light beams during operation that enclose an angle (β
, β
1, β
2) of less than or equal to 10°
with a main plane of extension of the chip carrier; andthe light beams are coupled out of the semiconductor module through the second main face of the cover plate facing away from the semiconductor chip. - View Dependent Claims (2, 3, 4, 5)
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6. An optoelectronic semiconductor module comprising:
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a chip carrier; a light emitting semiconductor chip mounted on the chip carrier; a cover element that has an at least partly light transmissive cover plate arranged on the side of the semiconductor chip facing away from the chip carrier; and a frame part laterally enclosing the semiconductor chip is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate, wherein; an anti-reflection layer is applied to the side of the cover plate facing toward the semiconductor chip, the optoelectronic semiconductor module emits and/or receives light beams during operation that enclose an angle (β
, β
1, β
2) of less than or equal to 10°
with a main plane of extension of the chip carrier, andthe light beams are coupled out of the semiconductor module through the second main face of the cover plate facing away from the semiconductor chip. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification