Method and system for universal target based inspection and metrology
First Claim
1. A method for in-die metrology comprising:
- designing a plurality of universal metrology targets, wherein at least some of the universal metrology targets are measurable with a metrology tool and an inspection tool;
identifying a plurality of inspectable features within at least one die of a wafer using design data;
disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features;
inspecting a region containing one or more of the universal targets with an inspection tool;
identifying one or more anomalistic universal metrology targets in the inspected region with an inspection tool, wherein the one or more anomalistic universal metrology targets display an inspection parameter outside a selected inspection parameter range; and
responsive to the identification of one or more anomalistic universal metrology targets in the inspected region with the inspection tool, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.
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Abstract
Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.
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Citations
25 Claims
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1. A method for in-die metrology comprising:
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designing a plurality of universal metrology targets, wherein at least some of the universal metrology targets are measurable with a metrology tool and an inspection tool; identifying a plurality of inspectable features within at least one die of a wafer using design data; disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features; inspecting a region containing one or more of the universal targets with an inspection tool; identifying one or more anomalistic universal metrology targets in the inspected region with an inspection tool, wherein the one or more anomalistic universal metrology targets display an inspection parameter outside a selected inspection parameter range; and responsive to the identification of one or more anomalistic universal metrology targets in the inspected region with the inspection tool, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool. - View Dependent Claims (2, 22)
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3. A system for in-die metrology comprising:
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a lithography tool configured to; design a plurality of universal metrology targets, wherein at least some of the universal metrology targets are measurable with a metrology tool and an inspection tool; identify a plurality of inspectable features within at least one die of a wafer using design data; and dispose the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features; an inspection tool configured to; inspect a region containing one or more of the universal targets; and identify one or more anomalistic universal targets in the inspected region with an inspection tool, wherein the one or more anomalistic universal metrology targets display an inspection parameter outside a selected inspection parameter range; and a metrology tool configured to perform one or more metrology processes on the one or more anomalistic universal metrology targets in response to the identification of one or more anomalistic universal metrology targets in the inspected region with the inspection tool, wherein the lithography tool, the inspection tool and the metrology tool are communicatively coupled to a controller. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 23, 24, 25)
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Specification