Methods for bonding a hermetic module to an electrode array
First Claim
1. A method for bonding a hermetic module to an electrode array comprising:
- providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate;
attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads, each bond-pad being adjacent to the bottom surface of the electrode array and being configured to align with a corresponding pad;
following the step of attaching, drilling a plurality of holes through each of the plurality of pads to its corresponding bond-pad, wherein each of the pads and its corresponding bond-pad are connected in each of the holes;
filling each drilled hole with biocompatible conductive ink;
forming a rivet on the biocompatible conductive ink over each pad; and
overmolding the electrode array with a moisture barrier material.
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Abstract
A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.
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Citations
6 Claims
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1. A method for bonding a hermetic module to an electrode array comprising:
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providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads, each bond-pad being adjacent to the bottom surface of the electrode array and being configured to align with a corresponding pad; following the step of attaching, drilling a plurality of holes through each of the plurality of pads to its corresponding bond-pad, wherein each of the pads and its corresponding bond-pad are connected in each of the holes; filling each drilled hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification