Light emitter device packages, modules and methods

• US 9,583,681 B2
• Filed: 02/07/2012
• Issued: 02/28/2017
• Est. Priority Date: 02/07/2011
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Joo, Sung Chul, Hussell, Christopher P.
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): Nguyen, Cuong B
• Application Number:
  US13/367,898
• Publication Number:
  US 20120313115A1
• Time in Patent Office: 1,848 Days
• Field of Search: 257 79-103, 257/678, 257/680, 257/684, 257700-702, 257/707, 257/711, 257/723, 257/725, 257/729, 257/731, 257/778, 257/771, 257787-789, 257E23158-E2316
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

Light emitter device packages, modules and methods are disclosed having a body and a cavity that can be formed from a single substrate of material. The material can be thermally conductive and/or metallic. A light emitter device package can have at least one isolating layer creating at least a first isolated portion of the body and/or first isolated portion of the cavity. The isolating layer can be formed from the same material as the single substrate which forms the package body and cavity, and can be a layer which is thermally and electrically isolated. A light emitter or light emitter device, such as an LED chip can be mounted upon a surface of the cavity and upon at least a portion of the isolating layer.

Claims

1. A light emitter device package comprising:

a body having a cavity;

at least one light emitter device disposed in the cavity and mounted to the body, wherein the body comprises an anode, a cathode, and an insulator disposed therebetween, wherein the at least one light emitter is directly attached to each of the anode, the cathode, and the insulator, and wherein the insulator inhibits electrical communications therethrough;

wherein a depth of the cavity is greater than a thickness of a lower portion of the body disposed below the at least one light emitter device, and wherein the insulator comprises a layer having a substantially uniform thickness extending within the lower portion of the body; and

wherein the body, including the anode, the cathode, and the insulator, is formed from a single substrate of material.

2. The light emitter device package according to claim 1, wherein the at least one light emitter device comprises at least one light emitting diode (LED) chip.

3. The light emitter device package according to claim 1, wherein the single substrate of material comprises a thermally conductive material.

4. The light emitter device package according to claim 1, wherein the insulator is an isolating layer of the single substrate of material.

5. The light emitter device package according to claim 4, wherein the single substrate of material comprises aluminum.

6. The light emitter device package according to claim 5, wherein the isolating layer comprises anodized aluminum.

7. The light emitter device package according to claim 2, wherein the LED chip is configured to emit blue light.

8. A light emitter device package comprising:

a body having at least one cavity, the cavity comprising an isolating layer disposed between a first electrically conductive portion of the cavity and a second electrically conductive portion of the cavity, wherein the isolating layer is devoid of electrically conductive material;

at least one light emitter chip disposed within the cavity, wherein a bottom surface of the at least one light emitter chip comprises a first electrical contact and a second electrical contact, wherein the first electrical contact is directly attached to the first electrically conductive portion of the cavity, wherein the second electrical contact is directly attached to the second electrically conductive portion of the cavity, and wherein a portion of the at least one light emitter chip that is disposed between the first electrical contact and the second electrical contact is directly attached to the isolating layer;

wherein the bottom surface of the at least one light emitter chip is centrally disposed over the isolating layer, such that equal portions of the bottom surface of the at least one light emitter chip directly contact each of the first and second electrically conductive portions of the cavity; and

wherein the first electrically conductive portion and the second electrically conductive portion are thermally and electrically isolated by the isolating layer.

9. The light emitter device package according to claim 8, wherein the isolating layer is anodized aluminum.

10. The light emitter device package according to claim 8, wherein the at least one light emitter chip comprises a light emitting diode (LED) chip mounted to at least a portion of the isolating layer using flip chip bonding.

11. The light emitter device package according to claim 8, wherein the body comprises more than one cavity to form a panel array.

12. The light emitter device package according to claim 8, wherein the body and the cavity are formed from a single substrate of material.

13. The light emitter device package according to claim 12, wherein the single substrate of material is a thermally conductive material.

14. The light emitter device package according to claim 12, wherein the single substrate of material is aluminum.

15. The light emitter device package according to claim 13, wherein the isolating layer comprises anodized aluminum.

16. The light emitter device package according to claim 8, wherein the at least one light emitter chip is configured to emit primarily blue light.

17. A method of forming a light emitting diode (LED) package from a single substrate of material, the method comprising:

providing the single substrate of material;

forming at least one cavity within the single substrate of material, wherein a depth of the cavity is greater than a thickness of a lower portion of the single substrate of material disposed below the cavity;

anodizing a portion of the single substrate of material to electrically isolate a first half of the cavity from a second half of the cavity, wherein the first half of the cavity forms an anode, the second half of the cavity forms a cathode, and an anodized portion of the single substrate of material is centrally disposed between the anode and the cathode for forming an insulator, wherein the insulator comprises a layer having a substantially uniform thickness extending within the lower portion of the single substrate of material, wherein the insulator inhibits electrical communications therethrough, and wherein the first half of the cavity, the second half of the cavity, and the insulator are each formed from the single substrate of material; and

mounting an LED chip directly to each of the anode, the cathode, and the insulator, such that equal portions of a bottom surface of the LED chip are in direct contact with each of the anode and the cathode.

18. The method according to claim 17, wherein forming the body and cavity comprises a step selected from the group consisting of extruding, pressing, stamping, punching, milling, etching, and machining.

19. The method according to claim 17, wherein mounting the LED chip comprises using flip chip bonding.

20. The method according to claim 17, further comprising singulating the LED package from a panel array of LED packages.

21. The method according to claim 20, wherein singulating the LED packages comprises a step selected from the group consisting of sawing, dicing, breaking, and shearing.

22. A light emitter device package comprising:

a body comprising a thermally conductive material, the body defining a cavity having a depth greater than a lower portion of the body disposed below the cavity, wherein the body comprises a thermally conductive electrical insulator of a substantially uniform thickness disposed between a first portion of the body and a second portion of the body;

at least one light emitter device disposed within the cavity, wherein the at least one light emitter device is directly attached to the thermally conductive electrical insulator, and wherein the thermally conductive electrical insulator is devoid of electrically conductive material;

wherein the light emitter device is electrically connected to each of the first and second portions of the body; and

wherein the first portion of the body comprises an anode, the second portion of the body comprises a cathode, and wherein the anode, the cathode, and the thermally conductive electrical insulator are formed from a single substrate of material.

23. The light emitter device package according to claim 22, wherein the at least one light emitter device comprises at least one light emitting diode (LED) chip.

24. The light emitter device package according to claim 23, wherein the LED chip is mounted upon a mounting surface of the body.

25. The light emitter device package according to claim 22, wherein the body and cavity are formed integrally from a single substrate of thermally conductive material.

26. The light emitter device package according to claim 22, wherein the electrical insulator comprises aluminum oxide.

27. The light emitter device package according to claim 22, wherein the at least one light emitter device is configured to emit blue light.

28. The light emitter device package according to claim 22, wherein the light emitter device comprises an LED chip mounted to at least a portion of the electrical insulator via flip chip bonding.

29. The light emitter device package according to claim 22, wherein the body comprises aluminum.