Stackable molded microelectronic packages

• US 9,570,382 B2
• Filed: 08/25/2015
• Issued: 02/14/2017
• Est. Priority Date: 07/19/2010
• Status: Active Grant

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Haba, Belgacem
• Primary Examiner(s): TOBERGTE, NICHOLAS J
• Application Number:
  US14/834,803
• Publication Number:
  US 20150364406A1
• Time in Patent Office: 539 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/1401 Structure
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06548 Conductive via connections through the substrate, container, or encapsulation
• CPC Class Codes: H01L 2225/06565 the devices having the same size and there being no auxiliary carrier between the devices
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/1023 : the support being an insulating substrate
• CPC Class Codes: H01L 2225/1047 : Details of electrical connections between containers
• CPC Class Codes: H01L 2225/1058 : Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/315 : the encapsulation having a cavity
• CPC Class Codes: H01L 23/3157 : Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 23/49805 : the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A microelectronic package has a microelectronic element overlying or mounted to a first surface of a substrate and substantially rigid conductive posts projecting above the first surface or projecting above a second surface of the substrate remote therefrom. Conductive elements exposed at a surface of the substrate opposite the surface above which the conductive posts project are electrically interconnected with the microelectronic element. An encapsulant overlies at least a portion of the microelectronic element and the surface of the substrate above which the conductive posts project, the encapsulant having a recess or a plurality of openings each permitting at least one electrical connection to be made to at least one conductive post. At least some conductive posts are electrically insulated from one another and adapted to simultaneously carry different electric potentials. In particular embodiments, the openings in the encapsulant at least partially expose conductive masses joined to posts, fully expose top surfaces of posts and partially expose edge surfaces of posts, or may only partially expose top surfaces of posts.

Claims

1. A microelectronic package comprising:

a substrate having a first surface and a second surface remote from the first surface;

a microelectronic element overlying the first surface;

substantially rigid conductors projecting above at least one of the first or second surfaces;

a conductive bond metal contacting surfaces of the conductors and extending downwardly from apexes thereof towards the at least one surface of the substrate;

conductive elements exposed at a surface of the substrate opposite the surface above which the conductors project, the conductive elements being electrically interconnected with the microelectronic element; and

an encapsulant overlying at least a portion of the microelectronic element and the surface of the substrate above which the conductors project, the encapsulant having a plurality of openings through which the bond metal is exposed, wherein at least some of the conductors are electrically insulated from one another and adapted to simultaneously carry different electric potentials.

2. A microelectronic package as claimed in claim 1, wherein a first dimension of at least some of the conductors in a first direction parallel to the at least one surface of the substrate can be different from a second dimension of the at least some of the conductors in a second direction parallel to the at least one surface, the second dimension being transverse to the first direction.

3. A microelectronic package as claimed in claim 1, wherein at least a first dimension of at least some of the conductors in a first direction parallel to the at least one surface of the substrate can be greater than or less than a height of the at least some of the conductors above the at least one surface of the substrate.

4. A microelectronic package as claimed in claim 1, wherein the at least some conductors are formed by plating a metal within an opening in a photoresist layer.

5. A microelectronic package as claimed in claim 4, wherein the at least some conductors have a cylindrical shape having a diameter in a direction parallel to the first surface, wherein the diameter can be greater than or less than a height of the of at least some conductors above the at least one surface of the substrate.

6. The microelectronic package as claimed in claim 1, wherein the conductors project to a first height above at least one of the first or second surfaces, the encapsulant contacts the conductors and has a major surface at a second height above a surface of the substrate above which the conductors project, the second height being greater than the first height, wherein the openings in the encapsulant are openings in the major surface.

7. The microelectronic package as claimed in claim 1, wherein the conductors project above the second surface and the conductive elements are exposed at the first surface.

8. A microelectronic package as claimed in claim 1, wherein a dimension of at least some of the conductors in a direction parallel to the at least one surface of the substrate can be greater than or less than a height of the at least some conductors above the at least one surface of the substrate.

9. A microelectronic package as claimed in claim 8, wherein a dimension of at least some of the conductors in a direction parallel to the at least one surface of the substrate is greater than a height of the at least some conductors above the at least one surface of the substrate.

10. The microelectronic package as claimed in claim 1, wherein the major surface of the encapsulant is a substantially planar surface overlying the first and second regions of the at least one surface at an at least substantially uniform second height therefrom and overlying the microelectronic element.

11. A microelectronic package comprising:

a substrate having a first surface and a second surface remote from the first surface;

a microelectronic element overlying the first surface;

substantially rigid conductors projecting above the first surface;

a conductive bond metal contacting surfaces of the conductors and extending downwardly from apexes thereof towards the first surface of the substrate;

conductive elements exposed at the second surface of the substrate, the conductive elements being electrically interconnected with the microelectronic element; and

an encapsulant overlying at least a portion of the microelectronic element and the first surface of the substrate, the encapsulant having a plurality of openings through which the bond metal is exposed, wherein at least some of the conductors are electrically insulated from one another and adapted to simultaneously carry different electric potentials.

12. A microelectronic package as claimed in claim 11, wherein the at least some conductors have a cylindrical shape having a diameter in a direction parallel to the first surface, wherein the diameter is greater than a height of the at least some conductors above the first surface.

13. A microelectronic package as claimed in claim 11, wherein each of the at least some conductors is formed by plating a metal within an opening in a photoresist layer.

14. The microelectronic package as claimed in claim 11, wherein the major surface of the encapsulant is a substantially planar surface, the encapsulant further having a second surface overlying the microelectronic element at a third height above the first surface, the third height being different from the second height.

15. The microelectronic package as claimed in claim 14, wherein the third height is greater than the second height.

16. The microelectronic package as claimed in claim 11, wherein the major surface of the encapsulant is a substantially planar surface overlying the first and second regions of the first surface at an at least substantially uniform second height therefrom and overlying the microelectronic element.

17. The microelectronic package as claimed in claim 11, wherein a portion of the encapsulant overlies the second surface and further has a plurality of second openings, each partially exposing at least one of the conductive elements, wherein at least some of the conductive elements are electrically insulated from one another and adapted to simultaneously carry different electric potentials.

18. The microelectronic package as claimed in claim 11, wherein surfaces of at least two of the conductors are at least partially exposed within a single one of the openings.

19. The microelectronic package as claimed in claim 11, wherein the conductive bond metal comprises solder and the conductor consists essentially of copper.

20. The microelectronic package as claimed in claim 11, wherein the major surface of the encapsulant is a substantially planar surface overlying the first and second regions of the first surface at an at least substantially uniform second height therefrom and overlying the microelectronic element.