Security wrap with breakable conductors

• US 9,576,450 B2
• Filed: 07/26/2013
• Issued: 02/21/2017
• Est. Priority Date: 07/27/2012
• Status: Active Grant

• Current Assignee: Johnson Electric International AG (Johnson Electric Holdings Limited)
• Original Assignee: Johnson Electric SA (Johnson Electric Holdings Limited)
• Inventors: Salle, Vincent Daniel Jean, Ward, Dominic John, Edmonds, Martin Wallace, Zhang, Libing
• Primary Examiner(s): Barakat, Mohamed
• Application Number:
  US13/952,203
• Publication Number:
  US 20140028335A1
• Time in Patent Office: 1,306 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: G06F 21/87 by means of encapsulation, e.g. for integrated circuits
• CPC Class Codes: G08B 13/12 by the breaking or disturbance of stretched cords or wires
• CPC Class Codes: G08B 13/128 the housing being an electronic circuit unit, e.g. memory or CPU chip protecting computer components in secure or tamper resistant housings G06F21/86; protecting computer input devices, e.g. keyboards G06F21/83
• CPC Class Codes: H05K 1/0275 Security details, e.g. tampering prevention or detection
• CPC Class Codes: H05K 2201/09263 Meander

Abstract

A security wrap (20) for protecting an electronic component includes a substrate (22) having a first side and a second side opposite to each other. A security screen (26) is disposed over the first side of the substrate (22) and includes a pair of screen terminals (48) and a frangible and electrically conductive path (46) between the pair of screen terminals (48). A layer of adhesive (30) is over the first side of the substrate (22) and bonds the first side of the substrate (22) to the electronic component with the security screen (26) sandwiched there between.

Claims

1. A security wrap for protecting an electronic component, comprising:

a substrate having a first side and a second side opposite to each other;

a security screen disposed over the first side of said substrate and including a pair of screen terminals and a frangible and electrically conductive path between the pair of screen terminals;

a layer of adhesive over the first side of said substrate and bonding the first side of said substrate to the electronic component with said security screen sandwiched there between;

a dielectric layer disposed between said security screen and the first side of said substrate; and

a second security screen disposed between said dielectric layer and the first side of said substrate and including a second pair of screen terminals and a second frangible and electrically conductive path between the second pair of screen terminals.

2. The security wrap of claim 1, wherein said security screen is formed from a conductive ink in a printing process.

3. The security wrap of claim 1, wherein said layer of adhesive includes a layer of pressure sensitive adhesive.

4. The security wrap of claim 1, wherein said layer of adhesive includes a layer of thermoset adhesive.

5. The security wrap of claim 1, further comprising a release layer having a predetermined pattern of release ink disposed between the first side of said substrate and said security screen to selectively modify an adhesion between said security screen and said substrate.

6. The security wrap of claim 5, wherein:

said layer of adhesive has a first bonding strength between said security screen and the electronic component; and

said release layer has a second bonding strength between said security screen and said substrate less than the first bonding strength.

7. The security wrap of claim 1, wherein the component has an alarm circuit coupled to the pair of screen terminals of said security screen.

8. The security wrap of claim 7, wherein the alarm circuit of the component is sensitive to a change of resistance in the frangible and electrically conductive path of said security screen.

9. The security wrap of claim 1, wherein said security screen includes the frangible and electrically conductive path formed by conductive ink printed on said substrate.

10. The security wrap of claim 1, wherein:

the frangible and electrically conductive path of said security screen has a width between one micrometer and one millimeter; and

a space between different potions of the frangible and electrically conductive path of said security screen is between one micrometer and one millimeter.

11. The security wrap of claim 1, wherein said security screen disposed over the first side of said substrate and includes a plural pairs of screen terminals and a plurality of frangible and electrically conductive paths, each frangible and electrically conductive path being coupled between a corresponding pair of screen terminals.

12. The security wrap of claim 1, wherein the dielectric layer is a printed layer applied to the second security screen.

13. The security wrap of claim 1, wherein the frangible and electrically conductive path of said security screen and the second frangible and electrically conductive path of said second security screen are connected in series with each other.

14. The security wrap of claim 1, further comprising:

a second security screen disposed over the second side of said substrate and including a second pair of screen terminals and a second frangible and electrically conductive path coupled between the second pair of screen terminals; and

a dielectric layer disposed over said second security screen.

15. The security wrap of claim 1, wherein the frangible and electrically conductive path is formed on the first side of the substrate, and the area of the first side of the substrate bonding to the frangible and electrically conductive path has a different surface energy with the remaining area of the first side of the substrate.

16. The security wrap of claim 1, wherein the layer of adhesive has a through hole completely filled with conductive material for connecting the frangible and electrically conductive path to the electronic component.

17. The security wrap of claim 1, wherein the substrate is folded to form an open sided box arranged to accommodate the electronic component.

18. The security wrap of claim 1, wherein the substrate has an embossed portion preformed by plastic deformation for receiving the electronic component.