Semiconductor device and method for manufacturing the same

• US 9,570,593 B2
• Filed: 05/07/2015
• Issued: 02/14/2017
• Est. Priority Date: 04/20/2012
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Isobe, Atsuo
• Primary Examiner(s): YUSHINA, GALINA G
• Application Number:
  US14/706,304
• Publication Number:
  US 20150236138A1
• Time in Patent Office: 649 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/70 Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof multistep manufacturing processes of assemblies consisting of a plurality of individual semiconductor or other solid state devices H01L25/00; manufacture of assemblies consisting of preformed electrical components H05K3/00, H05K13/00
• CPC Class Codes: H01L 27/1259 Multistep manufacturing methods
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/78648 arranged on opposing sides of the channel
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
• CPC Class Codes: H01L 29/78696 characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel H01L29/78612 takes precedence; transistors having a drain offset region or a lightly doped drain [LDD] H01L29/78621
• CPC Class Codes: H10B 12/03 Making the capacitor or connections thereto

Abstract

A variation in electrical characteristics, such as a negative shift of the threshold voltage or an increase in S value, of a fin-type transistor including an oxide semiconductor material is prevented. An oxide semiconductor film is sandwiched between a plurality of gate electrodes with an insulating film provided between the oxide semiconductor film and each of the gate electrodes. Specifically, a first gate insulating film is provided to cover a first gate electrode, an oxide semiconductor film is provided to be in contact with the first gate insulating film and extend beyond the first gate electrode, a second gate insulating film is provided to cover at least the oxide semiconductor film, and a second gate electrode is provided to be in contact with part of the second gate insulating film and extend beyond the first gate electrode.

Claims

1. A method for manufacturing a semiconductor device comprising a transistor, the method comprising:

forming a first gate electrode which extends in a first direction;

forming a first gate insulating film covering the first gate electrode;

forming an oxide semiconductor film which covers a top surface and side surfaces of the first gate electrode in the first direction;

forming a second gate insulating film covering the oxide semiconductor film; and

forming a second gate electrode which is over the second gate insulating film and extends in a second direction,

wherein the first direction is a channel length direction of the transistor and the second direction is a channel width direction of the transistor.

2. The method according to claim 1, wherein in a cross section in the channel width direction of the semiconductor device, a height of the first gate electrode is larger than a width in the channel width direction of the first gate electrode.

3. The method according to claim 1, wherein the oxide semiconductor film is formed by a sputtering method, a molecular beam epitaxy method, a chemical vapor deposition method, a pulsed laser deposition method, or an atomic layer deposition method.

4. The method according to claim 1, further forming a source electrode and a drain electrode connected to the oxide semiconductor film.

5. The method according to claim 1, wherein a hydrogen concentration in the oxide semiconductor film is lower than 5×

10¹⁸ atoms/cm³.

6. A method for manufacturing a semiconductor device comprising a transistor, the method comprising:

forming a first gate electrode which extends in a first direction;

forming a first gate insulating film covering the first gate electrode;

forming an oxide semiconductor film which covers a top surface and side surfaces of the first gate electrode in the first direction;

forming a second gate insulating film covering the oxide semiconductor film;

forming a second gate electrode which is over the second gate insulating film and extends in a second direction; and

adding an impurity to the oxide semiconductor film using the second gate electrode as a mask so that a first low-resistance region and a second low-resistance region are formed in the oxide semiconductor film,

wherein the first direction is a channel length direction of the transistor and the second direction is a channel width direction of the transistor.

7. The method according to claim 6, wherein in a cross section in the channel width direction of the semiconductor device, a height of the first gate electrode is larger than a width in the channel width direction of the first gate electrode.

8. The method according to claim 6, wherein the oxide semiconductor film is formed by a sputtering method, a molecular beam epitaxy method, a chemical vapor deposition method, a pulsed laser deposition method, or an atomic layer deposition method.

9. The method according to claim 6, further forming a source electrode and a drain electrode connected to the oxide semiconductor film.

10. The method according to claim 6, wherein a hydrogen concentration in the oxide semiconductor film is lower than 5×

10¹⁸ atoms/cm³.

11. The method according to claim 6, wherein the impurity comprises phosphorus.

12. A method for manufacturing a semiconductor device comprising a transistor and a capacitor, the method comprising:

forming a first conductive layer;

patterning the first conductive layer to form a first gate electrode of the transistor and a lower electrode of the capacitor, the first gate electrode extending in a first direction;

forming a first insulating film covering the first gate electrode of the transistor and the lower electrode of the capacitor;

forming an oxide semiconductor film which covers a top surface and side surfaces of the first gate electrode of the transistor;

forming a second insulating film covering the oxide semiconductor film and the first insulating film;

forming a second conductive layer which is over the second insulating film; and

patterning the second conductive layer to form a second gate electrode of the transistor and an upper electrode of the capacitor, the second gate electrode extending in a second direction;

adding an impurity to the oxide semiconductor film using the second gate electrode as a mask so that a first low-resistance region and a second low-resistance region are formed in the oxide semiconductor film,

wherein the first direction is a channel length direction of the transistor and the second direction is a channel width direction of the transistor.

13. The method according to claim 12, wherein in a cross section in the channel width direction of the semiconductor device, a height of the first gate electrode is larger than a width in the channel width direction of the first gate electrode.

14. The method according to claim 12, wherein the oxide semiconductor film is formed by a sputtering method, a molecular beam epitaxy method, a chemical vapor deposition method, a pulsed laser deposition method, or an atomic layer deposition method.

15. The method according to claim 12, further forming a source electrode and a drain electrode connected to the oxide semiconductor film.

16. The method according to claim 12, wherein a hydrogen concentration in the oxide semiconductor film is lower than 5×

10¹⁸ atoms/cm³.

17. The method according to claim 12, wherein the impurity comprises phosphorus.