Fine pitch BVA using reconstituted wafer with area array accessible for testing
First Claim
1. A method for simultaneously making a plurality of microelectronic units, comprising the steps of:
- providing an electrically conductive redistribution structure on a carrier and providing a plurality of microelectronic element attachment regions spaced apart from one another in at least a first direction parallel with a surface of the carrier;
forming a plurality of electrically conductive connector elements between adjacent attachment regions, each connector element having a first end, a second end and edge surfaces extending vertically between the first and second ends, the first end of each connector element being adjacent the redistribution structure and the second end of each connector element at a height greater than 50 microns above the carrier;
forming a dielectric encapsulation between adjacent edge surfaces of the connector elements;
further processing including singulating to form a plurality of microelectronic units, each microelectronic unit including a microelectronic element having a first face which faces away from the redistribution structure, and the microelectronic element having element contacts at the first face which are configured for joining with corresponding component contacts of a component external to the microelectronic unit through electrically conductive masses in a state in which the element contacts are juxtaposed with the corresponding component contacts.
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Accused Products
Abstract
A method for simultaneously making a plurality of microelectronic packages by forming an electrically conductive redistribution structure along with a plurality of microelectronic element attachment regions on a carrier. The attachment regions being spaced apart from one another and overlying the carrier. The method also including the formation of conductive connector elements between adjacent attachment regions. Each connector element having the first or second end adjacent the carrier and the remaining end at a height of the microelectronic element. The method also includes forming an encapsulation over portions of the connector elements and subsequently singulating the assembly, into microelectronic units, each including a microelectronic element. The surface of the microelectronic unit, opposite the redistribution structure, having both the active face of the microelectronic element and the free ends of the connector elements so that both are available for connection with a component external to the microelectronic unit.
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Citations
23 Claims
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1. A method for simultaneously making a plurality of microelectronic units, comprising the steps of:
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providing an electrically conductive redistribution structure on a carrier and providing a plurality of microelectronic element attachment regions spaced apart from one another in at least a first direction parallel with a surface of the carrier; forming a plurality of electrically conductive connector elements between adjacent attachment regions, each connector element having a first end, a second end and edge surfaces extending vertically between the first and second ends, the first end of each connector element being adjacent the redistribution structure and the second end of each connector element at a height greater than 50 microns above the carrier; forming a dielectric encapsulation between adjacent edge surfaces of the connector elements; further processing including singulating to form a plurality of microelectronic units, each microelectronic unit including a microelectronic element having a first face which faces away from the redistribution structure, and the microelectronic element having element contacts at the first face which are configured for joining with corresponding component contacts of a component external to the microelectronic unit through electrically conductive masses in a state in which the element contacts are juxtaposed with the corresponding component contacts. - View Dependent Claims (2, 3, 4, 22)
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5. A method for simultaneously making a plurality of microelectronic units, comprising the steps of:
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providing a carrier with a plurality of microelectronic element attachment regions spaced apart from one another in at least a first direction parallel with a surface of the carrier; forming a plurality of electrically conductive connector elements between adjacent attachment regions, each connector element having a first end, a second end and edge surfaces extending vertically between the first and second ends, the first end of each connector element being adjacent the carrier and the second end of each connector element at a height greater than 50 microns above the carrier; attaching a plurality of microelectronic elements to respective attachment regions on the carrier, each microelectronic element having a first face, a second face and sidewalls extending between the first face and the second face, the first face having contacts and facing the carrier; forming a dielectric encapsulation between adjacent edge surfaces of the connector elements; forming an electrically conductive redistribution structure overlying at least a surface of the encapsulation opposite from the first face of the microelectronic element, the redistribution structure coupled to the second ends of the connector elements and having traces extending in at least the first direction; singulating into a plurality of microelectronic units each including a microelectronic element, a side of the microelectronic unit having the first face of the microelectronic element and the first ends of the connector elements available for connection with a component external to the microelectronic unit. - View Dependent Claims (6, 7, 8, 9)
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10. A microelectronic package having a first side and a second side opposite from the first side, the package comprising:
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a microelectronic element having a first face, a second face opposite the first face, a plurality of sidewalls each extending between the first and second faces, and a plurality of element contacts at the first face; an encapsulation adjacent the sidewalls of the microelectronic element and having a thickness in a direction between the first and second sides of the package, wherein the element contacts are configured for joining with corresponding component contacts of a component external to the microelectronic package in a state in which the element contacts are juxtaposed with the corresponding component contacts; and electrically conductive connector elements each having a first end, a second end remote from the first end, and an edge surface extending between the first and second ends, wherein one of the first end or the second end of each connector element is adjacent the first side of the package and the other of the first end or the second end of each connector element is adjacent the second side of the package, the connector elements being contacted by the encapsulation between the first and second ends, the connector elements configured for electrically coupling a first external component adjacent the first side with a second external component adjacent the second side. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 23)
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Specification