Use of an external getter to reduce package pressure
First Claim
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1. A wafer for use in forming a wafer level package comprising:
- a substrate having a seal structure formed on a portion of a surface of the substrate, the surface defined by a wafer level package (WLP) region and an external region, the seal structure forming a perimeter of the WLP region; and
a layer of getter material disposed on at least a portion of the external region of the surface of the substrate and outside the seal structure and the WLP region.
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Abstract
A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a surface defined by a wafer level package (WLP) region and an external region, and a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.
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Citations
20 Claims
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1. A wafer for use in forming a wafer level package comprising:
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a substrate having a seal structure formed on a portion of a surface of the substrate, the surface defined by a wafer level package (WLP) region and an external region, the seal structure forming a perimeter of the WLP region; and a layer of getter material disposed on at least a portion of the external region of the surface of the substrate and outside the seal structure and the WLP region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for forming a wafer comprising:
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providing a substrate; masking a surface of the substrate with a masking material to at least partially define an external region, wherein at least a portion of the external region is open to the surface of the substrate; and depositing a layer of getter material on the surface of the substrate through the open portion of the external region. - View Dependent Claims (13, 14, 15)
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16. A method for forming a wafer level package, comprising:
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providing a window cap wafer and a device wafer, each of the window cap wafer and the device wafer having a seal structure formed on a portion of a surface of the substrate, the substrate defined by a WLP region and an external region, the seal structure forming a perimeter of the WLP region, wherein a layer of getter material is disposed on at least a portion of the external region and outside the seal structure and the WLP region of at least one of the window cap wafer and the device wafer; aligning the window cap wafer with the device wafer; and bonding the window cap wafer and the device wafer to each other to form the wafer level package. - View Dependent Claims (17, 18, 19, 20)
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Specification