Method of forming interconnects for three dimensional integrated circuit
First Claim
1. A method comprising:
- attaching a metal layer on a first carrier;
forming a dielectric layer on the metal layer;
attaching a first side of a packaging component on a first side of the dielectric layer, wherein the packaging component comprises a plurality of through holes before the packaging component is attached to the metal layer, and wherein the dielectric layer is between and in direct contact with the package component and the metal layer;
removing exposed portions of the dielectric layer to expose the metal layer;
filling the plurality of through holes with a metal material using an electrochemical plating process, wherein the exposed metal layer is employed as an electrode for the electrochemical plating process;
attaching a second carrier on a second side of the packaging component;
detaching the first carrier from the packaging component; and
patterning the metal layer to form a redistribution layer on the first side of the packaging component and expose a portion of a second side of the dielectric layer, wherein the plurality of through holes extend through the dielectric layer during the step of patterning the metal layer.
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Accused Products
Abstract
A method of forming interconnects for three dimensional integrated circuits comprises attaching a metal layer on a first carrier, attaching a first side of a packaging component on the metal layer, wherein the packaging component comprises a plurality of through vias. The method further comprises filling the plurality of through vias with a metal material using an electrochemical plating process, wherein the metal layer functions as an electrode for the electrochemical plating process, attaching a second carrier on a second side of the packaging component, detaching the first carrier from the packaging component, forming a photoresist layer on the metal layer, patterning the photoresist layer and detaching exposed portions of the metal layer.
95 Citations
18 Claims
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1. A method comprising:
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attaching a metal layer on a first carrier; forming a dielectric layer on the metal layer; attaching a first side of a packaging component on a first side of the dielectric layer, wherein the packaging component comprises a plurality of through holes before the packaging component is attached to the metal layer, and wherein the dielectric layer is between and in direct contact with the package component and the metal layer; removing exposed portions of the dielectric layer to expose the metal layer; filling the plurality of through holes with a metal material using an electrochemical plating process, wherein the exposed metal layer is employed as an electrode for the electrochemical plating process; attaching a second carrier on a second side of the packaging component; detaching the first carrier from the packaging component; and patterning the metal layer to form a redistribution layer on the first side of the packaging component and expose a portion of a second side of the dielectric layer, wherein the plurality of through holes extend through the dielectric layer during the step of patterning the metal layer. - View Dependent Claims (2, 3, 4, 5)
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6. A method comprising:
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attaching a metal foil layer on a first carrier; forming a dielectric layer on the metal foil layer; attaching a first side of a packaging component on the metal foil layer, wherein, prior to the step of attaching the first side of the packaging component on the metal foil layer, the packaging component comprises a plurality of through holes, and wherein the dielectric layer is between and in direct contact with the package component and the metal foil layer; removing exposed portions of the dielectric layer to expose the metal foil layer; applying an electrochemical plating process to the packaging component such that a metal material fills the plurality of through holes to form a plurality of through vias, wherein the exposed metal foil layer is employed as an electrode for the electrochemical plating process; and patterning the metal foil layer to expose the dielectric layer. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A method comprising:
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forming a redistribution layer on a first side of a packaging component comprising; attaching a metal layer on a first carrier; attaching the first side of a packaging component on the metal layer, wherein the packaging component comprises a plurality of through holes; filling the plurality of through holes with a metal material using an electrochemical plating process, wherein the metal layer is employed as an electrode for the electrochemical plating process; attaching a second carrier on a second side of the packaging component; detaching the first carrier from the packaging component; forming a photoresist layer on the metal layer; patterning the photoresist layer; and etching exposed portions of the metal layer to form the redistribution layer on the first side of the packaging component, wherein, during the step of etching exposed portions of the metal layer, a dielectric layer is between and in direct contact with the redistribution layer and the packaging component, and wherein during the step of etching exposed portions of the metal layer, the plurality of through holes extend through the dielectric layer; forming an under bump metallization structure on the redistribution layer; and forming an interconnect bump on the under bump metallization structure. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification