×

Packages with thermal interface material on the sidewalls of stacked dies

  • US 9,583,415 B2
  • Filed: 10/17/2013
  • Issued: 02/28/2017
  • Est. Priority Date: 08/02/2013
  • Status: Active Grant
First Claim
Patent Images

1. A package comprising:

  • a die stack comprising at least two stacked dies, wherein the die stack comprises;

    a first die; and

    a second die underlying the first die and comprising;

    a first portion overlapped by the first die; and

    a second portion not overlapped by the first die;

    a Thermal Interface Material (TIM) comprising;

    a top portion over and contacting a top surface of the die stack; and

    a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies, wherein the top portion and the sidewall portion are formed of a same homogenous material;

    a molding compound comprising;

    inner sidewalls contacting edges of dies in the die stack; and

    outer sidewalls contacting sidewalls of the sidewall portion of the TIM, wherein the outer sidewalls are co-terminus with respective sidewalls of the second die, and wherein both the inner sidewalls and outer sidewalls extend from a top surface of the die stack to a top surface of the second die;

    a first metallic heat-dissipating feature over and contacting the top portion of the TIM;

    a second metallic heat-dissipating feature comprising a sidewall contacting a first sidewall of the sidewall portion of the TIM, wherein the second metallic heat-dissipating feature is at a same level as the die stack; and

    a heat pipe, with an entirety of the heat pipe in the second metallic heat-dissipating feature, wherein the heat pipe comprises a liquid therein, with the heat pipe configured to vaporize the liquid as a vapor, and condense the vapor to liquid, wherein in a top view of the package, the heat pipe encircles without crossing the die stack.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×