Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
First Claim
1. A method of processing a semiconductor substrate, the semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry, the method comprising:
- forming a plurality of electrically conductive interconnects extending at least partially through the substrate and through corresponding terminals, wherein the individual interconnects are in contact with corresponding terminals and have back side portions at a back side of the semiconductor substrate;
depositing a conductive layer onto the back side of the substrate and over exposed back side portions of the interconnects;
constructing a conductive backplane at the back side of the semiconductor substrate using the conductive layer; and
electrically coupling at least one of the back side portions of the interconnects to the backplane, and electrically isolating at least one of the plurality of other interconnects from the backplane.
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Accused Products
Abstract
Microfeature workpieces having interconnects and conductive backplanes and associated systems and methods are disclosed herein. One such device includes a semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry. The device also includes electrically conductive interconnects extending through at least a portion of the semiconductor substrate and electrically coupled to corresponding terminals. The device further includes a conductive backplane assembly having a conductive layer at a back side of the semiconductor substrate. One or more of the interconnects are electrically coupled to the conductive layer at the back side of the semiconductor substrate.
493 Citations
13 Claims
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1. A method of processing a semiconductor substrate, the semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry, the method comprising:
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forming a plurality of electrically conductive interconnects extending at least partially through the substrate and through corresponding terminals, wherein the individual interconnects are in contact with corresponding terminals and have back side portions at a back side of the semiconductor substrate; depositing a conductive layer onto the back side of the substrate and over exposed back side portions of the interconnects; constructing a conductive backplane at the back side of the semiconductor substrate using the conductive layer; and electrically coupling at least one of the back side portions of the interconnects to the backplane, and electrically isolating at least one of the plurality of other interconnects from the backplane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification