Semiconductor device
First Claim
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1. A semiconductor device, comprising:
- a drift layer of a first conductivity type located on a semiconductor substrate of the first conductivity type;
a plurality of first well regions of a second conductivity type provided at an interval in a surface layer of said drift layer;
a second well region of the second conductivity type located in the surface layer of said drift layer while sandwiching the entirety of said plurality of first well regions therein in plan view, said second well region having a formation area larger than that of each of said first well regions;
a first separation region of the first conductivity type located to penetrate each of said first well regions from a surface layer of each of said first well regions in a depth direction;
a source region of the first conductivity type located in the surface layer of each of said first well regions while sandwiching said first separation region therein in plan view;
a first Schottky electrode provided on said first separation region;
a first ohmic electrode provided over each of said first well regions while sandwiching said first Schottky electrode therein in plan view;
a second separation region of the first conductivity type being a region for separating said first well regions from each other;
a third separation region of the first conductivity type located to penetrate said second well region from a surface layer of said second well region in the depth direction;
a second Schottky electrode provided on said third separation region;
a gate electrode provided, through a first insulating film, over said first and second well regions except for positions in which said first and second Schottky electrodes and said first ohmic electrode are provided;
a second insulating film located to cover said gate electrode; and
a first source electrode provided to cover said first and second Schottky electrodes, said first ohmic electrode, and said second insulating film.
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Abstract
A device that increases a value of current flowing through a whole chip until a p-n diode in a unit cell close to a termination operates and reduces a size of the chip and a cost of the chip resulting from the reduced size. The device includes a second well region located to sandwich the entirety of a plurality of first well regions therein in plan view, a third separation region located to penetrate the second well region from a surface layer of the second well region in a depth direction, and a second Schottky electrode provided on the third separation region.
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14 Claims
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1. A semiconductor device, comprising:
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a drift layer of a first conductivity type located on a semiconductor substrate of the first conductivity type; a plurality of first well regions of a second conductivity type provided at an interval in a surface layer of said drift layer; a second well region of the second conductivity type located in the surface layer of said drift layer while sandwiching the entirety of said plurality of first well regions therein in plan view, said second well region having a formation area larger than that of each of said first well regions; a first separation region of the first conductivity type located to penetrate each of said first well regions from a surface layer of each of said first well regions in a depth direction; a source region of the first conductivity type located in the surface layer of each of said first well regions while sandwiching said first separation region therein in plan view; a first Schottky electrode provided on said first separation region; a first ohmic electrode provided over each of said first well regions while sandwiching said first Schottky electrode therein in plan view; a second separation region of the first conductivity type being a region for separating said first well regions from each other; a third separation region of the first conductivity type located to penetrate said second well region from a surface layer of said second well region in the depth direction; a second Schottky electrode provided on said third separation region; a gate electrode provided, through a first insulating film, over said first and second well regions except for positions in which said first and second Schottky electrodes and said first ohmic electrode are provided; a second insulating film located to cover said gate electrode; and a first source electrode provided to cover said first and second Schottky electrodes, said first ohmic electrode, and said second insulating film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification