Fingerprint sensing device
First Claim
1. A fingerprint sensing device comprising:
- a substrate comprising readout circuitry;
a sensing chip arranged on said substrate, said sensing chip comprising a plurality of sensing structures each having a sensing element, wherein a surface of said sensing elements defines a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between said sensing element and a finger placed on an exterior surface of the fingerprint sensing device;
a bond wire arranged between a first bond pad located on said sensing chip and a second bond pad located on said substrate to electrically connect said sensing chip to said readout circuitry, wherein said first bond pad is located in said sensing plane and wherein a portion of said bond wire protrudes above said sensing plane;
an adhesive arranged on said sensing chip to cover said sensing chip such that a portion of said bond wire protruding above said sensing plane is embedded in said adhesive; and
a protective plate attached to said sensing chip by means of said adhesive, said protective plate forming an exterior surface of the fingerprint sensing device.
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Accused Products
Abstract
A fingerprint sensing device (and associated method of manufacturing) comprises a sensing chip arranged on a substrate with readout circuitry. The sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between a sensing element and a finger placed on the sensing device; bond wires arranged between bond pads located on the sensing chip on the substrate, respectively, to electrically connect the sensing chip to the readout circuitry. A portion of the bond wire protrudes above the chip and an adhesive is arranged on the sensing chip to covering to cover the chip so that the portion of the bond wire protruding above the chip is embedded in the adhesive. A protective plate is attached to the sensing chip by the adhesive and forms an exterior surface of the device.
19 Citations
26 Claims
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1. A fingerprint sensing device comprising:
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a substrate comprising readout circuitry; a sensing chip arranged on said substrate, said sensing chip comprising a plurality of sensing structures each having a sensing element, wherein a surface of said sensing elements defines a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between said sensing element and a finger placed on an exterior surface of the fingerprint sensing device; a bond wire arranged between a first bond pad located on said sensing chip and a second bond pad located on said substrate to electrically connect said sensing chip to said readout circuitry, wherein said first bond pad is located in said sensing plane and wherein a portion of said bond wire protrudes above said sensing plane; an adhesive arranged on said sensing chip to cover said sensing chip such that a portion of said bond wire protruding above said sensing plane is embedded in said adhesive; and a protective plate attached to said sensing chip by means of said adhesive, said protective plate forming an exterior surface of the fingerprint sensing device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of manufacturing a fingerprint sensing device, said method comprising the steps of:
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providing a sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between said sensing element and a finger placed on an exterior surface of the fingerprint sensing device; arranging said sensing chip on a substrate comprising readout circuitry; performing wire bonding to connect a bond pad of said sensing chip to a corresponding bond pad of said substrate by means of a bond wire, wherein said bond pad of said sensing chip is located in said sensing plane, such that a portion of said bond wire protrudes above said sensing plane; arranging an adhesive on said sensing chip to cover said sensing chip, such that said portion of said bond wire protruding above said sensing plane is embedded in said adhesive; and arranging a protective plate on said adhesive film, such that said protective plate is attached to said sensing chip, said protective plate forming an exterior surface of said fingerprint sensing device. - View Dependent Claims (22, 23, 24, 25)
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26. A method of manufacturing a fingerprint sensing device, said method comprising the steps of:
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providing a sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between said sensing element and a finger placed on an exterior surface of the fingerprint sensing device; arranging said sensing chip on a substrate comprising readout circuitry; performing wire bonding to connect a bond pad of said sensing chip to a corresponding bond pad of said substrate by means of a bond wire, wherein said bond pad of said sensing chip is located in said sensing plane, such that a portion of said bond wire protrudes above said sensing plane; arranging an adhesive on said sensing chip in contact with said sensing elements such that said portion of said bond wire protruding above said sensing plane is embedded in said adhesive; forming a cover comprising a protective plate portion and a frame portion protruding from said protective plate;
said frame portion being configured to surround said sensing chip when said cover is arranged on said sensing chip and said substrate; andarranging said cover on said sensing chip and said substrate such that said protective plate portion is attached to said sensing chip by means of said adhesive.
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Specification