Techniques for designing millimeter wave printed dipole antennas
First Claim
Patent Images
1. An apparatus, comprising:
- a substrate comprising a plurality of ground layers;
a signal wing and at least one ground wing, said at least one ground wing being coupled to at least one of the plurality of ground layers; and
an unbalanced feeding structure coupled to the signal wing, wherein the unbalanced feeding structure is boarded by a plurality of vias coupled to the ground layers, wherein the plurality of ground layers comprise a first ground layer and a second ground layer, and wherein the least one ground wing includes a first ground wing coupled to the first ground layer and a second ground wing coupled to the second ground layer.
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Abstract
A printed millimeter wave dipole antenna and techniques for designing such an antenna are disclosed. In one embodiment, the dipole antenna comprises: a signal wing and at least one ground wing for propagating signals in a millimeter wave band; and an unbalanced feeding structure directly coupled to the signal wing. The unbalanced feeding structure is boarded by a plurality of escorting vias to ensure equipotential grounds.
28 Citations
10 Claims
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1. An apparatus, comprising:
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a substrate comprising a plurality of ground layers; a signal wing and at least one ground wing, said at least one ground wing being coupled to at least one of the plurality of ground layers; and an unbalanced feeding structure coupled to the signal wing, wherein the unbalanced feeding structure is boarded by a plurality of vias coupled to the ground layers, wherein the plurality of ground layers comprise a first ground layer and a second ground layer, and wherein the least one ground wing includes a first ground wing coupled to the first ground layer and a second ground wing coupled to the second ground layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A computing device, comprising:
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a substrate comprising a plurality of ground layers; a signal wing and at least one ground wing, the ground wing coupled to at least one of the plurality of ground layers; an unbalanced feeding structure coupled to the signal wing, wherein the unbalanced feeding structure is boarded by a plurality of vias coupled to the ground layers; and a radio frequency (RF) circuit configured to transmit or receive signals via the signal wing and the at least one ground wing, wherein the plurality of ground layers comprise a first ground layer and a second ground layer, and wherein the least one ground wing includes a first ground wing coupled to the first ground layer and a second ground wing coupled to the second ground layer.
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Specification