Components of an electronic device and methods for their assembly

• US 9,578,769 B2
• Filed: 09/11/2012
• Issued: 02/21/2017
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Woodhull, Charles B., Pakula, David A., Tan, Tang Y., Weber, Douglas Joseph, Prest, Christopher D., Memering, Dale N., Kiple, Bryan P.
• Primary Examiner(s): Nguyen, Hoang V
• Assistant Examiner(s): BOUIZZA, MICHAEL M
• Application Number:
  US13/610,782
• Publication Number:
  US 20130321237A1
• Time in Patent Office: 1,624 Days
• Field of Search: 343/872
• US Class Current: 1/1
• CPC Class Codes: B23C 2220/04 Milling with the axis of the cutter inclined to the surface being machined
• CPC Class Codes: B23C 2220/16 Chamferring
• CPC Class Codes: B23C 2220/20 Deburring
• CPC Class Codes: B23C 2220/28 Finishing
• CPC Class Codes: B23C 2220/48 Methods of milling not otherwise provided for
• CPC Class Codes: B23C 2226/31 Diamond
• CPC Class Codes: B23C 2226/315 polycrystalline [PCD]
• CPC Class Codes: B23C 5/00 Milling-cutters for cutting gear-teeth B23F21/12
• CPC Class Codes: B23C 5/1081 with permanently fixed cutting inserts B23C5/1018 and B23C5/1063 take precedence
• CPC Class Codes: B23P 11/00 Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00
• CPC Class Codes: B23P 17/00 Metal-working operations, not covered by a single other subclass or another group in this subclass
• CPC Class Codes: B23P 17/02 Single metal-working processes; Machines or apparatus therefor
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 11/022 Anodisation on selected surface areas
• CPC Class Codes: C25D 11/12 Anodising more than once, e.g. in different baths
• CPC Class Codes: C25D 11/246 for sealing layers
• CPC Class Codes: C25D 11/34 of metals or alloys not provided for in groups C25D11/04 - C25D11/32
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 : Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0254 : comprising one or a plurality of mechanically detachable modules
• CPC Class Codes: H04M 1/11 : Supports for sets, e.g. incorporating armrests
• CPC Class Codes: H05K 13/00 : Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/02 : Details
• CPC Class Codes: H05K 5/0217 : Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0243 : for decorative purposes
• CPC Class Codes: H05K 5/0247 : Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 : Covers
• CPC Class Codes: H05K 5/04 : Metal casings
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 29/47 : Burnishing
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 407/1906 : including holder [i.e., head] having seat for inserted tool
• CPC Class Codes: Y10T 409/300896 : with sensing of numerical information and regulation without mechanical connection between sensing means and regulated means [i.e., numerical control]
• CPC Class Codes: Y10T 409/303752 : Process
• CPC Class Codes: Y10T 409/30952 : with cutter holder

Abstract

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Claims

1. An electronic device comprising:

a housing that carries a first antenna assembly at a first end of the housing and a second antenna assembly at a second end of the housing, the second end being opposite the first end,

wherein each of the first antenna assembly and the second antenna assembly includes;

an antenna, and

a cover plate coupled to the housing and proximate to the antenna, the cover plate being transparent at frequencies used by the antenna for wireless communication and being opaque to light at visible frequencies, and wherein an area defined by a backside of the housing is greater than a total area defined by each cover plate, and

wherein an outer surface of each cover plate is coplanar with the backside of the housing.

2. The electronic device of claim 1, wherein each cover plate comprises one of pigmented glass, ceramic glass, and sapphire.

3. The electronic device of claim 1, further comprising a cover glass on a front side of the electronic device, wherein the cover glass comprises 50% to 100% of a surface area of the front side.

4. The electronic device of claim 1, wherein at least a portion the housing is made from a metallic material.

5. The electronic device of claim 1, wherein the frequencies used by each antenna for wireless communication are from about 500-6500 MHz.

6. The electronic device of claim 1, wherein each cover plate is coupled to the housing such that a planar outer surface of the cover plate is flush with a planar outer surface region of the housing, and wherein the planar outer surfaces of both cover plates and the planar outer surface region of the housing combine to form a smooth and continuous outer surface of the electronic device.

7. The electronic device of claim 1, wherein each cover plate is coupled to the housing by way of a cured adhesive.

8. The electronic device of claim 1, wherein the housing comprises multiple separate sections, and wherein each cover plate is coupled to a plurality of the multiple separate sections.

9. The electronic device of claim 1, wherein the housing defines a first side, a second side, and four sidewalls therebetween, and wherein each cover plate contacts at least three of the four sidewalls.

10. An electronic device, comprising:

a housing having a first end and a second end opposite the first end, the housing being suitable for carrying a first antenna and a second antenna, the housing comprising;

a first cover plate coupled to the first end of the housing and proximate to the first antenna, wherein the first cover plate defines a plane, and wherein the first cover plate is transparent at frequencies used by the first antenna for wireless communication, and is opaque to light at visible frequencies, and

a second cover plate coupled to the second end of the housing, wherein an exterior surface of the second cover plate is coplanar with an exterior surface of the plane defined by the first cover plate, and wherein the second cover plate is transparent at frequencies used by the second antenna for wireless communication, and opaque to light at visible frequencies, and wherein an area defined by a backside of the housing is greater than a total area defined by the first cover plate and the second cover plate.

11. The electronic device of claim 10, wherein the first cover plate is located at a first end of the electronic device and the second cover plate is located at a second end of the electronic device opposite the first end.