Methods and devices for sample lysis

• US 9,580,679 B2
• Filed: 09/20/2013
• Issued: 02/28/2017
• Est. Priority Date: 09/21/2012
• Status: Active Grant

• Current Assignee: California Institute of Technology
• Original Assignee: California Institute of Technology
• Inventors: Gorman, John, Njoroge, Samuel, Maltezos, George, Scherer, Axel
• Primary Examiner(s): Wecker, Jennifer
• Application Number:
  US14/033,365
• Publication Number:
  US 20140087359A1
• Time in Patent Office: 1,257 Days
• US Class Current: 1/1
• CPC Class Codes: B01L 2300/1883 using thermal insulation
• CPC Class Codes: B01L 3/5027 by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip B01L3/5023 takes precedence; micromixers B01F33/30; microreactors for synthesis B01J19/0093; microcapillary devices in general B81B1/00
• CPC Class Codes: B01L 7/52 with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples amplification or hybridisation processes per se C12Q1/68; controlling sequential reactions for synthesis B01J19/0046
• CPC Class Codes: C12M 21/00 Bioreactors or fermenters specially adapted for specific uses digesters for manure A01C3/023; apparatus for PCR B01L7/52; destroying or transforming solid waste B09B3/00; methods for genetic engineering C12N15/00, C12Q1/68; nucleic acid amplification reactions C12Q1/6844
• CPC Class Codes: C12M 47/06 Hydrolysis; Cell lysis; Extraction of intracellular or cell wall material lysis of microorganisms C12N1/06; extracting or separating nucleic acids from biological samples C12N15/1003
• CPC Class Codes: C12N 1/06 Lysis of microorganisms
• CPC Class Codes: C12N 1/066 by physical methods
• CPC Class Codes: G01N 27/44791 Microapparatus sample containers with integrated microfluidic structures B01L3/5027

Abstract

Disclosed herein are methods and systems for use in preparing a sample. The methods and systems may be used for lysing one or more structures in a sample (e.g., cells, viral particles, etc.). The methods and compositions may comprise a microfluidic chip or use thereof. The microfluidic chips disclosed herein may comprise (a) a substrate comprising a chamber, wherein at least one mechanical element may be located within the chamber; (b) a thermal element in contact with the chamber; and (c) at least one aperture within the surface of the substrate, wherein the aperture may be configured to insulate the chamber.

Claims

1. A microfluidic chip comprising:

a. a chamber which comprises at least one stir bar or a plurality of granular particles;

b. a thermal device in thermal contact with the chamber; and

c. at least one insulative groove within the surface of the chip, wherein the at least one insulative groove is configured such that during operation of the chip, ambient air enters the at least one insulative groove and insulates the chamber, and wherein the at least one insulative groove is a plurality of grooves positioned around the chamber.

2. The microfluidic chip of claim 1, wherein the thermal device is a heater or a cooler.

3. The microfluidic chip of claim 1, wherein the at least one insulative groove is nine insulative grooves.

4. The microfluidic chip of claim 1, wherein the stir bar is composed of magnetic material.

5. The microfluidic chip of claim 1, wherein the microfluidic chip is coupled to an external magnetic field.

6. The microfluidic chip of claim 1, wherein the granular particles are beads.

7. The microfluidic chip of claim 6, wherein the beads are magnetic or made of glass or cubic-zirconium.

8. The microfluidic chip of claim 1, further comprising a vent, a filter, a pouch or one or more additional chambers.

9. The microfluidic chip of claim 1, further comprising a thermal conductor, a thermal transducer or a thermal sensor.

10. The microfluidic chip of claim 8, wherein the pouch is made of polypropylene, polyethylene, polyethylene terephthalate (PET) or combinations thereof.

11. The microfluidic chip of claim 1, wherein the microfluidic chip is manufactured by using converted-tape technology.

12. The microfluidic chip of claim 1, wherein the chamber comprises at least one stir bar.

13. The microfluidic chip of claim 1, wherein the thermal device is in mechanical contact with the chamber.

14. The microfluidic chip of claim 1, further comprising a thermal transducer in thermal contact with the chamber.

15. The microfluidic chip of claim 1, wherein the thermal device is a heater.

16. The microfluidic chip of claim 1, wherein the thermal device is a resistive heater.

17. The microfluidic chip of claim 15, wherein the heater is attached to the chamber via an adhesive.

18. The microfluidic chip of claim 17, wherein the adhesive is heat conductive.

19. The microfluidic chip of claim 17, wherein the adhesive is pressure sensitive.

20. The microfluidic chip of claim 1, wherein the chamber comprises two chambers.

21. The microfluidic chip of claim 1, wherein a cross-section of the at least one insulative groove is not circular.

22. The microfluidic chip of claim 1, wherein the at least one insulative groove is less than 100 μ

m in length.

23. The microfluidic chip of claim 1, wherein the at least one insulative groove is less than 30 μ

m in width.

24. The microfluidic chip of claim 1, wherein the at least one insulative groove is greater than 0.001 μ

m in length.