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Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

  • US 9,583,476 B2
  • Filed: 02/22/2016
  • Issued: 02/28/2017
  • Est. Priority Date: 08/26/2005
  • Status: Active Grant
First Claim
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1. A method for manufacturing a microelectronic package, comprising:

  • attaching a first die to a first substrate having a first external contact facing a first direction, a first wire bond contact facing a second direction opposite the first direction, and wherein the first substrate has a through opening;

    extending wires from a plurality of contacts on the first die through the through opening to contacts facing the first direction;

    attaching a second die to the first die;

    attaching a second substrate to the second die, the second substrate having a second external contact and a second wire bond contact facing the second direction;

    disposing a first wire bond between the first wire bond contact at the first substrate and the second wire bond contact at the second substrate; and

    encapsulating the first and second wire bond contacts and the first wire bond with a molding compound without covering the first external contact or the second external contact.

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