CAD-assisted TEM prep recipe creation

• US 9,576,772 B1
• Filed: 09/28/2015
• Issued: 02/21/2017
• Est. Priority Date: 08/31/2015
• Status: Active Grant

• Current Assignee: FEI Company (Thermo Fisher Scientific Incorporated)
• Original Assignee: FEI Company (Thermo Fisher Scientific Incorporated)
• Inventors: Knowles, Matthew P., Arjavac, Jason
• Primary Examiner(s): Berman, Jack
• Application Number:
  US14/868,056
• Publication Number:
  US 20170062178A1
• Time in Patent Office: 512 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: G01N 1/28 Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Qmounting specimens on microscopic slides G02B21/34; means for supporting the objects or the materials to be analysed in electron microscopes H01J37/20 ; laboratory gas handling apparatus B01L5/00
• CPC Class Codes: G01N 1/32 Polishing; Etching
• CPC Class Codes: G01N 2001/282 with mapping; Identification of areas; Spatial correlated pattern
• CPC Class Codes: H01J 2237/28 Scanning microscopes
• CPC Class Codes: H01J 2237/2802 Transmission microscopes
• CPC Class Codes: H01J 2237/2826 Calibration
• CPC Class Codes: H01J 2237/31732 Depositing thin layers on selected microareas
• CPC Class Codes: H01J 2237/31745 for preparing specimen to be viewed in microscopes or analyzed in microanalysers
• CPC Class Codes: H01J 37/28 with scanning beams H01J37/268, H01J37/292, H01J37/2955 take precedence
• CPC Class Codes: H01J 37/3023 Programme control
• CPC Class Codes: H01J 37/3045 Object or beam position registration

Abstract

An improved process workflow and apparatus for S/TEM sample preparation and analysis is provided. Preferred embodiments provide improved methods for an automated recipe TEM sample creation, especially for small geometry TEM lamellae, employing CAD data to automatically align various stages of sample preparation. The process automatically verifies and aligns the position of FIB-created fiducials by masking off portions of acquired images, and then comparing them to synthesized images from CAD data. SEM beam positions are verified by comparison to images synthesized from CAD data. FIB beam position is also verified by comparison to already-aligned SEM images, or by synthesizing an FIB image from CAD using techniques for simulating FIB images. The automatic alignment techniques herein allow creation of sample lamellas at specified locations without operator intervention.

Claims

1. A method for automatically preparing a semiconductor sample in a dual-beam charged particle system, the method comprising:

positioning the dual-beam charged particle system with respect to a semiconductor die sample region of interest to be examined in a sample chamber;

with focused ion beam (FIB) deposition, forming a first precision fiducial marker and one or more additional fiducial markers at desired locations with respect to the region of interest;

acquiring a first scanning electronic microscope (SEM) image of the region of interest;

retrieving computer aided design (CAD) data describing the region of interest;

synthesizing a second SEM image from CAD data describing the region of interest;

masking the one or more additional fiducial markers in the first SEM image and comparing the masked first SEM image and the second SEM image to determine a final correction offset for an actual position of the precision fiducial marker;

applying the final correction offset to the location of the precision fiducial marker;

based on the corrected location of the precision fiducial marker, adjusting the position of the FIB relative to the sample, and milling with the FIB to create a sample lamellae for examination.

2. The method of claim 1, wherein positioning the dual-beam charged particle system includes aligning with a desired field of view by comparing CAD data to an acquired image.

3. The method of claim 2, wherein aligning with a desired field of view comprises

(a) acquiring a preliminary SEM image including an alignment mark on the semiconductor die sample;

(b) acquiring CAD data describing the position of the alignment mark;

(c) comparing the preliminary SEM image with the CAD data and determining an first alignment correction offset; and

(d) based on the first alignment correction offset, adjusting the sample position relative to the position of the beam paths of the dual-beam system to direct the beam paths toward the region of interest.

4. The method of claim 1, further comprising, before FIB deposition of the fiducial markers,

(a) acquiring a FIB image from the FIB device;

(b) synthesizing a FIB image from the CAD data describing the region of interest;

(c) comparing the acquired FIB image to the synthesized FIB image to generate a FIB correction offset; and

(d) applying the FIB correction offset to the sample position.

5. The method of claim 1, further comprising, before FIB deposition of the fiducial markers, aligning the FIB beam by comparing an acquired SEM image to an acquired FIB image, and updating a tracked location for the FIB beam based on the results of the comparison.

6. The method of claim 1, further comprising, before the FIB deposition, depositing a protective layer over at least a portion of the region of interest.

7. The method of claim 6, wherein the protective layer is deposited by electron beam-induced deposition (EBID).

8. The method of claim 7, wherein depositing the protective layer with EBID further includes

(a) after positioning the dual beam charged particle system, acquiring an SEM image of the field of view;

(b) acquiring CAD data describing the position of the die sample region of interest;

(c) synthesizing a SEM image from the acquired CAD data;

(d) comparing the acquired SEM image to the synthesized SEM image to determine an SEM alignment correction offset;

(e) applying the SEM alignment correction offset to the FIB position; and

(f) then depositing the protective layer with EBID.

9. The method of claim 6, further comprising, when masking the one or more additional fiducial markers, also masking the protective layer.

10. A method for automatically preparing a semiconductor sample in a dual-beam charged particle system, the method comprising:

aligning a scanning electron microscope (SEM) beam the dual-beam charged particle system with a desired feature of interest on a sample in a sample chamber by comparing computer aided design (CAD) data to an acquired SEM image and applying a resulting SEM correction offset;

then, with beam-induced deposition, depositing a protective layer over at least part of the region of interest;

then, with a focused ion beam (FIB), creating a first precision fiducial marker and one or more additional fiducial markers at desired locations with respect to the region of interest;

acquiring a scanning electronic microscope (SEM) image of the region of interest;

retrieving CAD data describing the region of interest;

synthesizing a second SEM image from CAD data describing the region of interest;

masking the one or more additional fiducial markers and the protective layer in the first SEM image and comparing the masked first SEM image and the second SEM image to determine a final correction offset for an actual position of the precision fiducial marker;

applying the final correction offset to the FIB position and then FIB milling with reference to the corrected position to create a sample lamellae for examination.

11. The method of claim 10, further comprising, before creating the fiducial markers, acquiring a FIB image from the FIB device;

synthesizing a FIB image from the CAD data describing the region of interest;

comparing the acquired FIB image to the synthesized FIB image to generate a FIB correction offset;

applying the FIB correction offset to the FIB position relative to the sample.

12. An automated sample preparation system comprising:

a dual-beam scanning and milling system including a scanning electron microscope (SEM), a focused ion beam (FIB) both pointing at a sample chamber, a system controller operatively connected to the SEM and FIB and including at least one processor and tangible non-transitory computer media storing program instructions executable by the at least one processor for;

aligning a scanning electron microscope (SEM) beam the dual-beam charged particle system with a desired feature of interest on a sample in the sample chamber by comparing computer aided design (CAD) data to an acquired SEM image and applying a resulting SEM correction offset;

then, with beam-induced deposition, depositing a protective layer over at least part of the region of interest;

then, with a focused ion beam (FIB), creating a first precision fiducial marker and one or more additional fiducial markers at desired locations with respect to the region of interest;

acquiring a scanning electronic microscope (SEM) image of the region of interest;

retrieving CAD data describing the region of interest;

synthesizing a second SEM image from CAD data describing the region of interest;

masking the one or more additional fiducial markers and the protective layer in the first SEM image and comparing the masked first SEM image and the second SEM image to determine a final correction offset for an actual position of the precision fiducial marker;

applying the final correction offset to the FIB position and then FIB milling with reference to the corrected position to create a sample lamellae for examination.

13. The system of claim 12, wherein the program instructions are further executable for, before FIB deposition of the fiducial markers,

(a) acquiring a FIB image from the FIB device;

(b) synthesizing a FIB image from the CAD data describing the region of interest;

(c) comparing the acquired FIB image to the synthesized FIB image to generate a FIB correction offset; and

(d) applying the FIB correction offset to the sample position.

14. The system of claim 12, wherein the program instructions are further executable for, before FIB deposition of the fiducial markers, aligning the FIB beam by comparing an acquired SEM image to an acquired FIB image, and updating a tracked location for the FIB beam based on the results of the comparison.

15. The system of claim 12, further comprising:

a plucker device operable to remove one or more lamellas from the sample;

a transmission electron microscope (TEM), operable to receive the one or more lamellas from the plucker device and conduct scans;

a process controller operatively connected to the dual beam scanning and milling system, the plucker device, and the TEM and operable to command them to execute functions in an automated workflow.