Light emitting device package, backlight unit, lighting device and its manufacturing method

• US 9,570,664 B2
• Filed: 06/10/2016
• Issued: 02/14/2017
• Est. Priority Date: 03/05/2014
• Status: Active Grant

• Current Assignee: Lumens Co., Ltd.
• Original Assignee: Lumens Co., Ltd.
• Inventors: Oh, Seunghyun, Lee, Seunghoon, Nam, Tehong, Han, Kangmin
• Primary Examiner(s): Bowman, Mary Ellen
• Application Number:
  US15/179,952
• Publication Number:
  US 20160284960A1
• Time in Patent Office: 249 Days
• US Class Current: 1/1
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/009 of the light source in the package G02B6/0021 takes precedence
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04026 Bonding areas specifically adapted for layer connectors
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/10175 Flow barriers
• CPC Class Codes: H01L 2224/1132 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16257 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/26175 Flow barriers
• CPC Class Codes: H01L 2224/2732 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/81192 wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/83815 : Reflow soldering
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0066 : relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided are a light emitting device package, a backlight unit, a lighting device and its manufacturing method. The light emitting device package may include a flip chip type light emitting device having a first pad and a second pad, a lead frame that includes a first electrode disposed at one side of an electrode separation space, and a second electrode disposed at the other side of the electrode separation space, and on which the light emitting device is mounted, a first bonding medium formed between the first pad of the light emitting device and the first electrode of the lead frame to electrically connect the first pad and the first electrode, and a second bonding medium formed between the second pad of the light emitting device and the second electrode of the lead frame to electrically connect the second pad and the second electrode, wherein at least one first accommodating cup capable of accommodating the first bonding medium is formed in the first electrode of the lead frame, wherein at least one second accommodating cup capable of accommodating the second bonding medium is formed in the second electrode of the lead frame, and wherein at least one air discharge path is formed on each of the first and second accommodating cups.

Claims

1. A light emitting device package comprising:

a flip chip type light emitting device including a first pad and a second pad;

a lead frame where the light emitting device is mounted, the lead frame comprising a first electrode disposed at one side of an electrode separation space and a second electrode disposed at the other side of the electrode separation space;

a first bonding medium disposed between the first pad of the light emitting device and the first electrode of the lead frame to electrically connect the first pad to the first electrode; and

a second bonding medium disposed between the second pad of the light emitting device and the second electrode of the lead frame to electrically connect the second pad to the second electrode,

wherein at least one first accommodating cup capable of accommodating the first bonding medium is formed in the first electrode of the lead frame, at least one second accommodating cup capable of accommodating the second bonding medium is formed in the second electrode of the lead frame, the first pad directly contacts with an upper surface of the first electrode of the lead frame and an upper surface of the first bonding medium in the manner of the same plane, and the second pad directly contacts with an upper surface of the second electrode of the lead frame and an upper surface of the second bonding medium in the manner of the same plane.

2. The light emitting device package of claim 1, further comprising:

an electrode separation wall disposed between the first electrode of the lead frame and the second electrode of the lead frame.

3. The light emitting device package of claim 1, wherein the first bonding medium is disposed only within the first accommodating cup.

4. The light emitting device package of claim 1, wherein each of the first accommodating cup and the second accommodating cup is a rectangular recess having a rectangular cross section.

5. The light emitting device package of claim 1, further comprising an electrode separation wall disposed between the first electrode of the lead frame and the second electrode of the lead frame, and having the same width as a gap between the first pad and the second pad.

6. The light emitting device package of claim 1, wherein a contact region of the first electrode which the first pad contacts in, includes a plurality of individual areas which are separated from each other.

7. The light emitting device package of claim 1, wherein a contact region in the first electrode which the first pad contacts in, includes four individual areas which respectively correspond to four corners of the first accommodating cup.

8. The light emitting device package of claim 1, wherein a width of the first electrode of the lead frame and a width of the second electrode of the lead frame are greater than a width of an entrance of the first accommodating cup and a width of an entrance of the second accommodating cup, respectively.

9. The light emitting device package of claim 1, further comprising a reflective molding member having a reflective cup portion, the reflective cup portion being configured to surround side surfaces of the flip chip type light emitting device.

10. The light emitting device package of claim 9, further comprising an encapsulant filled in the reflective cup portion.