MEMS device having variable gap width and method of manufacture
First Claim
1. A microelectromechanical systems (MEMS) device comprising:
- a base structure including a substrate having a first dielectric layer formed thereon, a first structural layer formed on said first dielectric layer, and a second dielectric layer formed over said first structural layer, wherein an exposed region of a top surface of said substrate is exposed from each of said first dielectric layer, said first structural layer, and said second dielectric layer; and
a proof mass suspended above said base structure to yield a first gap between said proof mass and said exposed region of said top surface of said substrate and a second gap between said proof mass and said first structural layer, a first width of said first gap being greater than a second width of said second gap.
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Abstract
A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).
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Citations
19 Claims
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1. A microelectromechanical systems (MEMS) device comprising:
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a base structure including a substrate having a first dielectric layer formed thereon, a first structural layer formed on said first dielectric layer, and a second dielectric layer formed over said first structural layer, wherein an exposed region of a top surface of said substrate is exposed from each of said first dielectric layer, said first structural layer, and said second dielectric layer; and a proof mass suspended above said base structure to yield a first gap between said proof mass and said exposed region of said top surface of said substrate and a second gap between said proof mass and said first structural layer, a first width of said first gap being greater than a second width of said second gap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A microelectromechanical systems (MEMS) device comprising:
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a base structure comprising; a substrate having a first dielectric layer formed thereon; a first structural layer formed on said first dielectric layer, said first structural layer including a sense plate, said sense plate having openings extending through said sense plate; and a second dielectric layer formed over said first structural layer, wherein a first exposed region of a top surface of said substrate is located at a non-sensing region for said MEMS device, said first exposed region being exposed from each of said first dielectric layer, said first structural layer, and said second dielectric layer, and a second exposed region of said top surface of said substrate underlies said sense plate, said second exposed region being exposed from said each of said first dielectric layer, said first structural layer, and said second dielectric layer via said openings; and a proof mass suspended above said base structure to yield a first gap between said proof mass and each of said first and second said exposed regions, and a second gap between said proof mass and said first structural layer, a first width of said first gap being greater than a second width of said second gap. - View Dependent Claims (12, 13, 14, 15)
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16. A microelectromechanical systems (MEMS) device comprising:
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a base structure comprising; a substrate having a first dielectric layer formed thereon; a first structural layer formed on said first dielectric layer, said first structural layer including a first sense plate and a second sense plate, wherein openings extend through each of said first and second sense plates; and a second dielectric layer formed over said first structural layer, wherein a first exposed region of a top surface of said substrate underlies said first sense plate, and a second exposed region of said top surface of said substrate underlies said second sense plate, said first and second exposed regions being exposed from said each of said first dielectric layer, said first structural layer, and said second dielectric layer via said openings; and a proof mass suspended above said base structure to yield a first gap between said proof mass and each of said first and second exposed regions of said top surface of said substrate and a second gap between said proof mass and said first structural layer, a first width of said first gap being greater than a second width of said second gap. - View Dependent Claims (17, 18, 19)
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Specification