Sensor package with exposed sensor array and method of making same

• US 9,570,634 B2
• Filed: 08/12/2015
• Issued: 02/14/2017
• Est. Priority Date: 06/03/2013
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Primary Examiner(s): Wright, Tucker J
• Application Number:
  US14/824,966
• Publication Number:
  US 20160043240A1
• Time in Patent Office: 552 Days
• US Class Current: 1/1
• CPC Class Codes: B01L 2300/0636 Integrated biosensor, microarrays
• CPC Class Codes: B01L 2300/0663 Whole sensors
• CPC Class Codes: B01L 2300/0877 Flow chambers
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: G01N 27/414 Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10156 at the periphery
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

A packaged sensor assembly and method of forming that includes a first substrate having opposing first and second surfaces and a plurality of conductive elements each extending between the first and second surfaces. A second substrate comprises opposing front and back surfaces, one or more detectors formed on or in the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors. A third substrate is mounted to the front surface to define a cavity between the third substrate and the front surface, wherein the third substrate includes a first opening extending from the cavity through the third substrate. The back surface is mounted to the first surface. A plurality of wires each extend between and electrically connecting one of the contact pads and one of the conductive elements.

Claims

1. A packaged sensor assembly, comprising:

a first substrate having opposing first and second surfaces and a plurality of conductive elements each extending between the first and second surfaces;

a second substrate that comprises;

opposing front and back surfaces,

one or more detectors formed on or in the front surface,

a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors,

a third substrate mounted to the front surface, by spacer material directly disposed on the third substrate and an epoxy bonding agent disposed between the spacer material and the front surface, to define a cavity between the third substrate and the front surface, wherein the third substrate includes a first opening extending from the cavity through the third substrate,

wherein the back surface is mounted to the first surface;

a plurality of wires each extending between and electrically connecting one of the contact pads and one of the conductive elements;

overmold material encapsulating the wires, one or more portions of the first surface of the first substrate adjacent the conductive elements, and one or more portions of the front surface of second substrate adjacent the plurality of contact pads;

a lens module mounted to the overmold material and not mounted to the third substrate, wherein the lens module comprises a housing and one or more lenses positioned to focus light through the first opening and onto the one or more detectors.

2. The packaged sensor assembly of claim 1, wherein the first substrate is made of a conductive silicon material, and wherein the assembly further comprises an insulation material disposed between the conductive elements and the first substrate.

3. The packaged sensor assembly of claim 1, wherein the one or more detectors include a plurality of photo detectors.

4. The packaged sensor assembly of claim 3, wherein the first opening is disposed over the plurality of photo detectors.

5. The packaged sensor assembly of claim 1, wherein the one or more detectors includes one or more chemical sensors.

6. The packaged sensor assembly of claim 5, further comprising:

a second opening extending from the cavity through the third substrate.

7. The packaged sensor assembly of claim 6, further comprising:

one or more dam structures in the cavity that define a non-linear flow path between the first opening and the second opening.

8. A method of forming a packaged sensor assembly, comprising:

providing a first substrate having opposing first and second surfaces;

forming a plurality of conductive elements each extending between the first and second surfaces;

providing a second substrate that comprises;

opposing front and back surfaces,

one or more detectors formed on or in the front surface, and

a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors;

forming a first opening through a third substrate;

forming spacer material directly on the third substrate;

mounting the third substrate to the front surface with an epoxy bonding agent disposed directly between the spacer material and the front surface to define a cavity between the third substrate and the front surface, wherein the first opening extends from the cavity through the third substrate;

placing protective tape on the third substrate and over the first opening;

mounting the back surface to the first surface;

providing a plurality of wires each extending between and electrically connecting one of the contact pads and one of the conductive elements; and

removing the protective tape after the mounting of the back surface to the first surface and after the providing of the plurality of wires.

9. The method of claim 8, further comprising:

encapsulating the wires, one or more portions of the first surface of the first substrate adjacent the conductive elements, and one or more portions of the front surface of second substrate adjacent the plurality of contact pads with an overmold material.

10. The method of claim 9, further comprising:

mounting a lens module to the overmold material and not to the third substrate, wherein the lens module comprising a housing and one or more lenses positioned to focus light through the first opening and onto the one or more detectors.

11. The method of claim 8, wherein the first substrate is made of a conductive silicon material, the method further comprising:

forming an insulation material disposed between the conductive elements and the first substrate.

12. The method of claim 8, wherein the one or more detectors include a plurality of photo detectors.

13. The method of claim 12, wherein the first opening is disposed over the plurality of photo detectors.

14. The method of claim 8, wherein the one or more detectors includes one or more chemical sensors.

15. The method of claim 14, further comprising:

forming a second opening extending from the cavity through the third substrate.

16. The method of claim 15, further comprising:

forming one or more dam structures in the cavity that define a non-linear flow path between the first opening and the second opening.