Lithographic apparatus, device manufacturing method and displacement measurement system

• US 9,575,416 B2
• Filed: 08/02/2013
• Issued: 02/21/2017
• Est. Priority Date: 08/23/2012
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Van Der Pasch, Engelbertus Antonius Fransiscus, Beerens, Ruud Antonius Catharina Maria, Cuijpers, Martinus Agnes Willem, Hoogendam, Christiaan Alexander, Jacobs, Fransiscus Mathijs, Koenen, Willem Herman Gertruda Anna, Loopstra, Erik Roelof
• Primary Examiner(s): Ton, Toan
• Assistant Examiner(s): Iacoletti, Michelle M
• Application Number:
  US14/419,910
• Publication Number:
  US 20150212428A1
• Time in Patent Office: 1,299 Days
• US Class Current: 1/1
• CPC Class Codes: G03F 7/70483 Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
• CPC Class Codes: G03F 7/70725 control
• CPC Class Codes: G03F 7/70775 Position control, e.g. interferometers or encoders for determining the stage position

Abstract

A lithographic apparatus including a moveable object (WT) and a displacement measuring system arranged to determine a position quantity of the moveable object. The displacement measuring system includes an encoder (BC) and a grid structure. One of the encoder and the grid structure is connected to the moveable object. The grid structure includes a high precision grid portion (HG) and a low precision grid portion (LG). The encoder is arranged to cooperate with the high precision grid portion to determine the position quantity relative to the grid structure with a high precision. The encoder is arranged to cooperate with the low precision grid portion to determine the position quantity relative to the grid structure with a low precision.

Claims

1. A lithographic apparatus comprising:

a support structure constructed to support a patterning device, the patterning device being capable of imparting a radiation beam with a pattern to form a patterned radiation beam;

a substrate table constructed to hold a substrate;

a projection system configured to project the patterned radiation beam onto a target portion of the substrate; and

a displacement measuring system arranged to determine a position quantity of a moveable object,

wherein the moveable object comprises one of the support structure and the substrate table,

wherein the displacement measuring system comprises an encoder and a grid structure,

wherein one of the encoder and the grid structure is connected to the moveable object,

wherein the grid structure comprises a high precision grid portion and a low precision grid portion,

wherein the encoder is arranged to cooperate with the high precision grid portion to determine the position quantity relative to the grid structure with a high precision,

wherein the encoder is arranged to cooperate with the low precision grid portion to determine the position quantity relative to the grid structure with a low precision, and

wherein the high precision grid portion is provided closer to the projection system than the low precision grid portion.

2. The lithographic apparatus according to claim 1, wherein the encoder is arranged to cooperate with the high precision grid portion during projection of the patterned radiation beam onto the target portion of the substrate.

3. The lithographic apparatus according to claim 1, wherein the encoder is arranged to cooperate with the high precision grid portion during an alignment of the patterned radiation beam with the substrate.

4. The lithographic apparatus according to claim 1, wherein at least one of the high precision grid portion and the low precision grid portion has a two-dimensional pattern, wherein the encoder is arranged to cooperate with the two-dimensional pattern to determine the position quantity in at least two directions.

5. The lithographic apparatus according to claim 1, wherein the low precision grid portion at least partly surrounds the high precision grid portion.

6. The lithographic apparatus according to claim 1, wherein the low precision grid portion is substantially along an outer edge of the grid structure.

7. The lithographic apparatus according to claim 1, wherein the high precision grid portion is substantially along an inner edge of the grid structure.

8. The lithographic apparatus according to claim 1, wherein the high precision grid portion is adjacent to the low precision grid portion.

9. A lithographic apparatus comprising:

a moveable object; and

a displacement measuring system arranged to determine a position quantity of the moveable object,

wherein the displacement measuring system comprises an encoder and a grid structure,

wherein one of the encoder and the grid structure is connected to the moveable object,

wherein the grid structure comprises a high precision grid portion and a low precision grid portion,

wherein the encoder is arranged to cooperate with the high precision grid portion to determine the position quantity relative to the grid structure with a high precision,

wherein the encoder is arranged to cooperate with the low precision grid portion to determine the position quantity relative to the grid structure with a low precision, and

wherein the displacement measuring system comprises a further encoder, wherein the grid structure has a border between the high precision grid portion and the low precision grid portion, wherein the encoder and the further encoder are arranged at an offset relative to each other in a direction such that when one of the encoder and the further encoder faces the border, the other of the encoder and the further encoder cooperates with one of the high precision grid portion and the low precision grid portion.

10. The lithographic apparatus according to claim 9, wherein the border comprises a straight part, wherein the smallest angle between the direction and the straight part is between 10 and 80 degrees.

11. A device manufacturing method for transferring a pattern from a patterning device onto a substrate using a lithographic apparatus, wherein the lithographic apparatus comprises a moveable object and a projection system configured to project a patterned radiation beam onto a target portion of a substrate, the method comprising:

moving the moveable object,

providing a grid structure comprising a high precision grid portion and a low precision grid portion,

providing the high precision rid portion closer to the projection system than the low precision grid portion,

measuring with an encoder a position quantity of the moveable object with a high precision relative to the high precision grid portion, and

measuring with the encoder the position quantity of the moveable object with a low precision relative to the low precision grid portion.