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Methods for bonding a hermetic module to an electrode array

  • US 9,583,458 B2
  • Filed: 03/15/2013
  • Issued: 02/28/2017
  • Est. Priority Date: 03/15/2013
  • Status: Expired due to Fees
First Claim
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1. A method for bonding a hermetic module to an electrode array comprising:

  • providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate;

    attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads, each bond-pad being adjacent to the bottom surface of the electrode array and being configured to align with a corresponding pad;

    following the step of attaching, drilling a plurality of holes through each of the plurality of pads to its corresponding bond-pad, wherein each of the pads and its corresponding bond-pad are connected in each of the holes;

    filling each drilled hole with biocompatible conductive ink;

    forming a rivet on the biocompatible conductive ink over each pad; and

    overmolding the electrode array with a moisture barrier material.

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