Packages with thermal interface material on the sidewalls of stacked dies
First Claim
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1. A package comprising:
- a die stack comprising at least two stacked dies, wherein the die stack comprises;
a first die; and
a second die underlying the first die and comprising;
a first portion overlapped by the first die; and
a second portion not overlapped by the first die;
a Thermal Interface Material (TIM) comprising;
a top portion over and contacting a top surface of the die stack; and
a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies, wherein the top portion and the sidewall portion are formed of a same homogenous material;
a molding compound comprising;
inner sidewalls contacting edges of dies in the die stack; and
outer sidewalls contacting sidewalls of the sidewall portion of the TIM, wherein the outer sidewalls are co-terminus with respective sidewalls of the second die, and wherein both the inner sidewalls and outer sidewalls extend from a top surface of the die stack to a top surface of the second die;
a first metallic heat-dissipating feature over and contacting the top portion of the TIM;
a second metallic heat-dissipating feature comprising a sidewall contacting a first sidewall of the sidewall portion of the TIM, wherein the second metallic heat-dissipating feature is at a same level as the die stack; and
a heat pipe, with an entirety of the heat pipe in the second metallic heat-dissipating feature, wherein the heat pipe comprises a liquid therein, with the heat pipe configured to vaporize the liquid as a vapor, and condense the vapor to liquid, wherein in a top view of the package, the heat pipe encircles without crossing the die stack.
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Abstract
A package includes a die stack that includes at least two stacked dies, and a Thermal Interface Material (TIM). The TIM includes a top portion over and contacting a top surface of the die stack, and a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies. A first metallic heat-dissipating feature is over and contacting the top portion of TIM. A second metallic heat-dissipating feature has a sidewall contacting a sidewall of the sidewall portion of the TIM.
61 Citations
19 Claims
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1. A package comprising:
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a die stack comprising at least two stacked dies, wherein the die stack comprises; a first die; and a second die underlying the first die and comprising; a first portion overlapped by the first die; and a second portion not overlapped by the first die; a Thermal Interface Material (TIM) comprising; a top portion over and contacting a top surface of the die stack; and a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies, wherein the top portion and the sidewall portion are formed of a same homogenous material; a molding compound comprising; inner sidewalls contacting edges of dies in the die stack; and outer sidewalls contacting sidewalls of the sidewall portion of the TIM, wherein the outer sidewalls are co-terminus with respective sidewalls of the second die, and wherein both the inner sidewalls and outer sidewalls extend from a top surface of the die stack to a top surface of the second die; a first metallic heat-dissipating feature over and contacting the top portion of the TIM; a second metallic heat-dissipating feature comprising a sidewall contacting a first sidewall of the sidewall portion of the TIM, wherein the second metallic heat-dissipating feature is at a same level as the die stack; and a heat pipe, with an entirety of the heat pipe in the second metallic heat-dissipating feature, wherein the heat pipe comprises a liquid therein, with the heat pipe configured to vaporize the liquid as a vapor, and condense the vapor to liquid, wherein in a top view of the package, the heat pipe encircles without crossing the die stack. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A package comprising:
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a package component; a die stack over and bonded to the package component, wherein the die stack comprises at least two stacked dies; a molding compound encircling and contacting the die stack; a Thermal Interface Material (TIM) comprising; a top portion over and contacting a top surface of the die stack; and a ring portion encircling and contacting sidewalls of the molding compound, wherein the top portion is continuously connected to the ring portion with no distinguishable interface therebetween; a first metallic heat-dissipating feature over and contacting the top portion of the TIM; a second metallic heat-dissipating feature encircling and contacting the ring portion of the TIM, wherein the second metallic heat-dissipating feature is at a same level as the die stack; and a heat pipe, with an entirety of the heat pipe in the second metallic heat-dissipating feature, wherein the heat pipe comprises a liquid therein, with the heat pipe configured to vaporize the liquid as a vapor, and condense the vapor to liquid, wherein in a top view of the package, the heat pipe encircles without crossing the die stack. - View Dependent Claims (9, 10, 11, 12)
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13. A package comprising:
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a package substrate; a die stack over and bonded to the package substrate, wherein the die stack comprises at least two stacked dies; a molding compound comprising; an inner edge encircling and contacting a top die of the die stack; and an outer edge opposite to the inner edge, with the outer edge being in a same vertical plane as an edge of a bottom die of the die stack; an adhesive over and contacting the package substrate; a Thermal Interface Material (TIM) comprising; a top portion over and contacting a top surface of the die stack; and a ring portion encircling and contacting sidewalls of the molding compound; a heat dissipating lid comprising; a top portion over and contacting the top portion of the TIM; and a ring portion connected to the top portion of the heat dissipating lid, with the ring portion being coplanar with the die stack, wherein the ring portion of the heat dissipating lid encircles and contacts sidewalls of the ring portion of the TIM, and wherein a bottom surface of the ring portion of the heat dissipating lid is over and contacting the adhesive; and a heat pipe, with an entirety of the heat pipe in the ring portion of the heat dissipating lid, wherein the heat pipe comprises a liquid therein, with the heat pipe configured to vaporize the liquid as a vapor, and condense the vapor to liquid, wherein in a top view of the package, the heat pipe encircles without crossing the die stack. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification